Method of forming a process chamber component having electroplated yttrium containing coating

Abstract

Methods of fabricating a chamber component capable of being exposed to a plasma in a process chamber includes: providing a component structure composed of metal; immersing the surface of the component structure in an electroplating bath comprising first metal electrolyte species and second metal electrolyte species; forming a cathode by connecting the component structure to a negative terminal of a voltage source; immersing in the electroplating bath, an anode comprising an inert material or material to be electroplated, and connecting the anode to a positive terminal of the voltage source; and electroplating a layer having a concentration gradient of the first metal, second metal, or both.

1 . A method of fabricating a chamber component capable of being exposed to a plasma in a process chamber, the method comprising:
 (a) providing a component structure composed of metal;   (b) immersing the surface of the component structure in an electroplating bath comprising first metal electrolyte species and second metal electrolyte species;   (c) forming a cathode by connecting the component structure to a negative terminal of a voltage source;   (d) immersing in the electroplating bath, an anode comprising an inert material or material to be electroplated, and connecting the anode to a positive terminal of the voltage source; and   (e) varying the concentration of one or more of the first and second metal electrolyte species in the electroplating bath to electroplate a layer comprising a concentration gradient of the first metal, second metal, or both.   
     
     
         2 . A method according to  claim 1  wherein the first metal electrolyte species comprises yttrium-containing species. 
     
     
         3 . A method according to  claim 2  comprising providing an electroplating bath comprising a solution of one or more of yttrium bromide, yttrium chloride, yttrium fluoride, yttrium nitrate, yttrium perchlorate, yttrium carbonate, yttrium sulfate, yttrium hydroxide, yttrium iodide and yttrium acetate. 
     
     
         4 . A method according to  claim 3  comprising maintaining a concentration of yttrium-containing species in the electroplating bath of from about 0.1 mM to about 50 M. 
     
     
         5 . A method according to  claim 2  comprising electroplating the yttrium-containing species to form first metal comprising elemental yttrium, and annealing the elemental yttrium to form yttrium oxide. 
     
     
         6 . A method according to  claim 5  comprising annealing the elemental yttrium to a temperature of at least about 600° C. 
     
     
         7 . A method according to  claim 1  wherein the second metal electrolyte species comprises at least one of an aluminum-containing species and a zirconium-containing species. 
     
     
         8 . A method according to  claim 7  comprising providing an electroplating bath comprising a solution of one or more of aluminum chloride, aluminum bromide, aluminum fluoride, and aluminum hydroxide. 
     
     
         9 . A method according to  claim 7  comprising providing an electroplating bath comprising a solution of one or more of zirconium nitrate, zirconium silicate, zirconium sulfate and zirconium citrate. 
     
     
         10 . A method according to  claim 1  wherein (e) comprises varying the voltage applied by the voltage source. 
     
     
         11 . A method according to  claim 1  comprising maintaining a voltage that is sufficiently high to provide in the electroplating bath, a current density of from about 0.1 A/dm 2  to about 100 A/dm 2 . 
     
     
         12 . A method according to  claim 1  wherein (e) comprises varying the pH of the electroplating bath. 
     
     
         13 . A method according to  claim 2  comprising electroplating the yttrium-containing species to form an electroplated coating having a thickness of from about 12 micrometers to about 203 micrometers. 
     
     
         14 . A method of fabricating a plasma chamber component, the method comprising:
 (a) providing a component structure composed of metal;   (b) immersing the surface of the component structure in an electroplating bath to serve as a cathode, the electroplating bath comprising (i) first metal electrolyte species consisting of yttrium-containing species, and (ii) second metal electrolyte species comprising aluminum-containing species;   (c) immersing an anode in the electroplating bath, the anode comprising an inert material or material to be electroplated;   (d) applying a voltage across the component structure and the anode; and   (e) varying the voltage applied across the component structure and the anode, to electroplate a layer comprising a concentration gradient of the first metal, second metal, or both.   
     
     
         15 . A method according to  claim 14  comprising electroplating the yttrium-containing species to form elemental yttrium, and annealing the elemental yttrium to form yttrium oxide. 
     
     
         16 . A method according to  claim 14  wherein (e) further comprises varying the pH of the electroplating bath. 
     
     
         17 . A method of fabricating a plasma chamber component, the method comprising:
 (a) providing a component structure composed of metal;   (b) immersing the surface of the component structure in an electroplating bath to serve as a cathode, the electroplating bath comprising (i) first metal electrolyte species consisting of yttrium-containing species, and (ii) second metal electrolyte species comprising aluminum-containing species;   (c) immersing an anode in the electroplating bath, the anode comprising an inert material or material to be electroplated;   (d) applying a voltage across the component structure and the anode; and   (e) varying the pH of the electroplating bath to electroplate a layer comprising a concentration gradient of the first metal, second metal, or both.   
     
     
         18 . A method according to  claim 17  wherein (e) further comprises varying the voltage applied across the component structure and the anode. 
     
     
         19 . A method according to  claim 17  comprising maintaining a concentration of yttrium-containing species in the electroplating bath of from about 0.1 mM to about 50 M. 
     
     
         20 . A method according to  claim 17  comprising electroplating the yttrium-containing species to form first metal comprising elemental yttrium, and annealing the elemental yttrium to form yttrium oxide.