Inventor · disambiguated record
Yasunori Narizuka
Also filed as: NARIZUKA YASUNORI
25 granted patents·13 pending applications·515 citations·filing 1987–2011
96Inventor score
Top patents by PatentIndex Score
38 records- 0197US6353540B1Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board.HITACHI LTD·Filed 1996·Granted Mar 5, 2002·181 cites·31 claims
- 0291US7049837B2Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication methodRENESAS TECH CORP·Filed 2003·Granted May 23, 2006·65 cites·26 claims
- 0389US6707682B2Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit boardHITACHI LTD·Filed 2001·Granted Mar 16, 2004·40 cites·3 claims
- 0487US7776626B2Manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2005·Granted Aug 17, 2010·15 cites·24 claims
- 0584US5320729ASputtering targetHITACHI LTD·Filed 1992·Granted Jun 14, 1994·45 cites·18 claims
- 0683US8357933B2Manufacturing method of semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jan 22, 2013·6 cites·20 claims
- 0783US7724006B2Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted May 25, 2010·12 cites·12 claims
- 0883US7423439B2Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Sep 9, 2008·12 cites·18 claims
- 0980US7351597B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2007·Granted Apr 1, 2008·10 cites·9 claims
- 1079US7219422B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted May 22, 2007·21 cites·8 claims
- 1173US7656174B2Probe cassette, semiconductor inspection apparatus and manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Feb 2, 2010·7 cites·9 claims
- 1272US7901958B2Fabrication method of semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Mar 8, 2011·2 cites·18 claims
- 1370US7534629B2Manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted May 19, 2009·4 cites·24 claims
- 1468US7235413B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Jun 26, 2007·13 cites·17 claims
- 1565US7407823B2Manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted Aug 5, 2008·2 cites·26 claims
- 1664US8062911B2Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the sameHASEBE AKIO·Filed 2007·Granted Nov 22, 2011·2 cites·9 claims
- 1761US8206997B2Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the sameHASEBE AKIO·Filed 2010·Granted Jun 26, 2012·1 cites·14 claims
- 1852US5285016AWiring board provided with a heat bypass layerHITACHI LTD·Filed 1990·Granted Feb 8, 1994·22 cites·21 claims
- 1952US2008020498A1Fabrication method of semiconductor integrated circuit deviceOKAMOTO MASAYOSHI·Filed 2007·Application pending·0 cites
- 2050US2006091553A1Wiring board and method for producing sameHITACHI LTD·Filed 2005·Application pending·0 cites
- 2150US2011175634A1Fabrication method of semiconductor integrated circuit deviceOKAMOTO MASAYOSHI·Filed 2011·Application pending·0 cites
- 2250US2011136272A1Fabrication method of semiconductor integrated circuit deviceOKAMOTO MASAYOSHI·Filed 2011·Application pending·0 cites
- 2348US7598100B2Manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Oct 6, 2009·4 cites·21 claims
- 2448US6124553AMultilayer wiring board having vent holes and method of makingHITACHI LTD·Filed 1994·Granted Sep 26, 2000·17 cites·4 claims
- 2548US2006094162A1Thin film probe sheet and semiconductor chip inspection systemYABUSHITA AKIRA·Filed 2005·Application pending·0 cites
- 2646US7537943B2Method of manufacturing a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2007·Granted May 26, 2009·0 cites·9 claims
- 2746US2011014727A1Thin film probe sheet and semiconductor chip inspection systemYABUSHITA AKIRA·Filed 2010·Application pending·0 cites
- 2845US2007207559A1Fabrication method of semiconductor integrated circuit deviceHASEBE AKIO·Filed 2007·Application pending·0 cites
- 2942US5958600ACircuit board and method of manufacturing the sameHITACHI LTD·Filed 1996·Granted Sep 28, 1999·11 cites·23 claims
- 3042US4806725ACircuit substrate and thermal printing head using the sameHITACHI LTD·Filed 1987·Granted Feb 21, 1989·11 cites·10 claims
- 3142US2005093565A1Fabrication method of semiconductor integrated circuit deviceFiled 2004·Application pending·0 cites
- 3242US2010301884A1Thin-film probe sheet and method of manufacturing the same, probe card, and semiconductor chip inspection apparatusTAKANE ETSUKO·Filed 2010·Application pending·0 cites
- 3341US2006043593A1Connecting apparatus, semiconductor chip inspecting apparatus, and method for manufacturing semiconductor deviceMORI TERUTAKA·Filed 2005·Application pending·0 cites
- 3440US2008029763A1Transmission Circuit, Connecting Sheet, Probe Sheet, Probe Card, Semiconductor Inspection System and Method of Manufacturing Semiconductor DeviceKASUKABE SUSUMU·Filed 2007·Application pending·0 cites
- 3539US5235313AThin film resistor and wiring board using the sameHITACHI LTD·Filed 1991·Granted Aug 10, 1993·6 cites·14 claims
- 3639US2011281380A1Probe card and method of manufacturing semiconductor integrated circuit deviceNARIZUKA YASUNORI·Filed 2011·Application pending·0 cites
- 3737US2001026444A1Electronic circuit board with built-in thin film capacitor and manufacturing method thereofFiled 2001·Application pending·0 cites
- 3834US5218335AElectronic circuit device having thin film resistor and method for producing the sameHITACHI LTD·Filed 1991·Granted Jun 8, 1993·6 cites·31 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →