US2012319069A1PendingUtilityA1

Phase Change Memory Device

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Assignee: PARK YOUNG-LIMPriority: Jun 15, 2007Filed: Aug 13, 2012Published: Dec 20, 2012
Est. expiryJun 15, 2027(~0.9 yrs left)· nominal 20-yr term from priority
C23C 16/45536C23C 16/34H10N 70/8828H10N 70/8265H10N 70/826G11C 13/0004H10N 70/231H10N 70/066H10N 70/8825H10N 70/8413H10N 70/023
65
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Claims

Abstract

Provided are a phase change memory device and a method for forming the phase change memory device. The method includes forming a phase change material layer by providing reactive radicals to a substrate. The reactive radicals may comprise precursors for a phase change material and nitrogen.

Claims

exact text as granted — not AI-modified
1 . A phase change memory device comprising:
 a substrate including a first conductor;   a first dielectric layer having an opening exposing the first conductor;   a phase change material layer provided within the opening; and   a second conductor provided on the phase change material layer, wherein the phase change material layer has a width of about 50 nm or less.   
     
     
         2 . The phase change memory device of  claim 1 , wherein the phase change material layer comprises grains with a size of about 10 nm or less. 
     
     
         3 . The phase change memory device of  claim 1 , wherein
 the first conductor comprises a first portion provided on a bottom of the opening, and a second portion provided extending from the first portion and along a sidewall of the opening, and   the phase change material layer is provided connected to the second portion of the first conductor and along the sidewall of the opening.   
     
     
         4 . The phase change memory device of  claim 3 , further comprising a second dielectric layer provided within the opening, wherein the second portion of the first conductor and the phase change material layer are disposed between the first dielectric layer and the second dielectric layer. 
     
     
         5 . The phase change memory device of  claim 4 , wherein the phase change material layer is configured annularly.

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