Inventor · disambiguated record
Yoshiro Hirose
Also filed as: HIROSE YOSHIRO
148 granted patents·19 pending applications·1,528 citations·filing 1988–2025
99Inventor score
Top patents by PatentIndex Score
167 records- 0198US8415258B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusAKAE NAONORI·Filed 2011·Granted Apr 9, 2013·480 cites·19 claims
- 0298US8076251B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusAKAE NAONORI·Filed 2010·Granted Dec 13, 2011·489 cites·17 claims
- 0396US11527402B2Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 13, 2022·4 cites·20 claims
- 0496US10026607B2Substrate processing apparatus for forming film including at least two different elementsHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 17, 2018·8 cites·21 claims
- 0594US9443720B2Method of manufacturing semiconductor device for forming film including at least two different elementsHITACHI-KOKUSAI ELECTRIC INC·Filed 2016·Granted Sep 13, 2016·6 cites·18 claims
- 0694US9385013B2Method and apparatus of manufacturing a semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 5, 2016·5 cites·9 claims
- 0794US9312123B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Apr 12, 2016·6 cites·9 claims
- 0893US9620357B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Apr 11, 2017·8 cites·14 claims
- 0993US9384972B2Method of manufacturing semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·5 cites·13 claims
- 1093US9384968B2Method of manufacturing a semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·5 cites·15 claims
- 1193US9384971B2Method of manufacturing semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·5 cites·14 claims
- 1293US9330904B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted May 3, 2016·5 cites·15 claims
- 1393US9093270B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Jul 28, 2015·11 cites·18 claims
- 1493US8252701B2Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatusSASAJIMA RYOTA·Filed 2010·Granted Aug 28, 2012·16 cites·10 claims
- 1592US9613798B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Apr 4, 2017·8 cites·13 claims
- 1692US9487861B2Substrate processing apparatus capable of forming films including at least two different elementsHITACHI-KOKUSAI ELECTRIC INC·Filed 2016·Granted Nov 8, 2016·4 cites·9 claims
- 1792US9053927B2Method of manufacturing semiconductor device and method of processing substrateHITACHI INT ELECTRIC INC·Filed 2012·Granted Jun 9, 2015·11 cites·20 claims
- 1892US9054046B2Method of manufacturing semiconductor device and method of processing substrateHITACHI INT ELECTRIC INC·Filed 2012·Granted Jun 9, 2015·10 cites·20 claims
- 1991US11251039B2Method of manufacturing semiconductor device, recording medium, and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2020·Granted Feb 15, 2022·2 cites·21 claims
- 2091US9478417B2Method of manufacturing semiconductor device for forming film including at least two different elementsHITACHI-KOKUSAI ELECTRIC INC·Filed 2016·Granted Oct 25, 2016·4 cites·18 claims
- 2191US9472391B2Semiconductor device manufacturing methodHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 18, 2016·11 cites·17 claims
- 2291US9443718B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Sep 13, 2016·11 cites·21 claims
- 2391US9443719B2Method of manufacturing semiconductor device for forming film including at least two different elementsHITACHI-KOKUSAI ELECTRIC INC·Filed 2016·Granted Sep 13, 2016·4 cites·9 claims
- 2490US9508543B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 29, 2016·10 cites·15 claims
- 2590US9349586B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted May 24, 2016·8 cites·18 claims
- 2690US4975328AProcess for producing polyurethane lensHOYA CORP·Filed 1988·Granted Dec 4, 1990·61 cites·6 claims
- 2789US10340134B2Semiconductor device manufacturing method, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Jul 2, 2019·5 cites·15 claims
- 2889US9318316B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus for forming thin film containing at least two different elementsTAKASAWA YUSHIN·Filed 2009·Granted Apr 19, 2016·7 cites·16 claims
- 2989US9257275B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Feb 9, 2016·7 cites·12 claims
- 3089US9165761B2Method for manufacturing semiconductor device, method for processing substrate, substrate processing apparatus and recording mediumHIROSE YOSHIRO·Filed 2012·Granted Oct 20, 2015·9 cites·20 claims
- 3189US9018104B2Method for manufacturing semiconductor device, method for processing substrate and substrate processing apparatusHIROSE YOSHIRO·Filed 2011·Granted Apr 28, 2015·8 cites·16 claims
- 3289US7884034B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Granted Feb 8, 2011·20 cites·14 claims
- 3388US9865451B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jan 9, 2018·8 cites·16 claims
- 3488US9460911B2Method of manufacturing semiconductor device and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 4, 2016·4 cites·10 claims
- 3588US8575042B2Method of manufacturing semiconductor device and method of processing substrate and substrate processing apparatusOTA YOSUKE·Filed 2012·Granted Nov 5, 2013·7 cites·14 claims
- 3687US9384969B2Method of manufacturing semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·2 cites·14 claims
- 3787US9384970B2Method of manufacturing semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·2 cites·15 claims
- 3887US9384966B2Method of manufacturing a semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·2 cites·13 claims
- 3987US9330903B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted May 3, 2016·5 cites·13 claims
- 4087US9218959B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Dec 22, 2015·6 cites·14 claims
- 4186US10229829B2Method for manufacturing semiconductor device, substrate-processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 12, 2019·3 cites·2 claims
- 4286US9384967B2Method of manufacturing a semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·2 cites·17 claims
- 4386US8546272B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusHIROSE YOSHIRO·Filed 2011·Granted Oct 1, 2013·6 cites·9 claims
- 4485US9343290B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted May 17, 2016·6 cites·19 claims
- 4585US9190298B2Film forming method and recording medium for performing the methodHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 17, 2015·5 cites·16 claims
- 4685US8785333B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Jul 22, 2014·6 cites·17 claims
- 4784US9437422B2Method of manufacturing semiconductor device and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 6, 2016·3 cites·12 claims
- 4884US9334567B2Method for manufacturing semiconductor device, method for processing substrate and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted May 10, 2016·3 cites·14 claims
- 4984US8895455B2Method for manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Granted Nov 25, 2014·5 cites·12 claims
- 5084US8895457B2Method of manufacturing semiconductor device and substrate processing apparatusAKAE NAONORI·Filed 2011·Granted Nov 25, 2014·7 cites·20 claims
Showing the top 50 of 167 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →