US2009179281A1PendingUtilityA1

Schottky barrier source/drain N-MOSFET using ytterbium silicide

Assignee: ZHU SHIYANGPriority: May 11, 2004Filed: Feb 4, 2009Published: Jul 16, 2009
Est. expiryMay 11, 2024(expired)· nominal 20-yr term from priority
H10D 64/01318H10D 64/0134H10D 64/0112H10D 64/691H10D 64/667H10D 64/647H10D 64/64H10D 30/0277
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Claims

Abstract

An N-type Schottky barrier Source/Drain Transistor (N-SSDT) that uses ytterbium silicide (YbSi 2-x ) for the source and drain is described. The structure includes a suitable capping layer stack.

Claims

exact text as granted — not AI-modified
1 . A Schottky barrier source/drain MOSFET structure, comprising:
 on a layer of P-type silicon, a gate structure having a gate electrode on a layer of gate insulation; and   source and drain regions, that comprise ytterbium silicide, on opposing sides of said gate electrode.   
   
   
       2 . The structure described in  claim 1  wherein said layer of gate insulation is hafnium oxide. 
   
   
       3 . The structure described in  claim 2  wherein said layer of gate insulation is between about 3 and 10 nm thick. 
   
   
       4 . The structure described in  claim 1  wherein said gate electrode is hafnium nitride. 
   
   
       5 . The structure described in  claim 4  wherein said gate electrode is between about 20 and 400 nm thick. 
   
   
       6 . The structure described in  claim 1  wherein said layer of P-type silicon has a resistivity between about 0.1 and 50 ohm-cm.

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