Method for the formation of a planarizing coating film on substrate surface
Abstract
A method is disclosed for the formation of a planarizing coating film on the surface of a substrate having a stepped level difference under processing for the manufacture of semiconductor devices. The inventive method capable of giving a planarizing coating film of excellent planarity and good adhesion to the substrate surface comprises the steps of: (a) coating the substrate surface with a coating solution containing, as a film-forming solute uniformly dissolved in an ,organic solvent, a nitrogen-containing organic compound such as benzoguanamine and melamine having, in a molecule, at least two amino and/or imino groups each substituted for the nitrogen-bonded hydrogen atom by a hydroxyalkyl group or an alkoxyalkyl group to form a coating layer; (b) drying the coating layer by evaporating the organic solvent to form a dried coating layer; and (c) subjecting the dried coating layer to a baking treatment at a temperature in the range from 150 to 250° C.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A method for the formation of a planarizing coating film on a substrate surface which comprises the steps of:
(a) coating the substrate surface with a coating solution consisting of an organic solvent and, as a film-forming solute uniformly dissolved in the organic solvent, a nitrogen-containing organic compound selected from the group consisting of melamine, benzoguanamine, acetoguanamine, glycoluril, urea, thiourea, guanidine, dicyandiamide, alkylene ureas and succinamide having, in a molecule, at least two amino or imino groups each substituted for the nitrogen-bonded hydrogen atom by a hydroxyalkyl group or an alkoxyalkyl group to form a coating layer;
(b) drying the coating layer by evaporating the organic solvent to form a dried coating layer; and
(c) subjecting the dried coating layer to a baking treatment at a temperature in the range from 150 to 250° C.
2. The method for the formation of a planarizing coating film on a substrate surface as claimed in claim 1 in which the alkyl group of the hydroxyalkyl group and alkoxyalkyl group substituting the nitrogen-containing organic compound has 1 to 4 carbon atoms.
3. The method for the formation of a planarizing coating film on a substrate surface as claimed in claim 1 in which the alkoxy group of the alkoxyalkyl group substituting the nitrogen-containing organic compound has 1 to 4 carbon atoms.
4. The method for the formation of a planarizing coating film on a substrate surface as claimed in claim 1 in which the film-forming solute in the coating solution is a methoxymethylated benzoguanamine or a methoxymethylated melamine.
5. The method for the formation of a planarizing coating film on a substrate surface as claimed in claim 1 in which the organic solvent of the coating solution is selected from the group consisting of alkyleneglycol monoalkyl ethers and esters thereof.
6. The method for the formation of a planarizing coating film on a substrate surface as claimed in claim 1 in which the baking treatment in step (c) is conducted for a length of time in the range from 1 to 30 minutes.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.