Inventor · name-matched record
QIAN JUN
4 granted patents·4 pending applications·0 citations·filing 2018–2025
51Inventor score
Files withAPPLIED MATERIALS INC3ORACLE INT CORP2LAM RES CORP1SHANGHAI ZHICHU INSTR CO LTD1UNITED MICROELECTRONICS CORP1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
8 records- 0180US2026043135A1Independently adjustable flowpath conductance in multi-station semiconductor processingLAM RES CORP·Filed 2025·Application pending·0 cites
- 0272US2026061545A1Platen with multiple sensors for eddy current monitoringAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0359US2026068603A1Using signal minima in eddy current monitoringAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0454US12522793B2Accurate positioning mechanism of high-speed biological shaking tableSHANGHAI ZHICHU INSTR CO LTD·Filed 2023·Granted Jan 13, 2026·0 cites·5 claims
- 0552US2026023929A1Application Specific Auto-evaluation for Large Language Models (LLMs)ORACLE INT CORP·Filed 2024·Application pending·0 cites
- 0647US12561998B2Synthetic data fine-tuned optical character recognition engine for extensible markup language document reconstructionORACLE INT CORP·Filed 2023·Granted Feb 24, 2026·0 cites·20 claims
- 0745US12525460B2Method of manufacturing semiconductor structure including removing hard mask layer and dielectric material layer exposed by patterned photoresist layerUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 13, 2026·0 cites·20 claims
- 0842US12524675B2Semiconductor fabrication using machine learning approach to generating process control parametersAPPLIED MATERIALS INC·Filed 2018·Granted Jan 13, 2026·0 cites·8 claims
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Identity basis: exact name match across USPTO filings. How scoring works →