Substrate processing method, substrate processing system, and computer-readable storage medium

Abstract

In the present invention, a plurality of rounds of patterning are performed on a substrate. In a patterning system, the substrate on which a first round of patterning has been performed is transferred to a planarizing film forming unit, where a planarizing film is formed above the substrate. The substrate is then transferred to the patterning system and subjected to a second round of patterning. The time from the completion of the forming processing of the planarizing film to the start of the second round of patterning is managed to be constant among the substrates. According to the present invention, in the pattern forming processing of performing a plurality of rounds of patterning, a pattern with a desired dimension can be stably formed above the substrate.

What is claimed is: 
     
         1 . A substrate processing system for performing a plurality of rounds of patterning on a film to be processed located at a same layer above a surface of a substrate, said processing being performed on a plurality of substrates, said system comprising:
 a patterning system for performing each of the rounds of patterning;   a planarizing film forming unit for forming a planarizing film above the substrate between successive rounds of patterning of the plurality of rounds of patterning;   a substrate housing unit capable of temporarily housing the substrate transferred from said planarizing film forming unit to said patterning system; and   a substrate transfer unit for transferring the substrate between said planarizing film forming unit, said patterning system, and said substrate housing unit.   
     
     
         2 . The substrate processing system as set forth in  claim 1 , further comprising:
 a cleaning unit for cleaning the substrate immediately before formation of a planarizing film in said planarizing film forming unit;   another substrate housing unit capable of temporarily housing the substrate transferred from said cleaning unit to said planarizing film forming unit; and   a second substrate transfer unit for transferring the substrate between said cleaning unit, said planarizing film forming unit, and said other substrate housing unit.   
     
     
         3 . The substrate processing system as set forth in  claim 2 ,
 wherein said cleaning unit, said planarizing film forming unit, and said patterning system are linearly arranged in this order, and   wherein said substrate processing system further comprises a third substrate transfer unit for transferring the substrate between said patterning system and said cleaning unit.   
     
     
         4 . The substrate processing system as set forth in  claim 3 ,
 wherein said patterning system comprises at least a resist film forming unit for forming a resist film on or above top of the film to be processed above the substrate, an exposure unit for exposing the resist film above the substrate to light, a developing unit for developing the exposed resist film, an etching unit for etching the film to be processed using a resist pattern formed by the development as a mask, and a resist removing unit for removing the resist pattern,   wherein said cleaning unit, said planarizing film forming unit, said resist film forming unit, said exposure unit, said developing unit, said etching unit, and said resist removing unit are linearly arranged in this order, and   wherein said third substrate transfer unit transfers the substrate from said resist removing unit to said cleaning unit.   
     
     
         5 . The substrate processing system as set forth in  claim 4 ,
 wherein said third substrate transfer unit is capable of transferring the substrate between said resist film forming unit, said exposure unit, said developing unit, said etching unit, and said resist removing unit.   
     
     
         6 . The substrate processing system as set forth in  claim 5 ,
 wherein said third substrate transfer unit is movable on a linear transfer path, and   wherein said cleaning unit, said planarizing film forming unit, said resist film forming unit, said exposure unit, said developing unit, said etching unit, and said resist removing unit are connected to a side of said transfer path and linearly arranged along said transfer path.   
     
     
         7 . The substrate process system as set forth in  claim 1 , further comprising:
 a control unit for controlling a substrate processing system,   wherein said control unit is configured for running a program stored in a non-transitory computer-readable storage medium, and   wherein said program executes an adjustment of waiting time for each substrate in the substrate housing unit by controlling operation of the substrate transfer unit such that time from completion of forming the planarizing film in the planarizing film forming unit to start of subsequent round of patterning is made constant among the substrates.