US2017268103A1PendingUtilityA1

Method for forming base film of graphene, graphene forming method, and apparatus for forming base film of graphene

Assignee: TOKYO ELECTRON LTDPriority: Aug 11, 2014Filed: Jun 5, 2017Published: Sep 21, 2017
Est. expiryAug 11, 2034(~8 yrs left)· nominal 20-yr term from priority
H10P 72/0432H10P 72/7612H10P 14/43H10W 20/4462H10W 20/0526H10W 20/045H01L 2924/0002C23C 16/26C23C 16/45523C23C 16/46H01L 21/67103C23C 16/18C23C 16/56C01B 32/186C23C 16/0281C23C 16/0218
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Claims

Abstract

A method for forming a base film of a graphene includes: forming a metal film as a base film of a graphene on a substrate by chemical vapor deposition (CVD) of an organic metal compound using a hydrogen gas and an ammonia gas; heating the substrate to a temperature at which impurities included in the formed metal film are eliminated as a gas; and heating the substrate to a temperature at which crystal grains of metal are grown in the metal film, wherein the temperature of the substrate in the heating the substrate to a temperature at which crystal grains of metal are grown in the metal film is higher than the temperature of the substrate in the heating the substrate to a temperature at which impurities included in the formed metal film are eliminated as a gas.

Claims

exact text as granted — not AI-modified
1 - 12 . (canceled) 
     
     
         13 . A method for forming a base film of a graphene, comprising:
 forming a metal film as a base film of a graphene on a substrate by chemical vapor deposition (CVD) of an organic metal compound using a hydrogen gas and an ammonia gas;   heating the substrate to a temperature at which impurities included in the formed metal film are eliminated as a gas; and   heating the substrate to a temperature at which crystal grains of metal are grown in the metal film,   wherein the temperature of the substrate in the heating the substrate to a temperature at which crystal grains of metal are grown in the metal film is higher than the temperature of the substrate in the heating the substrate to a temperature at which impurities included in the formed metal film are eliminated as a gas.   
     
     
         14 . The method of  claim 13 , wherein the forming a metal film, the heating the substrate to a temperature at which impurities included in the formed metal film are eliminated as a gas, and the heating the substrate to a temperature at which crystal grains of metal are grown in the metal film are repeatedly executed in this order. 
     
     
         15 . The method of  claim 14 , wherein a ratio of a flow rate of the ammonia gas to a flow rate of the hydrogen gas is changed when the forming a metal film is repeated. 
     
     
         16 . The method of  claim 15 , wherein the ratio of the flow rate of the ammonia gas to the flow rate of the hydrogen gas is increased when the forming a metal film is repeated. 
     
     
         17 . An apparatus for forming a base film of a graphene, comprising:
 a CVD module configured to form a metal film as a base film of a graphene on a substrate by CVD of an organic metal compound using a hydrogen gas and an ammonia gas;   a first heating module configured to heat the substrate to a temperature at which impurities included in the formed metal film are eliminated as a gas; and   a second heating module configured to heat the substrate to a temperature at which crystal grains of metal are grown in the metal film,   wherein the temperature of the substrate heated in the second heating module is higher than the temperature of the substrate heated in the first heating module.   
     
     
         18 . The apparatus of  claim 17 , wherein the substrate circulates the CVD module, the first heating module and the second heating module in this order, and the circulation of the substrate is repeated. 
     
     
         19 . The apparatus of  claim 18 , wherein, in the CVD module, a ratio of a flow rate of the ammonia gas to a flow rate of the hydrogen gas is changed when the formation of the metal film is repeated. 
     
     
         20 . The apparatus of  claim 19 , wherein in the CVD module, the ratio of the flow rate of the ammonia gas to the flow rate of the hydrogen gas is increased when the formation of the metal film is repeated.

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