Assignee
CHEN CHIEN-HUA
TW·17 granted patents·12 pending applications·112 citations·filing 2004–2018
Top patents by PatentIndex Score
29 records- 0198US9446590B2Diagonal openings in photodefinable glassCHEN CHIEN-HUA·Filed 2012·Granted Sep 20, 2016·53 cites·10 claims
- 0294US8336981B2Determining a healthy fluid ejection nozzleCHEN CHIEN-HUA·Filed 2009·Granted Dec 25, 2012·24 cites·11 claims
- 0391US8853819B2Semiconductor structure with passive element network and manufacturing method thereofCHEN CHIEN-HUA·Filed 2011·Granted Oct 7, 2014·16 cites·20 claims
- 0483US10058119B1Fruit and vegetable washerCHEN CHIEN HUA·Filed 2017·Granted Aug 28, 2018·4 cites·13 claims
- 0577US8109607B2Fluid ejector structure and fabrication methodCHEN CHIEN-HUA·Filed 2008·Granted Feb 7, 2012·5 cites·7 claims
- 0673US10702103B2Flip-top washing device for vegetables and fruitsCHEN CHIEN HUA·Filed 2018·Granted Jul 7, 2020·1 cites·14 claims
- 0767US8415790B2Semiconductor package having passive device and method for making the sameCHEN CHIEN-HUA·Filed 2010·Granted Apr 9, 2013·2 cites·16 claims
- 0866US8274133B2Semiconductor package and method for making the sameCHEN CHIEN-HUA·Filed 2010·Granted Sep 25, 2012·2 cites·13 claims
- 0966US8217473B2Micro electro-mechanical system packaging and interconnectCHEN CHIEN-HUA·Filed 2005·Granted Jul 10, 2012·4 cites·26 claims
- 1057US8197030B1Fluid ejector structureCHEN CHIEN-HUA·Filed 2009·Granted Jun 12, 2012·1 cites·9 claims
- 1154US8174094B2Bonded structures formed by plasma enhanced bondingCHEN CHIEN-HUA·Filed 2009·Granted May 8, 2012·0 cites·10 claims
- 1251US2007068620A1System and method for transferring structured material to a substrateCHEN CHIEN-HUA·Filed 2006·Application pending·0 cites
- 1350US8778769B2Semiconductor package having passive device and method for making the sameCHEN CHIEN-HUA·Filed 2012·Granted Jul 15, 2014·0 cites·10 claims
- 1449US2013102122A1Semiconductor package and method for making the sameCHEN CHIEN-HUA·Filed 2012·Application pending·0 cites
- 1548US8497577B2Micro electrical mechanical systemCHEN CHIEN-HUA·Filed 2007·Granted Jul 30, 2013·0 cites·3 claims
- 1647US2009093172A1Systems and methods for utilizing single detective pin of host to support plurality of external apparatusCHEN CHIEN-HUA·Filed 2007·Application pending·0 cites
- 1746US2007272349A1System and Method for Low Temperature Plasma Enhanced BondingCHEN CHIEN-HUA·Filed 2007·Application pending·0 cites
- 1845US8314697B2Electric system and alarm device thereofCHEN CHIEN-HUA·Filed 2008·Granted Nov 20, 2012·0 cites·16 claims
- 1945US2009166161A1Power circuit-switching deviceCHEN CHIEN-HUA·Filed 2008·Application pending·0 cites
- 2045US2012019597A1Inkjet printhead with cross-slot conductor routingCHEN CHIEN-HUA·Filed 2009·Application pending·0 cites
- 2145US2006163712A1System and method for direct-bonding of substratesCHEN CHIEN-HUA·Filed 2006·Application pending·0 cites
- 2244US9355834B2Adhesive transferCHEN CHIEN-HUA·Filed 2011·Granted May 31, 2016·0 cites·19 claims
- 2344US9129758B2Rocker switch deviceCHEN CHIEN HUA·Filed 2012·Granted Sep 8, 2015·0 cites·10 claims
- 2443US2006016547A1System and method for transferring structured material to a substrateCHEN CHIEN-HUA·Filed 2004·Application pending·0 cites
- 2542US2012246113A1Embedded device with file change notification function and method thereofCHEN CHIEN-HUA·Filed 2011·Application pending·0 cites
- 2641US7442576B2Placement of absorbing material in a semiconductor deviceCHEN CHIEN-HUA·Filed 2006·Granted Oct 28, 2008·0 cites·9 claims
- 2740US2006033188A1Electronic component packagingCHEN CHIEN-HUA·Filed 2004·Application pending·0 cites
- 2839US2007090479A1Controlling bond fronts in wafer-scale packagingCHEN CHIEN-HUA·Filed 2005·Application pending·0 cites
- 2937US2007023850A1Bonding surfaces together via plasma treatment on both surfaces with wet treatment on only one surfaceCHEN CHIEN-HUA·Filed 2005·Application pending·0 cites
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