US2023207312A1PendingUtilityA1

Graphene structure and method of forming graphene structure

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Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Apr 30, 2019Filed: Mar 7, 2023Published: Jun 29, 2023
Est. expiryApr 30, 2039(~12.8 yrs left)· nominal 20-yr term from priority
H10P 14/3406H10P 14/3246H10P 14/2905H10P 14/36H10P 14/24H10P 14/3208H10P 14/2925H10D 48/01H10D 62/882H10D 62/8325H10D 62/822H01L 29/165H01L 29/1606H01L 21/02499H01L 21/02658H01L 29/1608H01L 21/02381H01L 21/02447H01L 21/0262H01L 21/02527H10P 95/90H10P 50/242H10P 50/642H10P 14/6336H10P 14/6319H10P 14/6903H10P 14/6902
69
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Claims

Abstract

Provided are a graphene structure and a method of forming the graphene structure. The graphene structure includes a substrate and graphene on a surface of the substrate. Here, a bonding region in which a material of the substrate and carbon of the graphene are covalently bonded is formed between the surface of the substrate and the graphene.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A graphene structure comprising:
 a substrate;   graphene on a surface of the substrate; and   a bonding region, where a material of the substrate and carbon of the graphene are covalently bonded, between the surface of the substrate and the graphene,   wherein the bonding region has a SiC content in a range of 40% to 60%.   
     
     
         2 . The graphene structure of  claim 1 , wherein
 the bonding region covers a part or all of the surface of the substrate.   
     
     
         3 . The graphene structure of  claim 1 , wherein
 the substrate includes silicon (Si), and   the bonding region includes a silicon-carbon (Si—C) bond.   
     
     
         4 . The graphene structure of  claim 1 , wherein
 the graphene has a thickness of 1 nm to 2 nm.   
     
     
         5 . The graphene structure of  claim 1 , wherein
 the surface of the substrate has nano-sized roughness.

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