Single wafer dryer and drying methods

Abstract

In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

1 . A module adapted to process a wafer, comprising: 
 a processing portion having: 
 a load port through which a wafer is lowered into the processing portion; and  
 a spray mechanism adapted to be submerged in a fluid contained in the processing portion during processing, and positioned so as to spray fluid to the underwater surface of a wafer as the wafer is lowered through the load port.  
   
   
   
       2 . The module of  claim 1  further comprising a spray mechanism adapted to be above a fluid level contained in the processing portion during processing, and positioned so as to spray fluid to the above water surface of a wafer as the wafer is lowered through the load port.  
   
   
       3 . The module of  claim 1  further comprising: 
 an unload port, horizontally displaced from the load port, such that the wafer may be raised out of the processing portion at the unload port; and    a separation wall positioned between the load port and the unload port so as to divide the upper region of the processing portion into a first section adjacent the load port and a second section adjacent the unload port, and so as to deter surface fluid from traveling from the first section to the second section.    
   
   
       4 . The module of  claim 3  wherein the second section comprises a spray mechanism adapted to spray a drying gas on the wafer as the wafer is raised out of the processing portion at the unload port.  
   
   
       5 . The apparatus of  claim 4  further comprising a flow deflector coupled to the drying gas spray mechanism and adapted to limit a volume of the fluid contained in the processing portion that is exposed to the drying gas.  
   
   
       6 . A module adapted to process a wafer, comprising a processing portion having: 
 a load port through which a wafer may be lowered into the processing portion;    an unload port, horizontally displaced from the load port, such that the wafer may be raised out of the processing portion at the unload port;    a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with the load port to a second orientation wherein the wafer is in line with the unload port;    a first pair of spray mechanisms positioned adjacent the load port and adapted to supply fluid to both a front surface and a back surface of the wafer so as to cause the fluid to run downward along the front and the back surfaces thereby maintaining the front and the back surfaces in a wet condition;    a second pair of spray mechanisms positioned adjacent the unload port and adapted to supply fluid to both the front and the back surfaces of the wafer so as to form a fluid meniscus on both the front and the back surfaces of the wafer; and    a third pair of spray mechanisms positioned above the second pair of spray mechanisms and adapted to supply a drying vapor to the fluid meniscus formed on the front and the back surfaces of the wafer.