Inventor · disambiguated record
Yu-Tang Pan
Also filed as: PAN YU-TANG
20 granted patents·7 pending applications·110 citations·filing 2005–2016
93Inventor score
Technology areasH10W
Top patents by PatentIndex Score
27 records- 0194US7436074B2Chip package without core and stacked chip package structure thereofCHIPMOS TECHNOLOGIES INC·Filed 2005·Granted Oct 14, 2008·34 cites·29 claims
- 0291US7510889B2Light emitting chip package and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Mar 31, 2009·32 cites·13 claims
- 0390US7723853B2Chip package without core and stacked chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2008·Granted May 25, 2010·17 cites·5 claims
- 0471US7514299B2Chip package structure and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Apr 7, 2009·5 cites·5 claims
- 0570US7902649B2Leadframe for leadless package, structure and manufacturing method using the sameCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Mar 8, 2011·3 cites·12 claims
- 0668US7884486B2Chip-stacked package structure and method for manufacturing the sameCHIPMOS TECHNOLOGY INC·Filed 2009·Granted Feb 8, 2011·4 cites·28 claims
- 0766US7560306B2Manufacturing process for chip package without coreCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Jul 14, 2009·3 cites·24 claims
- 0865US8691630B2Semiconductor package structure and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2012·Granted Apr 8, 2014·2 cites·10 claims
- 0964US8772089B2Chip package structure and manufacturing method thereofPAN YU-TANG·Filed 2012·Granted Jul 8, 2014·2 cites·12 claims
- 1063US8652882B2Chip package structure and chip packaging methodPAN YU TANG·Filed 2011·Granted Feb 18, 2014·2 cites·6 claims
- 1161US7696629B2Chip-stacked package structureCHIPMOS TECHNOLOGY INC·Filed 2007·Granted Apr 13, 2010·2 cites·13 claims
- 1260US7592694B2Chip package and method of manufacturing the sameCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Sep 22, 2009·2 cites·19 claims
- 1358US7459783B2Light emitting chip package and light source moduleCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Dec 2, 2008·2 cites·20 claims
- 1453US9437529B2Chip package structure and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2014·Granted Sep 6, 2016·0 cites·9 claims
- 1547US9735092B2Manufacturing method of chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2016·Granted Aug 15, 2017·0 cites·7 claims
- 1647US2008265400A1Chip-Stacked Package Structure and Applications ThereofCHIPMOS TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 1746US8105876B2Leadframe for leadless package, structure and manufacturing method using the sameLIN CHUN YING·Filed 2011·Granted Jan 31, 2012·0 cites·6 claims
- 1846US8106494B2Leadframe for leadless package, structure and manufacturing method using the sameLIN CHUN YING·Filed 2011·Granted Jan 31, 2012·0 cites·8 claims
- 1944US7605461B2Chip package structureCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Oct 20, 2009·0 cites·15 claims
- 2044US2015076670A1Chip package structure and manufacturing method thereofCHIPMOS TECHNOLOGIES INC·Filed 2014·Application pending·0 cites
- 2143US7919874B2Chip package without core and stacked chip package structureCHIPMOS TECHNOLOGIES·Filed 2010·Granted Apr 5, 2011·0 cites·5 claims
- 2242US2010155929A1Chip-Stacked Package StructureCHIPMOS TECHNOLOGY INC·Filed 2010·Application pending·0 cites
- 2342US2007228581A1Universal chip package structureCHOU SHIH-WEN·Filed 2007·Application pending·0 cites
- 2440US2007080466A1Universal chip package structureCHOU SHIH-WEN·Filed 2006·Application pending·0 cites
- 2539US2008283981A1Chip-On-Lead and Lead-On-Chip Stacked StructureCHOU SHIH-WEN·Filed 2008·Application pending·0 cites
- 2638US8148827B2Quad flat no lead (QFN) packagePAN YU-TANG·Filed 2010·Granted Apr 3, 2012·0 cites·9 claims
- 2733US2012241935A1Package-on-package structureCHOU SHIH-WEN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →