Inventor · disambiguated record
Yu-Peng Tsai
Also filed as: TSAI YU-PENG
37 granted patents·5 pending applications·209 citations·filing 2011–2024
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD22TAIWAN SEMICONDUCTOR MFG9CHEN MENG-TSE5CHENG MING-DA2HUANG KUEI-WEI1
Top patents by PatentIndex Score
42 records- 0198US9196559B2Directly sawing wafers covered with liquid molding compoundTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 24, 2015·61 cites·19 claims
- 0297US8884431B2Packaging methods and structures for semiconductor devicesLIN CHIH-WEI·Filed 2011·Granted Nov 11, 2014·35 cites·20 claims
- 0396US9859229B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·16 cites·20 claims
- 0496US9768048B2Package on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·26 cites·20 claims
- 0592US9559005B2Methods of packaging and dicing semiconductor devices and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 31, 2017·14 cites·20 claims
- 0691US10868353B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·7 cites·9 claims
- 0787US9269687B2Packaging methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 23, 2016·7 cites·18 claims
- 0886US9082776B2Semiconductor package having protective layer with curved surface and method of manufacturing sameLU WEN-HSIUNG·Filed 2012·Granted Jul 14, 2015·7 cites·18 claims
- 0982US11482491B2Package structure with porous conductive structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 25, 2022·3 cites·10 claims
- 1081US10535644B1Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·2 cites·20 claims
- 1181US9627369B2Packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 18, 2017·3 cites·20 claims
- 1281US9385040B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·5 cites·20 claims
- 1381US9082636B2Packaging methods and structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 14, 2015·4 cites·20 claims
- 1481US2024274589A1Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1580US10622240B2Package on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 14, 2020·2 cites·20 claims
- 1679US12040309B2Bonding through multi-shot laser reflowTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 1779US9786622B2Semiconductor packageCHENG MING-DA·Filed 2011·Granted Oct 10, 2017·5 cites·20 claims
- 1879US8609462B2Methods for forming 3DIC packageCHEN MENG-TSE·Filed 2011·Granted Dec 17, 2013·4 cites·20 claims
- 1977US11996400B2Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 2075US9331023B1Device packagingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 3, 2016·3 cites·20 claims
- 2175US9030022B2Packages and methods for forming the sameCHEN MENG-TSE·Filed 2011·Granted May 12, 2015·3 cites·20 claims
- 2271US11462507B2Bonding through multi-shot laser reflowTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
- 2370US11342321B2Manufacturing method of package on package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 2467US11830781B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 2567US11532498B2Package-on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 2667US8853002B2Methods for metal bump die assemblyTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 7, 2014·2 cites·20 claims
- 2760US10790261B2Bonding through multi-shot laser reflowTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·20 claims
- 2855US9073158B2Methods for forming 3DIC packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 7, 2015·0 cites·20 claims
- 2954US10134703B2Package on-package process for applying molding compoundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 20, 2018·0 cites·20 claims
- 3054US9257321B2Singulation apparatus and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 9, 2016·0 cites·27 claims
- 3152US11239103B2Package-on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 3252US9679790B2Singulation apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·0 cites·20 claims
- 3350US9698028B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 4, 2017·0 cites·20 claims
- 3449US8927391B2Package-on-package process for applying molding compoundCHEN MENG-TSE·Filed 2011·Granted Jan 6, 2015·0 cites·18 claims
- 3548US9754908B2Wafer with liquid molding compound and post-passivation interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 5, 2017·0 cites·19 claims
- 3648US8987058B2Method for wafer separationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 24, 2015·0 cites·22 claims
- 3748US2013234317A1Packaging Methods and Packaged Semiconductor DevicesCHEN MENG-TSE·Filed 2012·Application pending·0 cites
- 3847US9431360B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 30, 2016·0 cites·20 claims
- 3944US10784221B2Method of processing solder bump by vacuum annealingLIN HSIU JEN·Filed 2011·Granted Sep 22, 2020·0 cites·20 claims
- 4041US2014048934A1Method to control underfill fillet widthCHEN MENG-TSE·Filed 2012·Application pending·0 cites
- 4140US2013099371A1Semiconductor package having solder jointed region with controlled ag contentCHENG MING-DA·Filed 2011·Application pending·0 cites
- 4237US2012267423A1Methods and Apparatus for Thin Die ProcessingHUANG KUEI-WEI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →