Inventor · disambiguated record
Il Kwon Shim
Also filed as: SHIM IL K · SHIM IL KWON
211 granted patents·30 pending applications·5,307 citations·filing 1994–2024
99Inventor score
Files withSTATS CHIPPAC LTD84STATS CHIPPAC PTE LTD31UTAC HEADQUARTERS PTE LTD25SHIM IL KWON20ST ASSEMBLY TEST SERVICES LTD19
Top patents by PatentIndex Score
241 records- 0199US8039303B2Method of forming stress relief layer between die and interconnect structureSTATS CHIPPAC LTD·Filed 2009·Granted Oct 18, 2011·110 cites·25 claims
- 0299US7364945B2Method of mounting an integrated circuit package in an encapsulant cavitySTATS CHIPPAC LTD·Filed 2006·Granted Apr 29, 2008·100 cites·13 claims
- 0399US6861288B2Stacked semiconductor packages and method for the fabrication thereofST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Mar 1, 2005·308 cites·8 claims
- 0498US9059186B2Embedded semiconductor die package and method of making the same using metal frame carrierSTATS CHIPPAC LTD·Filed 2014·Granted Jun 16, 2015·41 cites·25 claims
- 0598US8354304B2Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulantSTATS CHIPPAC LTD·Filed 2008·Granted Jan 15, 2013·69 cites·25 claims
- 0698US7923295B2Semiconductor device and method of forming the device using sacrificial carrierSTATS CHIPPAC LTD·Filed 2009·Granted Apr 12, 2011·55 cites·14 claims
- 0798US7838337B2Semiconductor device and method of forming an interposer package with through silicon viasSTATS CHIPPAC LTD·Filed 2008·Granted Nov 23, 2010·166 cites·20 claims
- 0898US7435619B2Method of fabricating a 3-D package stacking systemSTATS CHIPPAC LTD·Filed 2006·Granted Oct 14, 2008·75 cites·20 claims
- 0998US7429787B2Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sidesSTATS CHIPPAC LTD·Filed 2006·Granted Sep 30, 2008·88 cites·17 claims
- 1098US7372141B2Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sidesSTATS CHIPPAC LTD·Filed 2006·Granted May 13, 2008·109 cites·24 claims
- 1198US6531784B1Semiconductor package with spacer stripsAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 11, 2003·299 cites·37 claims
- 1297US8993377B2Semiconductor device and method of bonding different size semiconductor die at the wafer levelKOO JUN MO·Filed 2011·Granted Mar 31, 2015·70 cites·28 claims
- 1397US8685792B2Integrated circuit package system with interposerCHOW SENG GUAN·Filed 2008·Granted Apr 1, 2014·52 cites·10 claims
- 1497US8354746B2Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulantSTATS CHIPPAC LTD·Filed 2011·Granted Jan 15, 2013·34 cites·26 claims
- 1597US8309397B2Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereofSHIM IL KWON·Filed 2011·Granted Nov 13, 2012·26 cites·10 claims
- 1697US8263439B2Semiconductor device and method of forming an interposer package with through silicon viasMARIMUTHU PANDI CHELVAM·Filed 2010·Granted Sep 11, 2012·91 cites·31 claims
- 1797US8072059B2Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor dieSHIM IL KWON·Filed 2009·Granted Dec 6, 2011·54 cites·25 claims
- 1897US7842542B2Embedded semiconductor die package and method of making the same using metal frame carrierSTATS CHIPPAC LTD·Filed 2008·Granted Nov 30, 2010·36 cites·33 claims
- 1997US7767496B2Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layerSTATS CHIPPAC LTD·Filed 2007·Granted Aug 3, 2010·46 cites·19 claims
- 2097US7598606B2Integrated circuit package system with die and package combinationSTATS CHIPPAC LTD·Filed 2005·Granted Oct 6, 2009·87 cites·13 claims
- 2197US7399658B2Pre-molded leadframe and method thereforSTATS CHIPPAC LTD·Filed 2006·Granted Jul 15, 2008·80 cites·20 claims
- 2297US6683377B1Multi-stacked memory packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 27, 2004·214 cites·19 claims
- 2396US11024561B2Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect unitsSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 1, 2021·3 cites·25 claims
- 2496US10049964B2Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect unitsSTATS CHIPPAC LTD·Filed 2013·Granted Aug 14, 2018·21 cites·22 claims
- 2596US7309913B2Stacked semiconductor packagesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 18, 2007·94 cites·8 claims
- 2696US6798049B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 28, 2004·125 cites·30 claims
- 2796US6599779B2PBGA substrate for anchoring heat sinkST ASSEMBLY TEST SERVICE LTD·Filed 2001·Granted Jul 29, 2003·130 cites·11 claims
- 2895US10388637B2Semiconductor device and method of forming a 3D interposer system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2017·Granted Aug 20, 2019·8 cites·24 claims
- 2995US8034661B2Semiconductor device and method of forming compliant stress relief buffer around large array WLCSPSTATS CHIPPAC LTD·Filed 2009·Granted Oct 11, 2011·21 cites·24 claims
- 3095US7005325B2Semiconductor package with passive device integrationST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 28, 2006·99 cites·10 claims
- 3194US10453785B2Semiconductor device and method of forming double-sided fan-out wafer level packageSTATS CHIPPAC LTD·Filed 2015·Granted Oct 22, 2019·14 cites·25 claims
- 3294US9704824B2Semiconductor device and method of forming embedded wafer level chip scale packagesSTATS CHIPPAC LTD·Filed 2013·Granted Jul 11, 2017·10 cites·5 claims
- 3394US8846454B2Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layerSHIM IL KWON·Filed 2012·Granted Sep 30, 2014·13 cites·28 claims
- 3494US8643163B2Integrated circuit package-on-package stacking system and method of manufacture thereofSHIM IL KWON·Filed 2009·Granted Feb 4, 2014·35 cites·20 claims
- 3594US8456002B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefLIN YAOJIAN·Filed 2011·Granted Jun 4, 2013·13 cites·25 claims
- 3694US8178392B2Electronic system with expansion featureCHOI HAENGCHEOL·Filed 2007·Granted May 15, 2012·45 cites·20 claims
- 3794US7400049B2Integrated circuit package system with heat sinkSTATS CHIPPAC LTD·Filed 2006·Granted Jul 15, 2008·34 cites·12 claims
- 3894US6534859B1Semiconductor package having heat sink attached to pre-molded cavities and method for creating the packageST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Mar 18, 2003·118 cites·63 claims
- 3993US11488933B2Semiconductor device and method of forming embedded wafer level chip scale packagesSTATS CHIPPAC PTE LTD·Filed 2020·Granted Nov 1, 2022·2 cites·24 claims
- 4093US9704780B2Semiconductor device and method of forming low profile fan-out package with vertical interconnection unitsSTATS CHIPPAC LTD·Filed 2013·Granted Jul 11, 2017·14 cites·29 claims
- 4193US7250685B2Etched leadframe flipchip package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 31, 2007·25 cites·20 claims
- 4293US7211900B2Thin semiconductor package including stacked diesAMKOR TECHNOLOGY INC·Filed 2005·Granted May 1, 2007·26 cites·20 claims
- 4393US7148086B2Semiconductor package with controlled solder bump wetting and fabrication method thereforSTATS CHIPPAC LTD·Filed 2005·Granted Dec 12, 2006·27 cites·10 claims
- 4493US6775140B2Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devicesST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Aug 10, 2004·79 cites·24 claims
- 4593US6414396B1Package for stacked integrated circuitsAMKOR TECHNOLOGY INC·Filed 2000·Granted Jul 2, 2002·85 cites·23 claims
- 4692US10804217B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2019·Granted Oct 13, 2020·6 cites·22 claims
- 4792US9978665B2Semiconductor device and method of forming low profile fan-out package with vertical interconnection unitsSTATS CHIPPAC PTE LTD·Filed 2017·Granted May 22, 2018·7 cites·25 claims
- 4892US9754897B2Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuitsSTATS CHIPPAC LTD·Filed 2015·Granted Sep 5, 2017·8 cites·20 claims
- 4992US9202769B2Semiconductor device and method of forming thermal lid for balancing warpage and thermal managementSTATS CHIPPAC LTD·Filed 2014·Granted Dec 1, 2015·12 cites·21 claims
- 5092US7993941B2Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulantSTATS CHIPPAC LTD·Filed 2008·Granted Aug 9, 2011·20 cites·27 claims
Showing the top 50 of 241 patent records by PatentIndex Score.
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