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Elastic membrane for semiconductor wafer polishing apparatus

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Assignee: EBARA CORPPriority: May 15, 2013Filed: Apr 30, 2014Granted: Nov 8, 2016
Est. expiryMay 15, 2033(~6.8 yrs left)· nominal 20-yr term from priority
Inventors:Makoto FukushimaHozumi YasudaKeisuke NamikiOsamu NabeyaShingo TogashiSatoru Yamaki
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PatentIndex Score
6
Cited by
27
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.

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