Rf power delivery system in a semiconductor apparatus

Abstract

Embodiments of the invention provide an apparatus which provide good RF uniformity within a processing chamber. In one embodiment, an apparatus includes a substrate support assembly, a terminal, and a dielectric insulator. The substrate support assembly has a center passage formed along a center axis. An RF transmission line is provided. The RF transmission line has a substantially vertical portion and a substantially horizontal portion, wherein the terminal is coupled to the substantially horizontal portion of the RF transmission line. The dielectric insulator circumscribes the substantially horizontal portion of the RF transmission line. The dielectric insulator has a first opening through which the terminal passes.

1 . A substrate support assembly, comprising:
 a substrate support assembly;   an RF transmission line coupled to a bottom of the substrate support assembly at a region offset to a center axis of the substrate support assembly; and   a metal plate coupled to the RF transmission line, wherein the metal plate comprises:   a plurality of conduits disposed in the metal plate.   
     
     
         2 . The substrate support assembly of  claim 1 , wherein the conduits of the metal plate are disposed within the substrate support assembly. 
     
     
         3 . The substrate support assembly of  claim 1 , wherein the conduits have a top end coupled to an RF electrode of the substrate support assembly. 
     
     
         4 . The substrate support assembly of  claim 3 , wherein the substrate support assembly further comprises:
 a base plate coupled to an electrostatic chuck.   
     
     
         5 . The substrate support assembly of  claim 3 , wherein the RF electrode is embedded in the electrostatic chuck. 
     
     
         6 . The substrate support assembly of  claim 1 , further comprising:
 a dielectric insulating ring coupled to a bottom of the substrate support assembly.   
     
     
         7 . The substrate support assembly of  claim 6 , wherein the RF transmission line is circumscribed by the dielectric insulating ring. 
     
     
         8 . The substrate support assembly of  claim 6 , wherein the metal plate is disposed in the dielectric insulating ring. 
     
     
         9 . The substrate support assembly of  claim 1 , wherein the conduits are formed substantially perpendicular to the metal plate. 
     
     
         10 . The substrate support assembly of  claim 1 , wherein the conduits protrudes from the metal plate extending to the substrate support assembly. 
     
     
         11 . The substrate support assembly of  claim 1 , wherein the metal plate is fabricated from a group consisting of copper, aluminum, stainless steel and combinations thereof. 
     
     
         12 . The substrate support assembly of  claim 1 , wherein the conduits are distributed in a symmetrical manner utilizing an axis passing through the region where the RF transmission line is attached to as a center axis. 
     
     
         13 . The substrate support assembly of  claim 1 , the location of the conduits is adjustable. 
     
     
         14 . The substrate support assembly of  claim 6 , wherein the dielectric insulating ring is fabricated from a plastic material selected from at least one of plastic, polymer or fluorocarbon. 
     
     
         15 . A substrate support assembly, comprising:
 a substrate support assembly;   an RF transmission line coupled to a bottom of the substrate support assembly at a region offset to a center axis of the substrate support assembly; and   a metal plate coupled to the RF transmission line; and   a plurality of conduits disposed in the metal plate, wherein the conduits disposed in the metal plate are distributed in a symmetrical manner utilizing an axis passing through the region where the RF transmission line is attached to as a center axis.   
     
     
         16 . The substrate support assembly of  claim 15 , further comprising:
 a dielectric insulating ring coupled to a bottom of the substrate support assembly.   
     
     
         17 . The substrate support assembly of  claim 16 , wherein the RF transmission line is circumscribed by the dielectric insulating ring. 
     
     
         18 . The substrate support assembly of  claim 15 , wherein the conduits have a top end coupled to an RF electrode of the substrate support assembly. 
     
     
         19 . The substrate support assembly of  claim 15 , the location of the conduits is adjustable.