Apparatus and methods for dry etch with edge, side and back protection

Abstract

Embodiments of the present invention generally relate to a method and apparatus for plasma etching substrates and, more specifically, to a method and apparatus with protection for edges, sides and backs of the substrates being processed. Embodiments of the present invention provide an edge protection plate with an aperture smaller in size than a substrate being processed, wherein the edge protection plate may be positioned in close proximity to the substrate in a plasma chamber. The edge protection plate overlaps edges and/or sides on the substrate to provide protection to reflective coatings on the edge, sides, and back of the substrate.

What is claimed is: 
     
         1 . An edge protection plate for a plasma processing chamber, comprising:
 a disk with an outer diameter of at least about six inches, wherein an aperture is formed through a central portion of the disk, the aperture having a rectangular shape, a plurality of openings are formed in a peripheral portion of the disk, and the disk comprises quartz or ceramic.   
     
     
         2 . The edge protection plate of  claim 1 , wherein an inner wall of the aperture has a cross-sectional shape that is stepped. 
     
     
         3 . The edge protection plate of  claim 2 , wherein the aperture is defined by an upper opening and a lower opening, and the lower opening is larger than the upper opening.