US2012299125A1PendingUtilityA1
Self-aligned contacts
Est. expiryApr 7, 2030(~3.7 yrs left)· nominal 20-yr term from priority
H10D 64/0132H10D 64/0131H10W 20/069H10D 64/013H10D 64/691H10D 64/017H10D 30/0213
49
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Claims
Abstract
A method of forming a gate structure with a self-aligned contact is provided and includes sequentially depositing a sacrificial layer and a secondary layer onto poly-Si disposed at a location of the gate structure, encapsulating the sacrificial layer, the secondary layer and the poly-Si, removing the sacrificial layer through openings formed in the secondary layer and forming silicide within at least the space formally occupied by the sacrificial layer.
Claims
exact text as granted — not AI-modified1 . A transistor gate, comprising:
a channel extending between source and drain regions; a gate structure disposed on the channel between the source and drain regions and having at least partial silicidation for a self-aligned contact; an encapsulation assembly to fully encapsulate the gate structure in lateral and radial directions; conductive elements electrically coupled with silicide formed at the source and drain regions; and an insulator having an etch chemistry different from that of the encapsulation assembly, which is substantially entirely interposed between the encapsulation assembly and the conductive elements.
2 . The transistor gate according to claim 1 , wherein the gate structure comprises poly-Si and silicide.
3 . The transistor gate according to claim 1 , wherein the gate structure is fully silicided (FUSI).
4 . A transistor gate, comprising:
a channel; a gate structure disposed on the channel and having at least partial silicidation for a self-aligned contact; an encapsulation assembly to fully encapsulate the gate structure in lateral and radial directions; conductive elements electrically coupled with silicide; and an insulator having an etch chemistry different from that of the encapsulation assembly, which is substantially entirely interposed between the encapsulation assembly and the conductive elements.
5 . The transistor gate according to claim 1 , wherein the gate structure comprises poly-Si and silicide.
6 . The transistor gate according to claim 1 , wherein the gate structure is fully silicided (FUSI).Cited by (0)
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