Mounting substrate, blanking aperture array chip, blanking aperture array system and multi charged particle beam irradiation apparatus

Abstract

According to one embodiment of the present invention, a mounting substrate is installed on a multi charged particle beam irradiation apparatus, and a blanking aperture array chip provided with blanking electrodes to perform blanking deflection on beams in a multi charged particle beam is mounted on the mounting substrate. The mounting substrate includes an opening through which the multi charged particle beam passes, a plurality of control circuits that supply a control signal to the blanking electrodes for each of a plurality of areas into which the blanking aperture array chip is divided, and grounds, each of which is provided for a corresponding one of the plurality of control circuits and configured to supply a ground electrical potential to the corresponding control circuit. The grounds corresponding to the control circuits are electrically separated from each other.

What is claimed is: 
     
         1 . A mounting substrate which is to be installed on a multi charged particle beam irradiation apparatus, and on which a blanking aperture array chip provided with blanking electrodes to perform blanking deflection on beams in a multi charged particle beam is mounted, the mounting substrate comprising:
 an opening through which the multi charged particle beam passes;   a plurality of control circuits that supply a control signal to the blanking electrodes for each of a plurality of areas into which the blanking aperture array chip is divided; and   grounds, each of which is provided for a corresponding one of the plurality of control circuits and configured to supply a ground electrical potential to the corresponding control circuit,   wherein the grounds corresponding to the control circuits are electrically separated from each other.   
     
     
         2 . The mounting substrate according to  claim 1 ,
 wherein the grounds corresponding to the plurality of control circuits are disposed spaced apart from each other on a surface of the mounting substrate, and a section by which the grounds are spaced apart is an insulation section where the surface of the mounting substrate is exposed.   
     
     
         3 . The mounting substrate according to  claim 2 ,
 wherein the plurality of control circuits and the insulation section are disposed with a rotational symmetry of 90° or 180° about an axis passing through a center of the opening and perpendicular to a major surface of the mounting substrate.   
     
     
         4 . The mounting substrate according to  claim 2 ,
 wherein the insulation section includes:   a frame-shaped first insulation section that surrounds the opening; and   a plurality of linear second insulation sections that radially extend from the first insulation section toward an outer periphery of the mounting substrate.   
     
     
         5 . The mounting substrate according to  claim 2 ,
 wherein the insulation section includes a lattice pattern.   
     
     
         6 . The mounting substrate according to  claim 1 ,
 wherein the plurality of control circuits include wires disposed parallel to directions of return currents which flow through the grounds.   
     
     
         7 . The mounting substrate according to  claim 1 ,
 wherein a first control circuit and a second control circuit are provided as the plurality of control circuits,   a ground for the first control circuit and a ground for the second control circuit are electrically separated by an insulation section where a substrate surface is exposed, and   a lateral face of the opening is provided with a high resistance film of 50Ω to 1 MΩ, which covers an end face of the insulation section.   
     
     
         8 . The mounting substrate according to  claim 1 ,
 wherein a first control circuit and a second control circuit are provided as the plurality of control circuits,   a first ground corresponding to the first control circuit, and a second ground corresponding to the second control circuit are electrically separated,   the first ground includes a plurality of first ground layers which are stacked, and the plurality of first ground layers are connected through a first via,   the second ground includes a plurality of second ground layers which are stacked, and the plurality of second ground layers are connected through a second via, and   the plurality of first ground layers and the plurality of second ground layers are disposed spaced apart.   
     
     
         9 . The mounting substrate according to  claim 8 ,
 wherein one surface of the mounting substrate is provided with a third ground layer that is electrically separated from the first ground and the second ground.   
     
     
         10 . The mounting substrate according to  claim 9 ,
 wherein the other surface of the mounting substrate is provided with a resistance component that connects the first ground layer and the second ground layer.   
     
     
         11 . The mounting substrate according to  claim 8 ,
 wherein a third ground is provided between the first ground and the second ground, the third ground being electrically separated from the first ground and the second ground, and   the third ground includes a plurality of third ground layers which are stacked, and the plurality of third ground layers are connected through a third via.   
     
     
         12 . The mounting substrate according to  claim 11 ,
 wherein one surface of the mounting substrate is provided with one of the third ground layers between one the first ground layers and one of the second ground layers, and   the other surface of the mounting substrate is provided with one of the third ground layers and not provided with the first ground layers and the second ground layers.   
     
     
         13 . The mounting substrate according to  claim 12 ,
 wherein the one surface of the mounting substrate is provided with a first resistance component to connect one of the first ground layers and one of the third ground layers, and a second resistance component to connect one of the second ground layers and the one of the third ground layers.   
     
     
         14 . The mounting substrate according to  claim 8 ,
 wherein a circuit section that constitutes the first control circuit is provided between the plurality of first ground layers, and   a circuit section that constitutes the second control circuit is provided between the plurality of second ground layers.   
     
     
         15 . A blanking aperture array chip to be installed on a multi charged particle beam irradiation apparatus, the blanking aperture array chip comprising:
 blanking electrodes provided for respective apertures through which beams in a multi charged particle beam pass, and configured to perform blanking deflection on the beams;   a plurality of control circuits supplying a control signal to the blanking electrodes; and   a plurality of grounds supplying a ground electrical potential to the control circuits,   wherein the grounds corresponding to the control circuits are electrically separated from each other.   
     
     
         16 . A blanking aperture array system to be installed on a multi charged particle beam irradiation apparatus, the blanking aperture array system comprising:
 a blanking aperture array chip provided with blanking electrodes to perform blanking deflection for respective apertures through which beams in a multi charged particle beam pass; and   a mounting substrate on which the blanking aperture array chip is mounted, the mounting substrate being provided with openings through which the multi charged particle beam passes,   wherein the blanking aperture array chip and the mounting substrate are each provided with a plurality of control circuits that supply a control signal to the blanking electrodes, and   in each of the blanking aperture array chip and the mounting substrate, grounds corresponding to the control circuits are electrically separated from each other.   
     
     
         17 . The blanking aperture array system according to  claim 16 ,
 wherein the blanking aperture array chip is installed on the mounting substrate through a chip carrier,   a lower surface of the chip carrier and an upper surface of the mounting substrate are bonded by a conductive adhesive agent, and   the conductive adhesive agent is applied not across a section that separates the grounds of the mounting substrate.   
     
     
         18 . A multi charged particle beam irradiation apparatus comprising:
 a beam formation mechanism forming a multi charged particle beam;   a blanking aperture array chip provided with blanking electrodes to perform blanking deflection for respective apertures through which beams in the multi charged particle beam pass; and   the mounting substrate according to  claim 1 , on which the blanking aperture array chip is mounted.   
     
     
         19 . The multi charged particle beam irradiation apparatus according to  claim 18 ,
 wherein the beam formation mechanism, the blanking aperture array chip and the mounting substrate are disposed in an electron column,   the mounting substrate is mounted on the electron column by a fixing component made of metal, and   a high resistance plate of 50Ω to 1 MΩ is provided between the mounting substrate and the fixing component.