Inventor · disambiguated record
Yongan Xu
Also filed as: XU JR YONGAN · XU YONGAN
89 granted patents·15 pending applications·263 citations·filing 2006–2025
99Inventor score
Files withIBM62APPLIED MATERIALS INC31TESSERA INC3ADEIA SEMICONDUCTOR SOLUTIONS LLC2GLOBALFOUNDRIES INC2
Top patents by PatentIndex Score
104 records- 0198US10020254B1Integration of super via structure in BEOLIBM·Filed 2017·Granted Jul 10, 2018·39 cites·8 claims
- 0298US10020255B1Integration of super via structure in BEOLIBM·Filed 2017·Granted Jul 10, 2018·36 cites·12 claims
- 0397US11610925B2Imaging system and method of creating composite imagesAPPLIED MATERIALS INC·Filed 2020·Granted Mar 21, 2023·5 cites·16 claims
- 0496US11699591B2Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logicTESSERA LLC·Filed 2021·Granted Jul 11, 2023·2 cites·20 claims
- 0596US10658180B1EUV pattern transfer with ion implantation and reduced impact of resist residueIBM·Filed 2018·Granted May 19, 2020·6 cites·18 claims
- 0696US9991365B1Forming vertical transport field effect transistors with uniform bottom spacer thicknessIBM·Filed 2017·Granted Jun 5, 2018·12 cites·15 claims
- 0795US9257334B2Double self-aligned via patterningIBM·Filed 2015·Granted Feb 9, 2016·13 cites·7 claims
- 0895US9219007B2Double self aligned via patterningIBM·Filed 2013·Granted Dec 22, 2015·24 cites·14 claims
- 0994US10157789B2Via formation using sidewall image transfer process to define lateral dimensionIBM·Filed 2016·Granted Dec 18, 2018·12 cites·11 claims
- 1094US9984919B1Inverted damascene interconnect structuresGLOBALFOUNDRIES INC·Filed 2017·Granted May 29, 2018·11 cites·17 claims
- 1194US9064813B2Trench patterning with block first sidewall image transferIBM·Filed 2013·Granted Jun 23, 2015·14 cites·17 claims
- 1293US12094774B2Back-end-of-line single damascene top via spacer defined by pillar mandrelsIBM·Filed 2021·Granted Sep 17, 2024·2 cites·8 claims
- 1393US11754919B2Lithography method to form structures with slanted angleAPPLIED MATERIALS INC·Filed 2021·Granted Sep 12, 2023·2 cites·20 claims
- 1493US10622301B2Method of forming a straight via profile with precise critical dimension controlIBM·Filed 2018·Granted Apr 14, 2020·8 cites·15 claims
- 1593US9490168B1Via formation using sidewall image transfer process to define lateral dimensionIBM·Filed 2015·Granted Nov 8, 2016·10 cites·9 claims
- 1692US7901607B2Method of low temperature imprinting process with high pattern transfer yieldAGENCY SCIENCE TECH & RES·Filed 2006·Granted Mar 8, 2011·23 cites·16 claims
- 1790US11111176B1Methods and apparatus of processing transparent substratesAPPLIED MATERIALS INC·Filed 2020·Granted Sep 7, 2021·2 cites·18 claims
- 1890US10032632B2Selective gas etching for self-aligned pattern transferIBM·Filed 2016·Granted Jul 24, 2018·4 cites·19 claims
- 1988US12327730B2Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logicADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2024·Granted Jun 10, 2025·0 cites·22 claims
- 2086US10032633B1Image transfer using EUV lithographic structure and double patterning processIBM·Filed 2017·Granted Jul 24, 2018·3 cites·4 claims
- 2186US9406746B2Work function metal fill for replacement gate fin field effect transistor processIBM·Filed 2014·Granted Aug 2, 2016·5 cites·15 claims
- 2285US11978639B2Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logicTESSERA LLC·Filed 2023·Granted May 7, 2024·0 cites·25 claims
- 2385US10921721B1Measurement system and grating pattern arrayAPPLIED MATERIALS INC·Filed 2019·Granted Feb 16, 2021·2 cites·20 claims
- 2485US10672705B2Method of forming a straight via profile with precise critical dimension controlIBM·Filed 2019·Granted Jun 2, 2020·3 cites·16 claims
- 2585US10607922B1Controlling via critical dimension during fabrication of a semiconductor waferIBM·Filed 2018·Granted Mar 31, 2020·3 cites·14 claims
- 2684US10749011B2Area selective cyclic deposition for VFET top spacerIBM·Filed 2018·Granted Aug 18, 2020·3 cites·15 claims
- 2784US9837351B1Avoiding gate metal via shorting to source or drain contactsIBM·Filed 2016·Granted Dec 5, 2017·3 cites·16 claims
- 2882US11152298B2Metal via structureIBM·Filed 2019·Granted Oct 19, 2021·3 cites·18 claims
- 2981US10886197B2Controlling via critical dimension with a titanium nitride hard maskIBM·Filed 2020·Granted Jan 5, 2021·1 cites·19 claims
- 3081US2025102398A1Method to determine line angle and rotation of multiple patterningAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3180US9330965B2Double self aligned via patterningIBM·Filed 2015·Granted May 3, 2016·2 cites·16 claims
- 3279US12488986B2Selective gas etching for self-aligned pattern transferADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2022·Granted Dec 2, 2025·0 cites·10 claims
- 3379US2025053082A1Lithography method to form structures with slanted angleAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3478US12153344B2Lithography method to form structures with slanted angleAPPLIED MATERIALS INC·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 3578US12021102B2Imaging system and method of creating composite imagesAPPLIED MATERIALS INC·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 3678US10937653B2Multiple patterning scheme integration with planarized cut patterningIBM·Filed 2019·Granted Mar 2, 2021·1 cites·19 claims
- 3777US12111572B2Methods of greytone imprint lithography to fabricate optical devicesAPPLIED MATERIALS INC·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 3877US11977246B2Mask orientationAPPLIED MATERIALS INC·Filed 2023·Granted May 7, 2024·0 cites·20 claims
- 3977US11709423B2Methods of greytone imprint lithography to fabricate optical devicesAPPLIED MATERIALS INC·Filed 2022·Granted Jul 25, 2023·0 cites·20 claims
- 4077US11037822B2Svia using a single damascene interconnectIBM·Filed 2019·Granted Jun 15, 2021·2 cites·16 claims
- 4176US11302533B2Selective gas etching for self-aligned pattern transferTESSERA INC·Filed 2021·Granted Apr 12, 2022·0 cites·20 claims
- 4276US11131919B2Extreme ultraviolet (EUV) mask stack processingIBM·Filed 2018·Granted Sep 28, 2021·1 cites·15 claims
- 4374US12060297B2Methods and apparatus of processing transparent substratesAPPLIED MATERIALS INC·Filed 2021·Granted Aug 13, 2024·0 cites·19 claims
- 4474US10825720B2Single trench damascene interconnect using TiN HMOIBM·Filed 2018·Granted Nov 3, 2020·1 cites·18 claims
- 4574US10043744B2Avoiding gate metal via shorting to source or drain contactsIBM·Filed 2017·Granted Aug 7, 2018·1 cites·20 claims
- 4673US10782606B2Photolithography methods and structures that reduce stochastic defectsGLOBALFOUNDRIES INC·Filed 2018·Granted Sep 22, 2020·1 cites·16 claims
- 4773US10551742B2Tunable adhesion of EUV photoresist on oxide surfaceIBM·Filed 2017·Granted Feb 4, 2020·1 cites·18 claims
- 4872US11630251B2Mask orientationAPPLIED MATERIALS INC·Filed 2022·Granted Apr 18, 2023·0 cites·20 claims
- 4972US11062911B2Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logicTESSERA INC·Filed 2020·Granted Jul 13, 2021·0 cites·20 claims
- 5070US10629436B2Spacer image transfer with double mandrelIBM·Filed 2018·Granted Apr 21, 2020·1 cites·18 claims
Showing the top 50 of 104 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →