Packaging Methods and Packaged Semiconductor Devices

Abstract

Packaging methods and packaged semiconductor devices are disclosed. In one embodiment, a packaging method includes providing a first die, partially packaging the first die, and forming a plurality of solder balls on a surface of the partially packaged first die. An epoxy flux is disposed over the plurality of solder balls. A second die is provided, and the second die is partially packaged. The plurality of solder balls is coupled to the partially packaged second die.

1 . A packaging method, comprising:
 providing a first die;   partially packaging the first die;   forming a plurality of solder balls on a surface of the partially packaged first die;   disposing an epoxy flux over the plurality of solder balls;   providing a second die;   partially packaging the second die; and   after disposing the epoxy flux over the plurality of solder balls, coupling the plurality of solder balls to the partially packaged second die.   
     
     
         2 . The method according to  claim 1 , wherein disposing the epoxy flux comprises dipping the plurality of solder balls in the epoxy flux or jet-spraying the epoxy flux on the plurality of solder balls. 
     
     
         3 . The method according to  claim 1 , wherein coupling the plurality of solder balls to the partially packaged second die comprises reflowing a solder material of the solder balls. 
     
     
         4 . The method according to  claim 1 , wherein the plurality of solder balls comprises a plurality of first solder balls, further comprising forming a plurality of second solder balls on a surface of the partially packaged second die, before coupling the plurality of first solder balls to the partially packaged second die, and wherein coupling the plurality of solder balls to the partially packaged second die comprises coupling the plurality of first solder balls to the plurality of second solder balls. 
     
     
         5 . The method according to  claim 1 , wherein disposing the epoxy flux comprises disposing an epoxy flux that includes a filler material. 
     
     
         6 . The method according to  claim 5 , wherein the filler material is adapted to increase a thermal conductivity of the epoxy flux. 
     
     
         7 . The method according to  claim 5 , wherein the filler material comprises SiO 2  or aluminum nitride. 
     
     
         8 . The method according to  claim 1 , wherein partially packaging the first die or partially packaging the second die comprises coupling the first die or the second die to a through-substrate via (TSV) interposer, the TSV interposer including a redistribution layer (RDL). 
     
     
         9 - 20 . (canceled) 
     
     
         21 . The method of  claim 1  wherein the step of partially packaging the first die comprises:
 providing a first interposer, the first interposer having a first surface and a second surface opposite the first surface, the first interposer comprising a first substrate having a plurality of first through-substrate vias (TSVs) formed therein; and 
 attaching the first die to the second surface of the first interposer. 
 
     
     
         22 . The method of  claim 1  wherein the step of partially packaging the second die comprises:
 providing a second interposer, the second interposer having a first surface and a second surface opposite the first surface, the second interposer comprising second substrate including a plurality of second TSVs formed therein; and 
 attaching the second die to the second surface of the second interposer. 
 
     
     
         23 . The method of  claim 1  wherein the step of forming a plurality of solder balls on a surface of the partially packaged first die comprises:
 coupling the plurality of solder balls to the first surface of the first interposer. 
 
     
     
         24 . The method of  claim 1  wherein the step of coupling the plurality of solder balls to the partially packaged second die comprises:
 attaching the plurality of solder balls on the first interposer to the second surface of the second interposer. 
 
     
     
         25 . The method according to  claim 21 , wherein attaching the first die to the second surface of the first interposer comprises wire-bonding contacts of the first die to bond pads on the second surface of the first interposer. 
     
     
         26 . The method according to  claim 22 , wherein attaching the second die to the second surface of the second interposer comprises coupling a plurality of microbumps between the second die and the second surface of the second interposer, further comprising forming an underfill material between the second die and the second surface of the second interposer between the plurality of microbumps. 
     
     
         27 . The method according to  claim 22 , further comprising forming a molding compound over the second die, after attaching the second die to the second surface of the second interposer. 
     
     
         28 . The method according to  claim 27 , wherein the second surface of the second interposer comprises a plurality of contacts disposed thereon, further comprising removing portions of the molding compound from over the plurality of contacts on the second surface of the second interposer, and wherein attaching the plurality of solder balls on the first interposer to the second surface of the second interposer comprises attaching the plurality of solder balls to the second surface of the second interposer through the molding compound. 
     
     
         29 . The method according to  claim 27 , further comprising removing the molding compound from over a top surface of the second die, before attaching the plurality of solder balls on the first interposer to the second surface of the second interposer. 
     
     
         30 . A packaging method, comprising:
 forming a plurality of solder balls on a surface of a partially packaged first die;   coating the plurality of solder balls with an epoxy flux; and   after coating the plurality of solder balls with the epoxy flux, connecting the plurality of solder balls to a partially packaged second die.   
     
     
         31 . The method of  claim 30  further comprising electrically coupling a first semiconductor die to a first substrate to form the packaged first die and electrically coupling a second semiconductor die to a second substrate to form the packaged second die. 
     
     
         32 . The method of  claim 30  wherein the step of coating the plurality of solder balls with an epoxy flux comprises dipping the plurality of solder balls into a liquid.