Cluster tool for E-beam treated films

Abstract

One embodiment of the present invention is a cluster tool for processing wafers that includes: (a) one or more chemical vapor deposition chambers; (b) one or more e-beam treatment chambers; and (c) a transfer chamber adapted to transfer a wafer from one chamber to another while maintaining vacuum conditions.

What is claimed is:  
     
         1 . A cluster tool for processing wafers that comprises: 
 one or more chemical vapor deposition chambers;    one or more e-beam treatment chambers; and    a transfer chamber adapted to transfer a wafer from one chamber to another while maintaining vacuum conditions.    
     
     
         2 . A cluster tool that comprises: 
 one or more spin-on coating chambers;    one or more thermal cure processing chambers;    one or more e-beam treatment chambers; and    a transfer chamber adapted to transfer a wafer from one chamber to another while maintaining vacuum conditions.    
     
     
         3 . The cluster tool of  claim 2  that further comprises: 
 one or more chemical vapor deposition chambers.  
 
     
     
         4 . The cluster tool of  claim 1  which further comprises: 
 one or more thermal cure processing chambers.  
 
     
     
         5 . The cluster tool of  claim 2  wherein one or more of the one or more spin-on coating chambers are spin-on dielectric deposition chambers.  
     
     
         6 . The cluster tool of  claim 1  wherein: 
 the cluster tool further comprises a factory/cluster tool interface; and  
 the factory/cluster tool interface includes an interface transfer robot that transfers a cassette adapted to carry one or more wafers into and out of an external factory environment through one or more access ports in the factory/cluster tool interface.  
 
     
     
         7 . The cluster tool of  claim 6  wherein: 
 the interface transfer robot is adapted to move the cassette or individual wafers into and out of a loadlock; and  
 the transfer chamber comprises a transfer robot adapted to move a wafer in the loadlock into the transfer chamber.  
 
     
     
         8 . The cluster tool of  claim 1  wherein: 
 the cluster tool further comprises a factory interface adapted to accept a wafer cassette from an external factory environment, and to transfer the wafer cassette to a loadlock that is in communication with the transfer chamber.  
 
     
     
         9 . The cluster tool of  claim 8  wherein: 
 the transfer chamber further comprises a transfer robot and one or more transfer stations;  
 the transfer robot is adapted to move wafers: (a) from the loadlock to one or more of the chambers, (b) from the loadlock to one or more of the transfer stations, (c) from one or more of the chambers to one or more of the transfer stations, (d) from one or more of the chambers to the loadlock, (e) from one or more of the chambers to one or more other chambers, and (f) from one or more of the transfer stations to the loadlock.  
 
     
     
         10 . The cluster tool of  claim 9  wherein the transfer chamber further comprises a second transfer robot wherein: 
 the second transfer robot is adapted to move wafers (a) from one or more of the transfer stations to one or more of the chambers, (b) from one or more of the chambers to one or more of the transfer stations, and (c) from one or more of the chambers to one or more other chambers.  
 
     
     
         11 . The cluster tool of  claim 10  wherein the transfer chamber further comprises one or more second transfer stations and a third transfer robot wherein: 
 the third transfer robot is adapted to move wafers (a) from one or more of the second transfer stations to one or more of the chambers, (b) from one or more of the chambers to one or more of the second transfer stations, and (c) from the one or more of the chambers to one or more other chambers.  
 
     
     
         12 . A cluster tool for processing wafers that comprises: 
 one or more chemical vapor deposition chambers;    one or more spin-on coating chambers;    one or more thermal cure processing chambers;    one or more e-beam treatment chambers; and    a transfer chamber adapted to transfer a wafer from one chamber to another while maintaining vacuum conditions, which the transfer chamber includes a first and a second transfer robot and a transfer station; wherein: 
 the first transfer robot is adapted to transfer a wafer to one or more of the spin-on coating chambers, and thereafter to transfer the wafer to the transfer station; and  
 the second transfer robot is adapted to transfer the wafer from the transfer station to one or more of the thermal cure processing chambers, and thereafter to transfer the wafer to one or more of the e-beam treatment chambers.  
   
     
     
         13 . The cluster tool of  claim 12  wherein the second transfer robot is further adapted to transfer the wafer to one or more of the chemical vapor deposition chambers.  
     
     
         14 . The cluster tool of  claim 12  wherein: 
 the transfer chamber further includes a second transfer station and a third robot; and  
 the second transfer robot is further adapted to transfer the wafer to the second transfer station; and  
 the third transfer robot is adapted to transfer the wafer from the second transfer station to one or more of the chemical vapor deposition chambers.