Inventor · disambiguated record
Zheng-Yi Lim
Also filed as: LIM ZHENG-YI
13 granted patents·1 pending application·91 citations·filing 2010–2019
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0196US8258055B2Method of forming semiconductor dieHWANG CHIEN LING·Filed 2010·Granted Sep 4, 2012·38 cites·16 claims
- 0291US9048135B2Copper pillar bump with cobalt-containing sidewall protectionHWANG CHIEN LING·Filed 2011·Granted Jun 2, 2015·12 cites·21 claims
- 0391US8242011B2Method of forming metal pillarLIM ZHENG-YI·Filed 2011·Granted Aug 14, 2012·23 cites·20 claims
- 0487US9099396B2Post-passivation interconnect structure and method of forming the sameWU YI-WEN·Filed 2011·Granted Aug 4, 2015·8 cites·20 claims
- 0575US8227334B2Doping minor elements into metal bumpsCHENG MING-DA·Filed 2010·Granted Jul 24, 2012·3 cites·18 claims
- 0673US10483230B2Bonding package components through platingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 19, 2019·1 cites·19 claims
- 0772US8865586B2UBM formation for integrated circuitsWU YI-WEN·Filed 2012·Granted Oct 21, 2014·3 cites·20 claims
- 0868US9691738B2Bonding package components through platingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 27, 2017·1 cites·20 claims
- 0966US9953891B2Method of forming post-passivation interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 24, 2018·1 cites·20 claims
- 1065US9275965B2Copper pillar bump with cobalt-containing sidewall protection layerTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 1, 2016·1 cites·20 claims
- 1163US10840212B2Bonding package components through platingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·0 cites·20 claims
- 1251US9117772B2Bonding package components through platingLIM ZHENG-YI·Filed 2012·Granted Aug 25, 2015·0 cites·21 claims
- 1348US2012286423A1Doping Minor Elements into Metal BumpsCHENG MING-DA·Filed 2012·Application pending·0 cites
- 1444US8501615B2Metal bump formationCHENG MING-DA·Filed 2011·Granted Aug 6, 2013·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →