Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device

Abstract

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

What is claimed is: 
     
       1. An array imaging module, comprising:
 at least two optical lenses; and 
 a molded photosensitive assembly, which comprises: 
 at least a circuit board which has at least one receiving chamber provided in a top lateral side thereof, wherein said circuit board comprises at least two sets of electronic elements electrically coupled at said circuit board outside said receiving chambers respectively; 
 at least two photosensitive units, each having a photosensitive area provided on a top side thereof, electrically coupled at said circuit board for photoelectric conversion, wherein at least one of said two photosensitive units is received in said respective receiving chamber to reduce a height difference between said top lateral side of said circuit board and said top side of said photosensitive unit so as to reduce a thickness of said molded photosensitive assembly; and 
 a molded base integrally coupled at a peripheral portion of said circuit board to integrally encapsulate and enclose at least one of said sets of said electronic elements therein to form an integrated body to prevent said electronic elements from exposing to outside and isolate said electronic elements with each other to prevent mutual interference therebetween, so as to reduce a distance between every two said electronic elements and a thickness of said molded base to reduce a size of said molded photosensitive assembly, wherein said molded base has at least two optical windows formed therein respectively to communicate and align with said photosensitive units respectively to define two photosensitive paths for said two photosensitive units respectively, wherein each of said optical windows is a tapered window having a lower size smaller than an upper size to prevent stray light reflection to said respective photosensitive unit, wherein said molded base is molded to have a flat top side adapted to install said two optical lenses thereon and located along said two photosensitive paths of said photosensitive units respectively such that said two optical windows form two light channels through said photosensitive units and said optical lenses respectively without the need of any additional lens holder to be installed so as to further reduce a thickness of said array imaging module while ensuring coaxial alignment of said optical lenses with said photosensitive units at the same time. 
 
     
     
       2. The array imaging module, as recited in  claim 1 , wherein said at least one two receiving chamber is an indented groove indented in said top lateral side of said circuit board having a bottom surface and a depth less than a thickness of said circuit board. 
     
     
       3. The array imaging module, as recited in  claim 2 , wherein each of said photosensitive units further has a non-photosensitive area on said top side thereof, wherein said molded photosensitive assembly further has at least two sets of connecting elements for electrically coupling with said photosensitive units with said circuit board, wherein one end of at least one said set of said connecting elements is coupled at said bottom surface of said respective receiving chamber to electrically connected to said circuit board and another end of each of said connecting elements is electrically connected to said non-photosensitive area of said respective photosensitive unit received in said respective receiving chamber, so that said set of connecting elements is enclosed by said molded base. 
     
     
       4. The array imaging module, as recited in  claim 3 , wherein said molded base comprises at least two outer ring bodies molded on said circuit board to encircle said two indention grooves and said photosensitive units respectively and a connecting body molded on said circuit board and mold-connected between said two outer ring bodies to form a reinforcing rib to enhance a rigidity of said circuit board and to spacedly separate said two outer ring bodies by said connecting body, wherein said two tapered optical window are formed in said two outer ring bodies respectively to communicate with said photosensitive areas of said two photosensitive units respectively. 
     
     
       5. The array imaging module, as recited in  claim 4 , wherein said molded photosensitive assembly further comprises a base frame overlappedly coupled at said bottom lateral side of said circuit board so as to reinforce a strength of said circuit board, retain a flatness of said circuit board and enhance heat dissipating of said circuit board and said photosensitive units. 
     
     
       6. The array imaging module, as recited in  claim 5 , wherein said molded photosensitive assembly further comprises at least one light filter, wherein said top side of said molded base is molded to have at least a flat outer lateral top surface and at least a flat inner lateral top surface located below said outer lateral top surface to form a step-ladder configuration and define at least an indention slot in said top side of said molded base, wherein said light filter is coupled at said inner lateral top surface within said indention slot of said top side of said molded base and positioned above one of said light windows and said respective photosensitive unit, wherein one of said optical lenses is coupled at said outer lateral top surface to align with said light filter and said photosensitive area of said photosensitive unit along said photosensitive path to form said a light channel, wherein said molded base further comprises at least a blocking protrusion protruded from said top side thereof, wherein said blocking protrusion is a partition wall protruded between said inner lateral top surface and said outer lateral top surface. 
     
     
       7. The array imaging module, as recited in  claim 3 , wherein said molded photosensitive assembly further comprises a base frame overlappedly coupled at said bottom lateral side of said circuit board so as to reinforce a strength of said circuit board, retain a flatness of said circuit board and enhance heat dissipating of said circuit board and said photosensitive units. 
     
     
       8. The array imaging module, as recited in  claim 3 , wherein said molded photosensitive assembly further comprises at least one light filter, wherein said top side of said molded base is molded to have at least a flat outer lateral top surface and at least a flat inner lateral top surface located below said outer lateral top surface to form a step-ladder configuration and define at least an indention slot in said top side of said molded base, wherein said at least one light filter is coupled at said inner lateral top surface within said indention slot of said top side of said molded base and positioned above said respective light window and said respective photosensitive unit, wherein one of said optical lenses is coupled at said outer lateral top surfacs to align with said light filter and said photosensitive area of said respective photosensitive unit along said photosensitive path to form said light channel. 
     
     
       9. The array imaging module, as recited in  claim 2 , wherein said molded base comprises at least two outer ring bodies molded on said circuit board to encircle said two indention grooves and said photosensitive units respectively and a connecting body molded on said circuit board and mold-connected between said two outer ring bodies to form a reinforcing rib to enhance a rigidity of said circuit board and to spacedly separate said two outer ring bodies by said connecting body, wherein said two tapered optical window are formed in said two outer ring bodies respectively to communicate with said photosensitive areas of said two photosensitive units respectively. 
     
     
       10. The array imaging module, as recited in  claim 9 , wherein said molded photosensitive assembly further comprises a base frame overlappedly coupled at said bottom lateral side of said circuit board so as to reinforce a strength of said circuit board, retain a flatness of said circuit board and enhance heat dissipating of said circuit board and said photosensitive units. 
     
     
       11. The array imaging module, as recited in  claim 10 , wherein said molded photosensitive assembly further comprises at least one light filter, wherein said top side of said molded base is molded to have at least a flat outer lateral top surface and at least a flat inner lateral top surface located below said outer lateral top surface to form a step-ladder configuration and define at least an indention slot in said top side of said molded base, wherein said light filter is coupled at said inner lateral top surface within said indention slot of said top side of said molded base and positioned above one of said light windows and said respective photosensitive unit, wherein one of said optical lenses is coupled at said outer lateral top surface to align with said light filter and said photosensitive area of said photosensitive unit along said photosensitive path to form said a light channel, wherein said molded base further comprises at least a blocking protrusion protruded from said top side thereof, wherein said blocking protrusion is a partition wall protruded between said inner lateral top surface and said outer lateral top surface. 
     
     
       12. The array imaging module, as recited in  claim 2 , wherein said molded photosensitive assembly further comprises a base frame overlappedly coupled at said bottom lateral side of said circuit board so as to reinforce a strength of said circuit board, retain a flatness of said circuit board and enhance heat dissipating of said circuit board and said photosensitive units. 
     
     
       13. The array imaging module, as recited in  claim 2 , wherein said molded photosensitive assembly further comprises at least one light filter, wherein said top side of said molded base is molded to have at least a flat outer lateral top surface and at least a flat inner lateral top surface located below said outer lateral top surface to form a step-ladder configuration and define at least an indention slot in said top side of said molded base, wherein said at least one light filter is coupled at said inner lateral top surface within said indention slot of said top side of said molded base and positioned above said respective light window and said respective photosensitive unit, wherein one of said optical lenses is coupled at said outer lateral top surfacs to align with said light filter and said photosensitive area of said respective photosensitive unit along said photosensitive path to form said light channel. 
     
     
       14. The array imaging module, as recited in  claim 1 , wherein said at least one receiving chamber is a through hole extending through said circuit board and said respective photosensitive unit is received in said through hole, wherein said molded photosensitive assembly further has at least two sets of connecting elements for electrically coupling with said photosensitive units with said circuit board, wherein one end of at least one said set of said connecting elements is electrically connected at said circuit board and another end of each of said at least one set of said connecting elements is electrically connected to said non-photosensitive area of said respective photosensitive unit received in said respective receiving chamber. 
     
     
       15. The array imaging module, as recited in  claim 14 , wherein said molded base comprises at least two outer ring bodies molded on said circuit board to encircle said two indention grooves and said photosensitive units respectively and a connecting body molded on said circuit board and mold-connected between said two outer ring bodies to form a reinforcing rib to enhance a rigidity of said circuit board and to spacedly separate said two outer ring bodies by said connecting body, wherein said two tapered optical window are formed in said two outer ring bodies respectively to communicate with said photosensitive areas of said two photosensitive units respectively. 
     
     
       16. The array imaging module, as recited in  claim 15 , wherein said molded photosensitive assembly further comprises a base frame overlappedly coupled at said bottom lateral side of said circuit board so as to reinforce a strength of said circuit board, retain a flatness of said circuit board and enhance heat dissipating of said circuit board and said photosensitive units. 
     
     
       17. The array imaging module, as recited in  claim 16 , wherein said molded photosensitive assembly further comprises at least one light filter, wherein said top side of said molded base is molded to have at least a flat outer lateral top surface and at least a flat inner lateral top surface located below said outer lateral top surface to form a step-ladder configuration and define at least an indention slot in said top side of said molded base, wherein said light filter is coupled at said inner lateral top surface within said indention slot of said top side of said molded base and positioned above one of said light windows and said respective photosensitive unit, wherein one of said optical lenses is coupled at said outer lateral top surface to align with said light filter and said photosensitive area of said photosensitive unit along said photosensitive path to form said a light channel, wherein said molded base further comprises at least a blocking protrusion protruded from said top side thereof, wherein said blocking protrusion is a partition wall protruded between said inner lateral top surface and said outer lateral top surface. 
     
     
       18. The array imaging module, as recited in  claim 14 , wherein said molded photosensitive assembly further comprises a base frame overlappedly coupled at said bottom lateral side of said circuit board so as to reinforce a strength of said circuit board, retain a flatness of said circuit board and enhance heat dissipating of said circuit board and said photosensitive units. 
     
     
       19. The array imaging module, as recited in  claim 14 , wherein said molded photosensitive assembly further comprises at least one light filter, wherein said top side of said molded base is molded to have at least a flat outer lateral top surface and at least a flat inner lateral top surface located below said outer lateral top surface to form a step-ladder configuration and define at least an indention slot in said top side of said molded base, wherein said at least one light filter is coupled at said inner lateral top surface within said indention slot of said top side of said molded base and positioned above said respective light window and said respective photosensitive unit, wherein one of said optical lenses is coupled at said outer lateral top surfacs to align with said light filter and said photosensitive area of said respective photosensitive unit along said photosensitive path to form said light channel. 
     
     
       20. The array photosensitive assembly, as recited in  claim 1 , wherein said at least one receiving chamber is an indention groove indented in a bottom lateral side of said circuit board and said top lateral side of said circuit board further has at least a conductive channel formed therein to communicate said receiving chamber with said respective light window of said molded base, wherein said respective photosensitive unit is received in said respective receiving chamber of said circuit board while said photosensitive area of said photosensitive unit is facing upwards to receive light through said respective light channel via said conductive channel. 
     
     
       21. The array imaging module, as recited in  claim 20 , wherein said molded base comprises at least two outer ring bodies molded on said circuit board to encircle said two indention grooves and said photosensitive units respectively and a connecting body molded on said circuit board and mold-connected between said two outer ring bodies to form a reinforcing rib to enhance a rigidity of said circuit board and to spacedly separate said two outer ring bodies by said connecting body, wherein said two tapered optical window are formed in said two outer ring bodies respectively to communicate with said photosensitive areas of said two photosensitive units respectively. 
     
     
       22. The array imaging module, as recited in  claim 21 , wherein said molded photosensitive assembly further comprises a base frame overlappedly coupled at said bottom lateral side of said circuit board so as to reinforce a strength of said circuit board, retain a flatness of said circuit board and enhance heat dissipating of said circuit board and said photosensitive units. 
     
     
       23. The array imaging module, as recited in  claim 22 , wherein said molded photosensitive assembly further comprises at least one light filter, wherein said top side of said molded base is molded to have at least a flat outer lateral top surface and at least a flat inner lateral top surface located below said outer lateral top surface to form a step-ladder configuration and define at least an indention slot in said top side of said molded base, wherein said light filter is coupled at said inner lateral top surface within said indention slot of said top side of said molded base and positioned above one of said light windows and said respective photosensitive unit, wherein one of said optical lenses is coupled at said outer lateral top surface to align with said light filter and said photosensitive area of said photosensitive unit along said photosensitive path to form said a light channel, wherein said molded base further comprises at least a blocking protrusion protruded from said top side thereof, wherein said blocking protrusion is a partition wall protruded between said inner lateral top surface and said outer lateral top surface. 
     
     
       24. The array imaging module, as recited in  claim 20 , wherein said molded photosensitive assembly further comprises a base frame overlappedly coupled at said bottom lateral side of said circuit board so as to reinforce a strength of said circuit board, retain a flatness of said circuit board and enhance heat dissipating of said circuit board and said photosensitive units. 
     
     
       25. The array imaging module, as recited in  claim 20 , wherein said molded photosensitive assembly further comprises at least one light filter, wherein said top side of said molded base is molded to have at least a flat outer lateral top surface and at least a flat inner lateral top surface located below said outer lateral top surface to form a step-ladder configuration and define at least an indention slot in said top side of said molded base, wherein said at least one light filter is coupled at said inner lateral top surface within said indention slot of said top side of said molded base and positioned above said respective light window and said respective photosensitive unit, wherein one of said optical lenses is coupled at said outer lateral top surfacs to align with said light filter and said photosensitive area of said respective photosensitive unit along said photosensitive path to form said light channel. 
     
     
       26. The array imaging module, as recited in  claim 1 , wherein said molded base comprises at least two outer ring bodies molded on said circuit board to encircle said two receiving chambers and said photosensitive units respectively and a connecting body molded on said circuit board and mold-connected between said two outer ring bodies to form a reinforcing rib to enhance a rigidity of said circuit board and to spacedly separate said two outer ring bodies by said connecting body, wherein said two tapered optical window are formed in said two outer ring bodies respectively to communicate with said photosensitive areas of said two photosensitive units respectively. 
     
     
       27. The array imaging module, as recited in  claim 26 , wherein said molded photosensitive assembly further comprises a base frame overlappedly coupled at said bottom lateral side of said circuit board so as to reinforce a strength of said circuit board, retain a flatness of said circuit board and enhance heat dissipating of said circuit board and said photosensitive units. 
     
     
       28. The array imaging module, as recited in  claim 27 , wherein said molded photosensitive assembly further comprises at least one light filter, wherein said top side of said molded base is molded to have at least a flat outer lateral top surface and at least a flat inner lateral top surface located below said outer lateral top surface to form a step-ladder configuration and define at least an indention slot in said top side of said molded base, wherein said at least one light filter is coupled at said inner lateral top surface within said indention slot of said top side of said molded base and positioned above said respective light window and said respective photosensitive unit, wherein one of said optical lenses is coupled at said outer lateral top surfacs to align with said light filter and said photosensitive area of said respective photosensitive unit along said photosensitive path to form said light channel. 
     
     
       29. The array imaging module, as recited in  claim 1 , wherein said molded photosensitive assembly further comprises a base frame overlappedly coupled at said bottom lateral side of said circuit board so as to reinforce a strength of said circuit board, retain a flatness of said circuit board and enhance heat dissipating of said circuit board and said photosensitive units. 
     
     
       30. The array imaging module, as recited in  claim 1 , wherein said molded photosensitive assembly further comprises at least one light filter, wherein said top side of said molded base is molded to have at least a flat outer lateral top surface and at least a flat inner lateral top surface located below said outer lateral top surface to form a step-ladder configuration and define at least an indention slot in said top side of said molded base, wherein said at least one light filter is coupled at said inner lateral top surface within said indention slot of said top side of said molded base and positioned above said respective light window and said respective photosensitive unit, wherein one of said optical lenses is coupled at said outer lateral top surfacs to align with said light filter and said photosensitive area of said respective photosensitive unit along said photosensitive path to form said light channel.