P
US9296922B2ActiveUtilityPatentIndex 71

Stable metal compounds as hardmasks and filling materials, their compositions and methods of use

Assignee: YAO HUIRONGPriority: Aug 30, 2013Filed: Aug 30, 2013Granted: Mar 29, 2016
Est. expiryAug 30, 2033(~7.2 yrs left)· nominal 20-yr term from priority
Inventors:YAO HUIRONGMULLEN SALEM KWOLFER ELIZABETHMCKENZIE DOUGLASCHO JOONYEONPADMANABAN MUNIRATHNA
H10P 76/4088H10P 76/4085H10P 76/405G03F 7/091G03F 7/0752C11D 1/72C07F 7/08G03F 7/094C08G 77/58C09D 185/00H01L 21/0338H01L 21/0337H01L 21/0332
71
PatentIndex Score
5
Cited by
117
References
19
Claims

Abstract

The present invention relates to novel, soluble, multi-ligand-substituted metal oxide compounds to form metal oxide films with improved stability as well as compositions made from them and methods of their use. Specifically, the invention pertains to compounds having the following structure (I) wherein M is a metal and n is 1 to 20, and wherein at least one of R 1 , R 2 , R 3 , and R 4 is i) and at least at least one of R 1 , R 2 , R 3 , and R 4 is ii), where i) is a silicon bearing organic moiety having at least 2 carbons, and ii) is an organic moiety. The invention also relates to spin-coatable compositions of compounds of structure (I) dissolved into a solvent. The present invention further relates to processes using this spin coatable composition to form a coating on a patterned substrate.

Claims

exact text as granted — not AI-modified
We claim: 
     
       1. A soluble, multi-ligand-substituted metal compound of structure (I): 
       
         
           
           
               
               
           
         
         wherein M is a metal and n is 1 to 20, and wherein at least one of R 1 , R 2 , R 3 , and R 4  is i) and at least one of R 1 , R 2 , R 3 , and R 4  is ii), where i) is a silicon bearing organic moiety having at least 2 carbons, and ii) is 
         an organic moiety (II), 
       
       
         
           
           
               
               
           
         
         wherein R 8  is selected from a group consisting of C 2 -C 10  alkylene, C 3 -C 12  branched alkylene, C 5 -C 12  cycloalkylene, C 2 -C 10  alkylene containing a C═C double bond, C 3 -C 12  branched alkylene containing a C═C double bond, and a C 5 -C 12  cycloalkylene containing a C═C double bond, and R 9  is the alkyloxycarbonyl moiety (III), where R 10  is a C 1 -C 9  alkyl group, 
       
       
         
           
           
               
               
           
         
         provided that the silicon bearing moiety bearing an organic moiety having at least 2 carbons i) ranges from about 10 mole % to about 80 mole %, and ii) ranges from about 20 mole % to about 90 mole % of the total groups R 1 , R 2 , R 3 , and R 4 . 
       
     
     
       2. The compound of  claim 1 , wherein the silicon bearing moiety bearing an organic moiety having at least 2 carbons i) ranges from 30 mole % to 60 mole %, and that the organic moiety ii) ranges from 30 mole % to 60 mole % of the total of groups R 1 , R 2 , R 3 , and R 4 . 
     
     
       3. The compound of  claim 1 , wherein in structure (I) at least one of R 1 , R 2 , R 3 , and R 4  further comprises C 1 -C 8  alkyl moiety ranging up to 50 mole % of the total of groups R 1 , R 2 , R 3 , and R 4 . 
     
     
       4. The compound of  claim 1 , wherein in structure (I) at least one of R 1 , R 2 , R 3 , and R 4  further comprises C 1 -C 5  alkyl moiety ranging up to 35 mole % of the total of groups R 1 , R 2 , R 3 , and R 4 . 
     
     
       5. The compound of  claim 1 , wherein the metal is selected from a group consisting of titanium, zirconium, tantalum, lead, antimony, thallium, indium, ytterbium, gallium, hafnium, aluminum, magnesium, molybdenum, germanium, tin, iron, cobalt, nickel, copper, zinc, gold, silver, cadmium, tungsten, and platinum. 
     
     
       6. The compound of  claim 1 , wherein the metal is more than one metal when n is 2 to 20. 
     
     
       7. The compound of  claim 1  wherein the silicon bearing organic moiety having at least 2 carbon i) is selected from a group consisting of a trisubstitutedsilyl moiety (IV) and a siloxane moiety (V) 
       
         
           
           
               
               
           
         
         wherein R 5 , and R 6 , are independently selected from a group consisting of C 1 -C 8  alkyl, C 3 -C 12  branched alkyl, and aryl, R 7  is independently selected from a group consisting of C 1 -C 8  alkyl, aryl and hydroxyl, and R 8′  is selected from group consisting of hydrogen, a C 1 -C 8  alkyl, a C 1 -C 8  alkyl substituted with a hydroxyl group, a carboxylic acid group (CO 2 H), and an aryl, and further where p represents the number of repeat units in the siloxane moiety (v). 
       
     
     
       8. The compound of  claim 1 , where the silicon bearing organic moiety having at least 2 carbon I) is a trisubstitutedsilyl moiety (IV). 
     
     
       9. The compound of  claim 1 , where the silicon bearing organic moiety having at least 2 carbon I) is a siloxane moiety (V). 
     
     
       10. The compound of  claim 1  where M is Ti, and the organic moiety i) is selected from the group consisting of 
       
         
           
           
               
               
           
         
         and further wherein n=4-16. 
       
     
     
       11. The compound of  claim 1  where M is Ti and the silicon bearing organic moiety at least 2 carbon ii) is selected from the group consisting of 
       
         
           
           
               
               
           
         
         and further wherein n=4-16. 
       
     
     
       12. A composition comprising:
 a. a soluble, multi-ligand-substituted metal compound of the following structure (I) 
 
       
         
           
           
               
               
           
         
       
       wherein M is a metal and n is 1 to 20, and wherein at least one of R 1 , R 2 , R 3 , and R 4  is i) and at least at least one of R 1 , R 2 , R 3 , and R 4  is ii), where i) is a silicon bearing organic moiety having at least 2 carbons, and ii) is 
       an organic moiety (II), 
       
         
           
           
               
               
           
         
       
       wherein R 8  is selected from a group consisting of C 2 -C 10  alkylene, C 3 -C 12  branched alkylene, C 5 -C 12  cycloalkylene, C 2 -C 10  alkylene containing a C═C double bond, C 3 -C 12  branched alkylene containing a C═C double bond, and a C 5 -C 12  cycloalkylene containing a C═C double bond, and R 9  or the alkyloxycarbonyl moiety (III), where R 10  is a C 1 -C 8  alkyl group, 
       
         
           
           
               
               
           
         
       
       provided that the silicon bearing moiety bearing an organic moiety having at least 2 carbons i) ranges from about 10 mole % to about 80 mole %, and ii) ranges from about 20 mole % to about 90 mole % of the total groups R 1 , R 2 , R 3 , and R 4 , and
 (b) a solvent. 
 
     
     
       13. The composition of  claim 12  where the composition further comprises a surfactant. 
     
     
       14. The composition of  claim 12 , further comprising at least one selected from a group consisting of a thermal acid generator, a thermal base generator, and a thermally activated peroxide. 
     
     
       15. The composition of  claim 12 , wherein n is 2 to 20. 
     
     
       16. The composition of  claim 12 , wherein n is 1. 
     
     
       17. The composition of  claim 12 , further comprising a crosslinking additive. 
     
     
       18. A method of manufacturing an electronic device on a substrate comprised of a patterned photoresist comprising, vias, trenches, holes or other hollow topographical features where the method comprises:
 a. applying a composition from  claim 12  onto the substrate; 
 b. baking the film; 
 c. removing the composition overlaying the top of the patterned photoresist; and 
 d. removing the resist with an oxygen plasma, thereby forming a negative tone image of the original patterned resist. 
 
     
     
       19. The method of  claim 18 , further comprising removing the residual composition with a stripper composition.

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