Inventor · disambiguated record
Vijay Wakharkar
Also filed as: WAKHARKAR VIJAY · WAKHARKAR VIJAY S
13 granted patents·8 pending applications·114 citations·filing 2002–2022
91Inventor score
Top patents by PatentIndex Score
21 records- 0193US6724091B1Flip-chip system and method of making sameINTEL CORP·Filed 2002·Granted Apr 20, 2004·38 cites·24 claims
- 0292US7332807B2Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing sameINTEL CORP·Filed 2005·Granted Feb 19, 2008·26 cites·19 claims
- 0382US7183139B2Flip-chip system and method of making sameINTEL CORP·Filed 2004·Granted Feb 27, 2007·15 cites·22 claims
- 0480US7927925B2Electronic packages with fine particle wetting and non-wetting zonesINTEL CORP·Filed 2010·Granted Apr 19, 2011·5 cites·7 claims
- 0572US7619318B2No-flow underfill composition and methodINTEL CORP·Filed 2005·Granted Nov 17, 2009·4 cites·13 claims
- 0671US7952212B2Applications of smart polymer composites to integrated circuit packagingINTEL CORP·Filed 2006·Granted May 31, 2011·5 cites·12 claims
- 0770US6982492B2No-flow underfill composition and methodINTEL CORP·Filed 2003·Granted Jan 3, 2006·14 cites·12 claims
- 0869US8018073B2Electronic packages with fine particle wetting and non-wetting zonesINTEL CORP·Filed 2011·Granted Sep 13, 2011·2 cites·5 claims
- 0967US7776657B2Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing sameINTEL CORP·Filed 2007·Granted Aug 17, 2010·3 cites·10 claims
- 1066US2014231265A1Electronic Packages and Components Thereof Formed by Co-Deposited Carbon NanotubesWAKHARKAR VIJAY S·Filed 2014·Application pending·0 cites
- 1160US7579046B2Smart curing with a catalyst-functionalized surfaceINTEL CORP·Filed 2005·Granted Aug 25, 2009·2 cites·18 claims
- 1258US12428292B2Waterproof mems pressure sensor package with a metal lid and an embedded ePTFE filter and process of makingINVENSENSE INC·Filed 2022·Granted Sep 30, 2025·0 cites·27 claims
- 1351US2008131658A1Electronic packages and components thereof formed by co-deposited carbon nanotubesWAKHARKAR VIJAY·Filed 2006·Application pending·0 cites
- 1446US2008067502A1Electronic packages with fine particle wetting and non-wetting zonesCHAKRAPANI NIRUPAMA·Filed 2006·Application pending·0 cites
- 1545US8304065B2Treatment for a microelectronic device and method of resisting damage to a microelectronic device using sameARANA LEONEL·Filed 2009·Granted Nov 6, 2012·0 cites·11 claims
- 1644US7759780B2Microelectronic package with wear resistant coatingINTEL CORP·Filed 2008·Granted Jul 20, 2010·0 cites·17 claims
- 1740US2007152325A1Chip package dielectric sheet for body-biasingINTEL CORP·Filed 2005·Application pending·0 cites
- 1839US2020031661A1Liquid proof pressure sensorINVENSENSE INC·Filed 2019·Application pending·0 cites
- 1937US2004262728A1Modular device assembliesFiled 2003·Application pending·0 cites
- 2037US2008237841A1Microelectronic package, method of manufacturing same, and system including sameARANA LEONEL R·Filed 2007·Application pending·0 cites
- 2137US2005068757A1Stress compensation layer systems for improved second level solder joint reliabilityFiled 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →