Inventor · disambiguated record
Yuichi Kakizono
Also filed as: KAKIZONO YUICHI
4 granted patents·7 pending applications·8 citations·filing 2006–2011
64Inventor score
Top patents by PatentIndex Score
11 records- 0174US7288207B2Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the sameSUMCO CORP·Filed 2006·Granted Oct 30, 2007·4 cites·8 claims
- 0265US8092277B2Method of grinding semiconductor wafers, grinding surface plate, and grinding deviceHASHII TOMOHIRO·Filed 2009·Granted Jan 10, 2012·4 cites·8 claims
- 0348US2009311948A1Method for producing semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 0447US2007184658A1Etching Liquid for Controlling Silicon Wafer Surface ShapeKOYATA SAKAE·Filed 2007·Application pending·0 cites
- 0545US2009311808A1Method for producing semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 0645US2009311949A1Method for producing semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 0745US2009311863A1Method for producing semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 0845US2009298397A1Method of grinding semiconductor wafers and device for grinding both surfaces of semiconductor wafersSUMCO CORP·Filed 2009·Application pending·0 cites
- 0941US9017145B2Polishing solution distribution apparatus and polishing apparatus having the sameKUROSAWA YOSHIAKI·Filed 2011·Granted Apr 28, 2015·0 cites·18 claims
- 1032US2012315739A1Manufacturing method for semiconductor waferHASHII TOMOHIRO·Filed 2011·Application pending·0 cites
- 1131US9550264B2Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor waferHASHII TOMOHIRO·Filed 2010·Granted Jan 24, 2017·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →