High efficiency uv curing system

Abstract

An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. One or more UV sources per process region that are covered by housings coupled to the lid emit UV light directed through the windows onto substrates located within the process regions. The UV sources can be an array of light emitting diodes or bulbs utilizing a source such as microwave or radio frequency. The UV light can be pulsed during a cure process. Using oxygen radical/ozone generated remotely and/or in-situ accomplishes cleaning of the chamber. Use of lamp arrays, relative motion of the substrate and lamp head, and real-time modification of lamp reflector shape and/or position can enhance uniformity of substrate illumination.

1 . An ultraviolet (UV) curing chamber for curing dielectric materials disposed on substrates, comprising:
 a body defining first and second process regions that are separate and adjacent to one another;   a lid coupled to a top of the body to cover the first and second process regions, wherein the lid includes first and second quartz windows aligned respectively above the first and second process regions;   first and second UV sources disposed respectively above the first and second windows;   first and second housings coupled to the lid and respectively covering the first and second UV sources; and   first and second reflectors disposed respectively in the first and second housings and each of the first and second reflectors are movable to adjust patterns of UV light directed by the reflectors into the process regions.   
   
   
       2 . The UV curing chamber of  claim 1 , wherein gas inlets into the first and second process regions are adapted to supply ozone to the process regions for a cleaning process. 
   
   
       3 . The UV curing chamber of  claim 1 , further comprising a central air source in fluid communication with an interior of the first housing and an interior of the second housing to cool the first and second UV sources disposed therein. 
   
   
       4 . The UV curing chamber of  claim 3 , further comprising a common exhaust system in fluid communication with the interior of the first housing and the interior of the second housing to collect heated air therein and remove ozone from the air. 
   
   
       5 . The UV curing chamber of  claim 1 , further comprising first and second heated and movable pedestals disposed respectively within the first and second process regions for supporting the substrates. 
   
   
       6 . The UV curing chamber of  claim 1 , further comprising at least one power source for activation of the first and second UV sources and each of the at least one power source being at least one microwave generator. 
   
   
       7 . The UV curing chamber of  claim 1 , further comprising at least one power source for activation of the first and second UV sources, each power source being at least one radio frequency generator. 
   
   
       8 . The UV curing chamber of  claim 1 , wherein each of the first and second UV sources comprise one or more UV bulbs. 
   
   
       9 . The UV curing chamber of  claim 8 , wherein each of the one or more UV bulbs have long axes oriented vertically with respect to first and second substrates located respectively in the first and second process regions. 
   
   
       10 . The UV curing chamber of  claim 8 , wherein the UV curing chamber is mounted on a transfer chamber. 
   
   
       11 . The UV curing chamber of  claim 1 , wherein the first and second housings have respective first and second quartz linings coated with dichroic films. 
   
   
       12 . The UV curing chamber of  claim 8 , wherein of the first and second UV sources each comprise a first UV bulb and a second UV bulb. 
   
   
       13 . The UV curing chamber of  claim 12 , wherein the first UV bulb emits UV light of a first wavelength distribution different from a second wavelength distribution emitted by the second UV bulb. 
   
   
       14 . The UV curing chamber of  claim 12 , wherein the first UV bulb is capable of being turned on independently of the second UV bulb. 
   
   
       15 . An ultraviolet (UV) curing chamber for curing dielectric materials disposed on substrates, comprising:
 a body defining first and second process regions that are separate and adjacent to one another;   a lid coupled to a top of the body to cover the first and second process regions, wherein the lid includes first and second quartz windows aligned respectively above the first and second process regions;   first and second UV sources disposed respectively above the first and second windows; and   first and second housings coupled to the lid and respectively covering the first and second UV sources and the first and second housings have respective first and second quartz linings coated with dichroic films.   
   
   
       16 . The UV curing chamber of  claim 15 , wherein the dichroic film comprises a periodic multilayer film composed of non-metallic dielectric materials having alternating high and low refractive index. 
   
   
       17 . The UV curing chamber of  claim 15 , further comprising first and second heated and movable pedestals disposed respectively within the first and second process regions for supporting the substrates. 
   
   
       18 . The UV curing chamber of  claim 15 , further comprising at least one power source for activation of the first and second UV sources, each power source being at least one microwave generator or at least one radio frequency generator. 
   
   
       19 . The UV curing chamber of  claim 15 , wherein the first and second UV sources comprise one or more UV bulbs having long axes oriented vertically with respect to first and second substrates located respectively in the first and second process regions. 
   
   
       20 . The UV curing chamber of  claim 15 , wherein the UV curing chamber is mounted on a transfer chamber.