Inventor · disambiguated record
Seung-Duk Baek
Also filed as: BAEK SEUNG-DUK
40 granted patents·11 pending applications·699 citations·filing 2004–2023
98Inventor score
Top patents by PatentIndex Score
51 records- 0199US7276799B2Chip stack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 2, 2007·429 cites·10 claims
- 0297US10658300B2Semiconductor package and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 19, 2020·20 cites·18 claims
- 0397US7537959B2Chip stack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 26, 2009·52 cites·10 claims
- 0495US8368231B2Chipstack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Feb 5, 2013·12 cites·19 claims
- 0595US8153521B2Wafer-level stack packageKANG SUN-WON·Filed 2010·Granted Apr 10, 2012·23 cites·10 claims
- 0691US8735276B2Semiconductor packages and methods of manufacturing the sameCHUNG HYUN-SOO·Filed 2012·Granted May 27, 2014·14 cites·20 claims
- 0790US10756062B2Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 25, 2020·6 cites·20 claims
- 0890US7508061B2Three-dimensional semiconductor module having multi-sided ground blockSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 24, 2009·20 cites·33 claims
- 0989US11056414B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 6, 2021·4 cites·19 claims
- 1087US7977156B2Chipstack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jul 12, 2011·11 cites·20 claims
- 1185US8779576B2Wafer level package and methods of fabricating the samePARK SANG-WOOK·Filed 2011·Granted Jul 15, 2014·8 cites·27 claims
- 1282US7274097B2Semiconductor package including redistribution pattern and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 25, 2007·11 cites·41 claims
- 1381US7893526B2Semiconductor package apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 22, 2011·11 cites·15 claims
- 1480US7595559B2Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chipSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 29, 2009·8 cites·9 claims
- 1579US7884458B2Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 8, 2011·8 cites·20 claims
- 1679US7663903B2Semiconductor memory device having improved voltage transmission path and driving method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 16, 2010·6 cites·18 claims
- 1778US11955399B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 1877US7586182B2Packaged semiconductor die and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 8, 2009·7 cites·20 claims
- 1976US11302598B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 12, 2022·1 cites·20 claims
- 2075US11081425B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 3, 2021·2 cites·19 claims
- 2175US7924592B2Semiconductor memory device having improved voltage transmission path and driving method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Apr 12, 2011·3 cites·25 claims
- 2273US11133232B2Semiconductor device, method of testing semiconductor device and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 28, 2021·1 cites·19 claims
- 2372US8039928B2Chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 18, 2011·4 cites·37 claims
- 2471US11664292B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·0 cites·11 claims
- 2571US8097940B2Stack packageBAEK SEUNG-DUK·Filed 2009·Granted Jan 17, 2012·5 cites·15 claims
- 2670US7759716B2Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked moduleSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jul 20, 2010·4 cites·20 claims
- 2769US10804218B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 13, 2020·1 cites·15 claims
- 2869US8110922B2Wafer level semiconductor module and method for manufacturing the sameCHUNG HYUN-SOO·Filed 2009·Granted Feb 7, 2012·3 cites·15 claims
- 2968US8115324B2Semiconductor moduleKANG SUN-WON·Filed 2008·Granted Feb 14, 2012·3 cites·20 claims
- 3067US8143693B2Semiconductor device including redistribution line structure and method of fabricating the sameBAEK SEUNG-DUK·Filed 2008·Granted Mar 27, 2012·4 cites·22 claims
- 3166US8004848B2Stack module, card including the stack module, and system including the stack moduleSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 23, 2011·3 cites·23 claims
- 3264US7307340B2Wafer-level electronic modules with integral connector contactsSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 11, 2007·11 cites·38 claims
- 3363US8446016B2Chip stack packageKANG SUN-WON·Filed 2011·Granted May 21, 2013·1 cites·39 claims
- 3460US7767576B2Wafer level package having floated metal line and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 3, 2010·1 cites·22 claims
- 3559US11756853B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·20 claims
- 3659US8004081B2Semiconductor chip package and printed circuit board having through interconnectionsSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 23, 2011·1 cites·19 claims
- 3758US7652383B2Semiconductor package module without a solder ball and method of manufacturing the semiconductor package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 26, 2010·1 cites·8 claims
- 3852US2009166840A1Wafer-level stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3951US2009184411A1Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 4050US8174860B2Semiconductor memory device having improved voltage transmission path and driving method thereofKANG SUN-WON·Filed 2011·Granted May 8, 2012·0 cites·31 claims
- 4149US8928154B2Semiconductor moduleKANG SUN-WON·Filed 2012·Granted Jan 6, 2015·0 cites·20 claims
- 4248US7851256B2Method of manufacturing chip-on-chip semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Dec 14, 2010·0 cites·21 claims
- 4348US2007246826A1Wafer level semiconductor module and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4445US2008128882A1Chip stack package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4545US2008048322A1Semiconductor package including redistribution pattern and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4645US2008116572A1Semiconductor memory modules, methods of arranging terminals therein, and methods of using thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4743US2007102814A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4841US2019206841A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 4940US2007007663A1Semiconductor package having dual interconnection form and manufacturing method thereofBAEK SEUNG-DUK·Filed 2006·Application pending·0 cites
- 5037US2017047310A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →