Inventor · disambiguated record
Yoshitaka Otsu
Also filed as: OTSU YOSHITAKA
28 granted patents·4 pending applications·259 citations·filing 2007–2023
96Inventor score
Top patents by PatentIndex Score
32 records- 0197US11282783B2Three-dimensional memory device with via structures surrounded by perforated dielectric moat structure and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Mar 22, 2022·7 cites·19 claims
- 0296US10937801B2Three-dimensional memory device containing a polygonal lattice of support pillar structures and contact via structures and methods of manufacturing the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Mar 2, 2021·19 cites·19 claims
- 0396US10700089B1Three-dimensional memory device including locally thickened electrically conductive layers and methods of manufacturing the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Jun 30, 2020·44 cites·15 claims
- 0496US10615172B2Three-dimensional memory device having double-width staircase regions and methods of manufacturing the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Apr 7, 2020·20 cites·15 claims
- 0595US11404427B2Three-dimensional memory device including multi-tier moat isolation structures and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Aug 2, 2022·7 cites·14 claims
- 0695US11114459B2Three-dimensional memory device containing width-modulated connection strips and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Sep 7, 2021·15 cites·23 claims
- 0795US10985176B2Three-dimensional memory device containing eye-shaped contact via structures located in laterally-undulating trenches and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Apr 20, 2021·14 cites·14 claims
- 0895US10879264B1Three-dimensional memory device containing through-array contact via structures between dielectric barrier walls and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Dec 29, 2020·20 cites·20 claims
- 0995US10872857B1Three-dimensional memory device containing through-array contact via structures between dielectric barrier walls and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Dec 22, 2020·17 cites·20 claims
- 1095US8357989B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Jan 22, 2013·23 cites·9 claims
- 1194US10957706B2Multi-tier three-dimensional memory device with dielectric support pillars and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Mar 23, 2021·11 cites·13 claims
- 1294US10923498B2Three-dimensional memory device containing direct source contact structure and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Feb 16, 2021·14 cites·20 claims
- 1392US10971514B2Multi-tier three-dimensional memory device with dielectric support pillars and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Apr 6, 2021·8 cites·13 claims
- 1492US10847524B2Three-dimensional memory device having double-width staircase regions and methods of manufacturing the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Nov 24, 2020·12 cites·20 claims
- 1592US8692352B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2012·Granted Apr 8, 2014·12 cites·3 claims
- 1684US8569839B2Semiconductor device and manufacturing method thereofMORII KATSUMI·Filed 2011·Granted Oct 29, 2013·11 cites·5 claims
- 1774US10304830B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted May 28, 2019·1 cites·16 claims
- 1874US9614076B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Apr 4, 2017·2 cites·10 claims
- 1969US10879262B2Three-dimensional memory device containing eye-shaped contact via structures located in laterally-undulating trenches and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Dec 29, 2020·1 cites·13 claims
- 2069USRE46773ESemiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Apr 3, 2018·1 cites·16 claims
- 2167US11495616B2Multi-tier three-dimensional memory device with dielectric support pillars and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Nov 8, 2022·0 cites·5 claims
- 2258US11355515B2Three-dimensional memory device including locally thickened electrically conductive layers and methods of manufacturing the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jun 7, 2022·0 cites·20 claims
- 2358USRE48450ESemiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Feb 23, 2021·0 cites·11 claims
- 2455US10020305B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Jul 10, 2018·0 cites·9 claims
- 2555US2024260268A1Three-dimensional memory device containing inverted staircase and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 2653US11398488B2Three-dimensional memory device including through-memory-level via structures and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Jul 26, 2022·0 cites·14 claims
- 2752US12009306B2Three-dimensional memory device containing a capped isolation trench fill structure and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Jun 11, 2024·0 cites·12 claims
- 2849US11756877B2Three-dimensional memory device with via structures surrounded by perforated dielectric moat structure and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Sep 12, 2023·0 cites·19 claims
- 2949US2021210503A1Three-dimensional memory device with dielectric isolated via structures and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Application pending·0 cites
- 3047US2021210504A1Three-dimensional memory device with via structures surrounded by perforated dielectric moat structure and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Application pending·0 cites
- 3141US12068249B2Three-dimensional memory device with dielectric isolated via structures and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Aug 20, 2024·0 cites·12 claims
- 3240US2007166969A1Semiconductor device and method for manufacturing the sameRENESAS TECH CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →