Method for forming a metal layer in multiple steps

Abstract

A method for forming a metal layer having a predetermined thickness on an underlying material is disclosed. According to the method, the underlying material is electroplated to form the metal layer having a fraction of the predetermined thickness thereon. The step of electroplating is interrupted for a predetermined period of time. The step of electroplating is then resumed to form the metal layer having the predetermined thickness on the underlying material, thereby improving planarity of the metal layer.

1 . A method for forming a metal layer having a predetermined thickness on an underlying material comprising: 
 electroplating the underlying material to form the metal layer having a fraction of the predetermined thickness thereon;    interrupting the electroplating for a predetermined period of time; and    resuming the electroplating to form the metal layer having the predetermined thickness on the underlying material, thereby improving planarity of the metal layer.    
   
   
       2 . The method of  claim 1  wherein the metal layer is a copper layer.  
   
   
       3 . The method of  claim 1  wherein the predetermined period of time is at least one second.  
   
   
       4 . The method of  claim 1  wherein the predetermined thickness is between 1 and 100K angstroms.  
   
   
       5 . The method of  claim 1  wherein the step of electroplating further comprises placing the underlying material in a chemical solution or a chemical reaction chamber.  
   
   
       6 . The method of  claim 5  wherein the step of interrupting further comprising removing the underlying material from the chemical solution or the chemical reaction chamber.  
   
   
       7 . The method of  claim 1  wherein the steps of interrupting and resuming are repeated for a plurality of times, depending on the predetermined thickness.  
   
   
       8 . A method for forming a metal layer having a predetermined thickness on an underlying material comprising: 
 placing the underlying material in a chemical solution or a chemical reaction chamber;    electroplating the underlying material to form the metal layer having a fraction of the predetermined thickness thereon;    removing the underlying material from the chemical solution or the chemical reaction solution for a predetermined period of time;    placing the underlying material in the chemical solution or the chemical reaction chamber; and    resuming the electroplating to form the metal layer having the predetermined thickness on the underlying material, thereby improving planarity of the metal layer.    
   
   
       9 . The method of  claim 8  wherein the metal layer is a copper layer.  
   
   
       10 . The method of  claim 8  wherein the predetermined period of time is at least one second.  
   
   
       11 . The method of  claim 8  wherein the predetermined thickness is between 1 and 100K angstroms.  
   
   
       12 . The method of  claim 8  wherein the steps of removing, placing and resuming are repeated for a plurality of times, depending on the predetermined thickness.  
   
   
       13 . A method for forming a copper layer having a predetermined thickness on an underlying material comprising: 
 placing the underlying material in a chemical solution or a chemical reaction chamber;    electroplating the underlying material to form the copper layer having a fraction of the predetermined thickness thereon;    removing the underlying material from the chemical solution or the chemical reaction solution for a predetermined period of time;    placing the underlying material back in the chemical solution or the chemical reaction chamber; and    resuming the electroplating to form the copper layer having the predetermined thickness on the underlying material, thereby improving planarity of the metal layer.    
   
   
       14 . The method of  claim 13  wherein the predetermined period of time is at least one second.  
   
   
       15 . The method of  claim 13  wherein the predetermined thickness is between 1 and 100K angstroms.  
   
   
       16 . The method of  claim 13  wherein the steps of removing, placing and resuming are repeated for a plurality of times, depending on the predetermined thickness.