Inventor · disambiguated record
Yukinori Aburatani
Also filed as: ABURATANI YUKINORI
24 granted patents·25 pending applications·792 citations·filing 1996–2025
95Inventor score
Files withKOKUSAI ELECTRIC CORP23HITACHI INT ELECTRIC INC13ABURATANI YUKINORI5KOKUSAI ELECTRIC CO LTD4SHIMADA MASAKAZU2
Top patents by PatentIndex Score
49 records- 0197US8128333B2Substrate processing apparatus and manufacturing method for semiconductor devicesABURATANI YUKINORI·Filed 2007·Granted Mar 6, 2012·290 cites·8 claims
- 0296US5788447ASubstrate processing apparatusKOKUSAI ELECTRIC CO LTD·Filed 1996·Granted Aug 4, 1998·246 cites·26 claims
- 0389US6066210ASubstrate processing apparatus with a processing chamber, transfer chamber, intermediate holding chamber, and an atmospheric pressure sectionKOKUSAI ELECTRIC CO LTD·Filed 1996·Granted May 23, 2000·93 cites·14 claims
- 0488US8420167B2Method of manufacturing a semiconductor deviceNAKASHIMA SEIYO·Filed 2009·Granted Apr 16, 2013·9 cites·15 claims
- 0588US6143083ASubstrate transferring mechanismKOKUSAI ELECTRIC CO LTD·Filed 1999·Granted Nov 7, 2000·81 cites·3 claims
- 0686US8277161B2Substrate processing apparatus and manufacturing method of a semiconductor deviceABURATANI YUKINORI·Filed 2008·Granted Oct 2, 2012·12 cites·22 claims
- 0784US10453720B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 22, 2019·3 cites·18 claims
- 0882US8814488B2Substrate processing apparatus and semiconductor device manufacturing methodABURATANI YUKINORI·Filed 2008·Granted Aug 26, 2014·9 cites·19 claims
- 0980US2025022703A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1078US12131902B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Oct 29, 2024·0 cites·19 claims
- 1176US7700054B2Substrate processing apparatus having gas side flow via gas inletHITACHI INT ELECTRIC INC·Filed 2007·Granted Apr 20, 2010·5 cites·12 claims
- 1273US11521848B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Dec 6, 2022·0 cites·17 claims
- 1373US11289350B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 29, 2022·1 cites·15 claims
- 1472US2025339787A1Source material collection system, substrate processing apparatus, source material collection method and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1568US8876453B2Substrate processing apparatus and method of manufacturing semiconductor deviceABURATANI YUKINORI·Filed 2011·Granted Nov 4, 2014·2 cites·6 claims
- 1664USD795716SSubstrate thermometry unitHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 29, 2017·10 cites·1 claims
- 1764US2025095969A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1863US12451375B2Substrate processing apparatus, method of manufacturing semiconductor device and method of processing substrate supportKOKUSAI ELECTRIC CORP·Filed 2021·Granted Oct 21, 2025·0 cites·17 claims
- 1963US6190104B1Treatment object conveyor apparatus, semiconductor manufacturing apparatus, and treatment object treatment methodKOKUSAI ELECTRIC CO LTD·Filed 1999·Granted Feb 20, 2001·28 cites·9 claims
- 2063US2025279307A1Substrate processing apparatus, method of teaching transfer machine, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2162US2008173238A1Substrate processing apparatus, method of manufacturing semiconductor device, and reaction vesselHITACHI INT ELECTRIC INC·Filed 2007·Application pending·0 cites
- 2262US2025011925A1Substrate processing apparatus, processing vessel, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2360US2024177991A1Method of manufacturing semiconductor device, gas supply method, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2460US2024249963A1Substrate processing apparatus, transfer method of substrate support, recording medium, and manufacturing method of semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2559US2025308972A1Transfer machine, substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2659US2025218832A1Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate retainer assemblyKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2759US2024096604A1Substrate processing apparatus, plasma generation apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2857US2009269937A1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 2957US2025011930A1Substrate Processing Apparatus, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3056US11891697B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 6, 2024·0 cites·13 claims
- 3156US2023317438A1Maintenance method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3254US2025191963A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3354US2009185892A1Substrate processing apparatus and manufacturing method for semiconductor devicesHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 3454US2025273488A1Heating Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, Lamp Module, Method of Processing Substrate and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3549US2010229416A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 3648US2025279305A1Loading port structure, substrate processing apparatus, substrate processing method and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3747US2006075972A1Substrate processing apparatus and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2005·Application pending·0 cites
- 3846US2017081764A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
- 3945US11424146B2Substrate processing apparatus and temperature measurement unitKOKUSAI ELECTRIC CORP·Filed 2018·Granted Aug 23, 2022·0 cites·13 claims
- 4045US2020312625A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 4143US10014171B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Jul 3, 2018·0 cites·3 claims
- 4240US9082797B2Substrate processing apparatus and method of manufacturing semiconductor deviceABURATANI YUKINORI·Filed 2012·Granted Jul 14, 2015·0 cites·12 claims
- 4337US2002017363A1Substrate processing apparatus and substrate processing methodFiled 2001·Application pending·0 cites
- 4436US2010280653A1Substrate processing apparatus and semiconductor device manufacturing methodHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
- 4535US2002094600A1Substrate processing apparatus and method for manufacturing a semiconductor device employing sameHITACHI INT ELECTRIC INC·Filed 2002·Application pending·0 cites
- 4634US10403478B2Plasma processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 3, 2019·0 cites·10 claims
- 4733USD795715SSubstrate thermometry unitHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 29, 2017·1 cites·1 claims
- 4828USD652395SSemiconductor manufacturing equipmentSHIMADA MASAKAZU·Filed 2010·Granted Jan 17, 2012·1 cites·1 claims
- 4928USD651990SSemiconductor manufacturing equipmentSHIMADA MASAKAZU·Filed 2010·Granted Jan 10, 2012·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →