Substrate cleaning device and substrate cleaning method

Abstract

A substrate cleaning device and a substrate cleaning method reduces liquid drops remaining on a substrate to prevent the irregular heating of the substrate by a heating process due to liquid drops or water marks remaining on the substrate. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto the surface of a substrate such that a region onto which the cleaning liquid is poured moves from a central part toward the circumference of the substrate. A gas is jetted radially outward at a region on the surface of the substrate behind a region onto which the cleaning liquid is poured with respect to the rotating direction of the substrate. The gas forces a liquid film of the cleaning liquid flowing on the surface of the substrate to flow in a circumferential direction and a radially outward direction.

1 . A substrate cleaning method comprising the steps of:
 horizontally holding a substrate by a substrate holding device; and   pouring a cleaning liquid onto a surface of the substrate while the rotary substrate holding device is rotated about a vertical axis through a cleaning liquid pouring nozzle having a nozzle exit extended oblique to the surface of the substrate to pour out the cleaning liquid toward a circumference of the substrate so that a region onto which the cleaning liquid is poured moves from a central part toward a circumference of the substrate.   
     
     
         2 . The substrate cleaning method according to  claim 1  further comprising the step of jetting a gas through a gas nozzle at a region behind the region onto which the cleaning liquid is poured with respect to a rotating direction in which the substrate is rotated to force the cleaning liquid poured through the cleaning liquid pouring nozzle onto the substrate to flow toward the circumference of the substrate. 
     
     
         3 . The substrate cleaning method according to  claim 2 , wherein the gas is passed through an ionizer before being jetted out through the gas nozzle. 
     
     
         4 . The substrate cleaning method according to  claim 1 , wherein the cleaning liquid is jetted out through a nozzle exit extending parallel to the surface of the substrate. 
     
     
         5 . The substrate cleaning method according to  claim 1  further comprising the step of restraining the cleaning liquid poured through the nozzle exit of the cleaning liquid pouring nozzle onto the surface of the substrate and flowing in a direction opposite the rotating direction of the substrate by a liquid damming member disposed at a height equal to or lower than that of the nozzle exit. 
     
     
         6 . The substrate cleaning method according to  claim 1 , wherein the substrate is at a stage after being processed by an immersion exposure process that coats the surface of the substrate with a liquid for exposure and before being subject to a hating process. 
     
     
         7 . The substrate cleaning method according to  claim 1 , wherein the substrate is rotated at a rotating speed of 500 rpm or below. 
     
     
         8 . A substrate cleaning method comprising the steps of:
 horizontally holding a substrate on a substrate holding device;   pouring a cleaning liquid onto a surface of the substrate while the rotary substrate holding device is rotated about a vertical axis so that a region onto which the cleaning liquid is poured moves from a central part toward the circumference of the substrate; and   restraining the cleaning liquid poured through the nozzle exit of the cleaning liquid pouring nozzle onto the surface of the substrate and flowing in a direction opposite the rotating direction of the substrate by a liquid damming member disposed at a height equal to or lower than that of the nozzle exit of the cleaning liquid pouring nozzle.   
     
     
         9 . The substrate cleaning method according to  claim 8 , wherein the liquid damming member is formed such that height thereof decreases gradually in the rotating direction of the substrate. 
     
     
         10 . The substrate cleaning method according to  claim 8 , wherein the substrate is at a stage after being processed by an immersion exposure process that coats the surface of the substrate with a liquid for exposure and before being subject to a hating process. 
     
     
         11 . The substrate cleaning method according to  claim 8 , wherein the substrate is rotated at a rotating speed of 500 rpm or below.