Inventor · disambiguated record
Ho-Yung David Hwang
Also filed as: HWANG HO-YUNG · HWANG HO-YUNG DAVID
43 granted patents·18 pending applications·213 citations·filing 2010–2025
97Inventor score
Files withAPPLIED MATERIALS INC26MICROMATERIALS LLC14TAIWAN SEMICONDUCTOR MFG CO LTD10CHEN CHI-MING9TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
61 records- 0198US8476146B2Reducing wafer distortion through a low CTE layerCHEN CHI-MING·Filed 2010·Granted Jul 2, 2013·134 cites·20 claims
- 0296US8624326B2FinFET device and method of manufacturing sameCHEN CHI-MING·Filed 2011·Granted Jan 7, 2014·29 cites·20 claims
- 0394US11550222B2Dose reduction of patterned metal oxide photoresistsAPPLIED MATERIALS INC·Filed 2020·Granted Jan 10, 2023·3 cites·20 claims
- 0494US10510540B2Mask scheme for cut pattern flow with enlarged EPE windowMICROMATERIALS LLC·Filed 2018·Granted Dec 17, 2019·11 cites·20 claims
- 0590US10424507B2Fully self-aligned viaMICROMATERIALS LLC·Filed 2017·Granted Sep 24, 2019·5 cites·13 claims
- 0689US12020908B2Atomic layer etching of Ru metalAPPLIED MATERIALS INC·Filed 2022·Granted Jun 25, 2024·1 cites·18 claims
- 0789US10600688B2Methods of producing self-aligned viasMICROMATERIALS LLC·Filed 2018·Granted Mar 24, 2020·6 cites·17 claims
- 0887US10553485B2Methods of producing fully self-aligned vias and contactsMICROMATERIALS LLC·Filed 2018·Granted Feb 4, 2020·5 cites·14 claims
- 0982US11869807B2Fully self-aligned subtractive etchAPPLIED MATERIALS INC·Filed 2021·Granted Jan 9, 2024·1 cites·14 claims
- 1082US2024393051A1Adaptive baking methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1181US10558120B2System and method for supplying and dispensing bubble-free photolithography chemical solutionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 11, 2020·2 cites·20 claims
- 1279US11437274B2Fully self-aligned viaMICROMATERIALS LLC·Filed 2020·Granted Sep 6, 2022·1 cites·9 claims
- 1379US8772831B2III-nitride growth method on silicon substrateCHEN CHI-MING·Filed 2011·Granted Jul 8, 2014·4 cites·22 claims
- 1478US2023384680A1System and method for supplying and dispensing bubble-free photolithography chemical solutionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1576US12196491B2Adaptive baking methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 14, 2025·0 cites·20 claims
- 1676US10593594B2Selectively etched self-aligned via processesMICROMATERIALS LLC·Filed 2018·Granted Mar 17, 2020·2 cites·20 claims
- 1775US11994800B2Dose reduction of patterned metal oxide photoresistsAPPLIED MATERIALS INC·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 1875US10910381B2Multicolor approach to DRAM STI active cut patterningAPPLIED MATERIALS INC·Filed 2019·Granted Feb 2, 2021·1 cites·19 claims
- 1975US2025279319A1Two-dimension self-aligned scheme with subtractive metal etchAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2074US11638374B2Multicolor approach to DRAM STI active cut patterningAPPLIED MATERIALS INC·Filed 2022·Granted Apr 25, 2023·0 cites·10 claims
- 2174US2024145245A1Aluminum oxide carbon hybrid hardmasks and methods for making the sameAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2274US2024142870A1Aluminum oxide carbon hybrid hardmasks and methods for making the sameAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2374US2024142869A1Aluminum oxide carbon hybrid hardmasks and methods for making the sameAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2472US12327764B2Two-dimension self-aligned scheme with subtractive metal etchAPPLIED MATERIALS INC·Filed 2022·Granted Jun 10, 2025·0 cites·17 claims
- 2572US8723185B2Reducing wafer distortion through a high CTE layerCHEN CHI-MING·Filed 2010·Granted May 13, 2014·2 cites·19 claims
- 2672US2025226235A1Tin oxide and tin carbide materials for semiconductor patterning applicationsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2771US12272564B2Tin oxide and tin carbide materials for semiconductor patterning applicationsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 8, 2025·0 cites·8 claims
- 2870US11335690B2Multicolor approach to DRAM STI active cut patterningAPPLIED MATERIALS INC·Filed 2021·Granted May 17, 2022·0 cites·10 claims
- 2970US8791504B2Substrate breakdown voltage improvement for group III-nitride on a silicon substrateCHEN CHI-MING·Filed 2011·Granted Jul 29, 2014·2 cites·20 claims
- 3069US10699953B2Method for creating a fully self-aligned viaMICROMATERIALS LLC·Filed 2019·Granted Jun 30, 2020·1 cites·20 claims
- 3169US9123671B2Silicon wafer strength enhancementCHEN CHI-MING·Filed 2010·Granted Sep 1, 2015·2 cites·19 claims
- 3268US10840138B2Selectively etched self-aligned via processesAPPLIED MATERIALS INC·Filed 2018·Granted Nov 17, 2020·1 cites·15 claims
- 3367US2022367186A1Patterning scheme to improve euv resist and hard mask selectivityAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3466US12025917B2System and method for supplying and dispensing bubble-free photolithography chemical solutionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 2, 2024·0 cites·20 claims
- 3566US2023045689A1Method of forming interconnect for semiconductor deviceAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3664US11508618B2Multicolor self-aligned contact selective etchAPPLIED MATERIALS INC·Filed 2021·Granted Nov 22, 2022·0 cites·20 claims
- 3763US10522404B2Fully self-aligned viaMICROMATERIALS LLC·Filed 2019·Granted Dec 31, 2019·0 cites·6 claims
- 3863US2022359289A1Fully self-aligned viaMICROMATERIALS LLC·Filed 2022·Application pending·0 cites
- 3963US2012238076A1Method and Apparatus for Forming a III-V Family LayerCHEN CHI-MING·Filed 2012·Application pending·0 cites
- 4062US10410921B2Fully self-aligned viaMICROMATERIALS LLC·Filed 2019·Granted Sep 10, 2019·0 cites·14 claims
- 4162US2020098633A1Fully self-aligned viaZHANG YING·Filed 2019·Application pending·0 cites
- 4261US11204200B2Adaptive baking methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 21, 2021·0 cites·20 claims
- 4361US11164938B2DRAM capacitor moduleMICROMATERIALS LLC·Filed 2020·Granted Nov 2, 2021·0 cites·16 claims
- 4461US2022013624A1DRAM Capacitor ModuleMICROMATERIALS LLC·Filed 2021·Application pending·0 cites
- 4560US11437238B2Patterning scheme to improve EUV resist and hard mask selectivityAPPLIED MATERIALS INC·Filed 2019·Granted Sep 6, 2022·0 cites·18 claims
- 4659US2012149176A1Method and apparatus for forming a iii-v family layerCHEN CHI-MING·Filed 2010·Application pending·0 cites
- 4758US12387927B2Deposition of boron filmsAPPLIED MATERIALS INC·Filed 2021·Granted Aug 12, 2025·0 cites·19 claims
- 4857US10006717B2Adaptive baking system and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 26, 2018·0 cites·19 claims
- 4957US9817315B2System and method for supplying and dispensing bubble-free photolithography chemical solutionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 14, 2017·0 cites·20 claims
- 5057US2023095970A1Methods for treating photoresists with non-metal compoundsAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
Showing the top 50 of 61 patent records by PatentIndex Score.
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