Inventor · disambiguated record
Young Wook Heo
Also filed as: HEO YOUNG W · HEO YOUNG WOOK · HEO YOUNGWOOK
26 granted patents·2,008 citations·filing 1994–2012
98Inventor score
Technology areasH10W
Files withANAM SEMICONDUCTOR INC10AMKOR TECHNOLOGY INC9ANAM IND CO LTD3YOSHIDA AKITO2AMKOR ELECTRONICS INC1
Top patents by PatentIndex Score
26 records- 0199US6555917B1Semiconductor package having stacked semiconductor chips and method of making the sameAMKOR TECHNOLOGY INC·Filed 2001·Granted Apr 29, 2003·353 cites·23 claims
- 0297US6987314B1Stackable semiconductor package with solder on pads on which second semiconductor package is stackedAMKOR TECHNOLOGY INC·Filed 2004·Granted Jan 17, 2006·106 cites·24 claims
- 0395US5915169ASemiconductor chip scale package and method of producing suchANAM IND CO LTD·Filed 1996·Granted Jun 22, 1999·197 cites·18 claims
- 0492US6946323B1Semiconductor package having one or more die stacked on a prepackaged device and method thereforAMKOR TECHNOLOGY INC·Filed 2004·Granted Sep 20, 2005·73 cites·21 claims
- 0592US5953589ABall grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the sameANAM SEMICONDUCTOR INC·Filed 1997·Granted Sep 14, 1999·139 cites·20 claims
- 0691US5905633ABall grid array semiconductor package using a metal carrier ring as a heat spreaderANAM SEMICONDUCTOR INC·Filed 1996·Granted May 18, 1999·128 cites·6 claims
- 0789US6879047B1Stacking structure for semiconductor devices using a folded over flexible substrate and method thereforAMKOR TECHNOLOGY INC·Filed 2003·Granted Apr 12, 2005·55 cites·16 claims
- 0889US5767446APrinted circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor packageANAM IND CO LTD·Filed 1996·Granted Jun 16, 1998·116 cites·10 claims
- 0989US5635671AMold runner removal from a substrate-based packaged electronic deviceAMKOR TECHNOLOGY INC·Filed 1994·Granted Jun 3, 1997·109 cites·17 claims
- 1087US5708567ABall grid array semiconductor package with ring-type heat sinkANAM IND CO LTD·Filed 1996·Granted Jan 13, 1998·95 cites·8 claims
- 1186US7982306B1Stackable semiconductor packageAMKOR TECHNOLOGY INC·Filed 2010·Granted Jul 19, 2011·5 cites·23 claims
- 1286US7459349B1Method of forming a stack of semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2005·Granted Dec 2, 2008·9 cites·20 claims
- 1385US5908317AMethod of forming chip bumps of bump chip scale semiconductor packageANAM SEMICONDUCTOR INC·Filed 1997·Granted Jun 1, 1999·117 cites·20 claims
- 1484US5864470AFlexible circuit board for ball grid array semiconductor packageANAM SEMICONDUCTOR INC·Filed 1997·Granted Jan 26, 1999·75 cites·17 claims
- 1584US5858815ASemiconductor package and method for fabricating the sameANAM SEMICONDUCTOR INC·Filed 1996·Granted Jan 12, 1999·80 cites·13 claims
- 1682US5854741AUnit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the sameAMKOR ELECTRONICS INC·Filed 1996·Granted Dec 29, 1998·66 cites·10 claims
- 1780US6091141ABump chip scale semiconductor packageANAM SEMICONDUCTOR INC·Filed 1998·Granted Jul 18, 2000·51 cites·20 claims
- 1879US7737542B1Stackable semiconductor packageAMKOR TECHNOLOGY INC·Filed 2008·Granted Jun 15, 2010·5 cites·20 claims
- 1978US5729432ABall grid array semiconductor package with improved heat dissipation and dehumidification effectANAM IND COL LTD·Filed 1996·Granted Mar 17, 1998·60 cites·11 claims
- 2074US8227905B1Stackable semiconductor packageYOSHIDA AKITO·Filed 2011·Granted Jul 24, 2012·2 cites·19 claims
- 2174US6389689B2Method of fabricating semiconductor packageAMKOR TECHNOLOGY INC·Filed 1998·Granted May 21, 2002·46 cites·12 claims
- 2272US5981873APrinted circuit board for ball grid array semiconductor packageANAM SEMICONDUCTOR INC·Filed 1997·Granted Nov 9, 1999·42 cites·4 claims
- 2366US5977624ASemiconductor package and assembly for fabricating the sameANAM SEMICONDUCTOR INC·Filed 1998·Granted Nov 2, 1999·33 cites·21 claims
- 2460US5897334AMethod for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boardsANAM SEMICONDUCTOR INC·Filed 1997·Granted Apr 27, 1999·26 cites·10 claims
- 2555US6021563AMarking Bad printed circuit boards for semiconductor packagesANAM SEMICONDUCTOR INC·Filed 1997·Granted Feb 8, 2000·20 cites·4 claims
- 2654US8466545B1Stackable semiconductor packageYOSHIDA AKITO·Filed 2012·Granted Jun 18, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →