Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

Abstract

A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing chamber or experimental data derived from operating the actual processing chamber. After a workpiece is processed with the initial parameter configuration, the results are measured and a sensitivity matrix based upon the mathematical model of the processing chamber is used to select new parameters that correct for any deficiencies measured in the processing of the first workpiece. These parameters are then used in processing a second workpiece, which may be similarly measured, and the results used to further refine the parameters.

1 - 14 . (canceled)  
     
     
         15 . A method for electroplating a material on a microelectronic workpiece comprising: 
 introducing at least one surface of the microelectronic workpiece into an electroplating bath;    providing a plurality of anodes in the electroplating bath; and    for each of the plurality of anodes, inducing an electrical current between the anode and the at least one surface of the microelectronic workpiece, the induced electrical current being (a) based on an electrical current induced between the anode and a previously electroplated microelectronic workpiece and (b) selected to improve on an electroplating result achieved for the previously electroplated microelectronic workpiece.    
     
     
         16 . A method of  claim 15  wherein each of the plurality of anodes is provided with a fixed electrical current over a substantial portion of the electroplating process.  
     
     
         17 . The method of  claim 15  and further comprising the step of providing a substantially uniform normal flow of electroplating solution to the at least one surface of the microelectronic workpiece.  
     
     
         18 . The method of  claim 15  and further comprising the step of providing a substantially uniform normal flow of electroplating solution to the at least between the plurality of anodes and the at least one surface of the microelectronic workpiece.  
     
     
         19 . The method of  claim 15  wherein each induced electrical current is selected to improve on a level of plating uniformly achieved for the previously electroplated microelectronic workpiece.  
     
     
         20 . The method of  claim 15  wherein each induced electrical current is selected to improve compliance of a plating profile achieved for the previously electroplated microelectronic workpiece with a target plating profile.  
     
     
         21 . The method of step  15 , further comprising selecting the induced electric currents.  
     
     
         22 . The method of  claim 21 , further comprising performing a sensitivity analysis of the electroplating that is a basis for selecting the induced electric currents.  
     
     
         23 - 63 . (canceled)