Inventor · disambiguated record
Stephen Jew
Also filed as: JEW STEPHEN · JEW STEPHEN C
15 granted patents·10 pending applications·398 citations·filing 1998–2022
92Inventor score
Top patents by PatentIndex Score
25 records- 0197US6068539AWafer polishing device with movable windowLAM RES CORP·Filed 1998·Granted May 30, 2000·200 cites·35 claims
- 0296US6254459B1Wafer polishing device with movable windowLAM RES CORP·Filed 1999·Granted Jul 3, 2001·143 cites·20 claims
- 0394US9005999B2Temperature control of chemical mechanical polishingXU KUN·Filed 2012·Granted Apr 14, 2015·22 cites·25 claims
- 0483US11077536B2Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Aug 3, 2021·2 cites·8 claims
- 0583US8292691B2Use of pad conditioning in temperature controlled CMPXU KUN·Filed 2008·Granted Oct 23, 2012·9 cites·20 claims
- 0682US10967483B2Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Apr 6, 2021·2 cites·17 claims
- 0780US11986926B2Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2022·Granted May 21, 2024·0 cites·18 claims
- 0874US11806835B2Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 0973US10589397B2Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Mar 17, 2020·1 cites·16 claims
- 1073US2021331288A1Slurry distribution device for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 1171US8694144B2Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishingDUBOUST ALAIN·Filed 2010·Granted Apr 8, 2014·2 cites·13 claims
- 1270US8616935B2Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishingZHANG JIMIN·Filed 2010·Granted Dec 31, 2013·2 cites·20 claims
- 1367US8021211B2Substrate holder with liquid supporting surfaceAPPLIED MATERIALS INC·Filed 2008·Granted Sep 20, 2011·3 cites·15 claims
- 1466US8295967B2Endpoint control of multiple-wafer chemical mechanical polishingZHANG JIMIN·Filed 2008·Granted Oct 23, 2012·3 cites·25 claims
- 1565US11787008B2Chemical mechanical polishing with applied magnetic fieldAPPLIED MATERIALS INC·Filed 2020·Granted Oct 17, 2023·0 cites·18 claims
- 1658US6666755B1Belt wiper for a chemical mechanical planarization systemLAM RES CORP·Filed 2002·Granted Dec 23, 2003·9 cites·18 claims
- 1755US2014222188A1Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 1848US2010279435A1Temperature control of chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 1948US2010120331A1Endpoint control of multiple-wafer chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 2047US2009057264A1High throughput low topography copper cmp processAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 2146US2009061743A1Method of soft pad preparation to reduce removal rate ramp-up effect and to stabilize defect rateJEW STEPHEN·Filed 2008·Application pending·0 cites
- 2245US2014024293A1Control Of Overpolishing Of Multiple Substrates On the Same Platen In Chemical Mechanical PolishingZHANG JIMIN·Filed 2012·Application pending·0 cites
- 2343US2014030956A1Control of polishing of multiple substrates on the same platen in chemical mechanical polishingZHANG JIMIN·Filed 2012·Application pending·0 cites
- 2436US2003060145A1Multi-step polishing system and process of using sameFiled 2001·Application pending·0 cites
- 2532US2011300776A1Tuning of polishing process in multi-carrier head per platen polishing stationMAI DAVID H·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →