Inventor

JOBETTO HIROYASU

JP38 patents

⚠️ This page may combine multiple inventors who share the name “JOBETTO HIROYASU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JOBETTO HIROYASU

CASIO COMPUTER CO LTD

Light emitting device used for display device

Semiconductor device having wiring line and manufacturing method thereof

Semiconductor device having adhesion increasing film to prevent peeling

Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Semiconductor device having adhesion increasing film to prevent peeling

Semiconductor device

Semiconductor device with increased number of external connection electrodes

Semiconductor device having conducting portion of upper and lower conductive layers

Semiconductor device and method of manufacturing the same

Semiconductor device having heat dissipation layer

Semiconductor package and method of fabricating the same

Semiconductor device and method of manufacturing the same

Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein

Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Optical sensor module with semiconductor device for drive

Semiconductor device including semiconductor constituent and manufacturing method thereof

ZnS dielectric thin film and magnetic recording medium

Semiconductor device with no base member and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor package, including connected upper and lower interconnections

Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion

Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device having wiring line and manufacturing method thereof

Semiconductor device including wiring and manufacturing method thereof

JOBETTO HIROYASU

Semiconductor device including semiconductor constituent

Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same

Semiconductor device and method for manufacturing the same

NIPPON CMK KK

Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion

Semiconductor device and method of manufacturing the same

WAKISAKA SHINJI

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof