US2009179281A1PendingUtilityA1
Schottky barrier source/drain N-MOSFET using ytterbium silicide
Est. expiryMay 11, 2024(expired)· nominal 20-yr term from priority
H10D 64/01318H10D 64/0134H10D 64/0112H10D 64/691H10D 64/667H10D 64/647H10D 64/64H10D 30/0277
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Claims
Abstract
An N-type Schottky barrier Source/Drain Transistor (N-SSDT) that uses ytterbium silicide (YbSi 2-x ) for the source and drain is described. The structure includes a suitable capping layer stack.
Claims
exact text as granted — not AI-modified1 . A Schottky barrier source/drain MOSFET structure, comprising:
on a layer of P-type silicon, a gate structure having a gate electrode on a layer of gate insulation; and source and drain regions, that comprise ytterbium silicide, on opposing sides of said gate electrode.
2 . The structure described in claim 1 wherein said layer of gate insulation is hafnium oxide.
3 . The structure described in claim 2 wherein said layer of gate insulation is between about 3 and 10 nm thick.
4 . The structure described in claim 1 wherein said gate electrode is hafnium nitride.
5 . The structure described in claim 4 wherein said gate electrode is between about 20 and 400 nm thick.
6 . The structure described in claim 1 wherein said layer of P-type silicon has a resistivity between about 0.1 and 50 ohm-cm.Join the waitlist — get patent alerts
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