Inventor · disambiguated record
Yi-Hang Lin
Also filed as: LIN YI-HANG
13 granted patents·2 pending applications·33 citations·filing 2011–2025
88Inventor score
Top patents by PatentIndex Score
15 records- 0194US9929128B1Chip package structure with adhesive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 27, 2018·9 cites·20 claims
- 0291US8916972B2Adhesion between post-passivation interconnect structure and polymerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 23, 2014·15 cites·20 claims
- 0383US2025323106A1Chip package structure with ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0479US8507321B2Chip package and method for forming the sameLIN CHAO-YEN·Filed 2011·Granted Aug 13, 2013·5 cites·17 claims
- 0576US12368080B2Chip package structure with ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 0674US9673098B2Methods of packaging semiconductor devices and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 6, 2017·1 cites·20 claims
- 0769US9117682B2Methods of packaging semiconductor devices and structures thereofLIN JING-CHENG·Filed 2011·Granted Aug 25, 2015·1 cites·18 claims
- 0868US11728233B2Chip package structure with ring structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·0 cites·20 claims
- 0964US10964594B2Methods of packaging semiconductor devices including placing semiconductor devices into die cavesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 30, 2021·0 cites·18 claims
- 1064US9196594B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Nov 24, 2015·1 cites·21 claims
- 1163US9030011B2Chip package and method for forming the sameXINTEC INC·Filed 2013·Granted May 12, 2015·1 cites·21 claims
- 1260US10163711B2Methods of packaging semiconductor devices including placing semiconductor devices into die cavesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·19 claims
- 1357US10163875B2Method for forming chip package structure with adhesive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·0 cites·20 claims
- 1456US9406581B2Methods of packaging semiconductor devices and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 2, 2016·0 cites·19 claims
- 1556US2024421128A1Semiconductor device with multiple stacked passive devicesQUALCOMM INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →