Inventor · disambiguated record
Ching-Hong Jiang
Also filed as: JIANG CHING-HONG
14 granted patents·2 pending applications·2,251 citations·filing 2011–2022
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10HUANG GIN-CHEN2TAIWAN SEMICONDUCTOR MFG2LIAO CHIN-I1UNITED MICROELECTRONICS CORP1
Top patents by PatentIndex Score
16 records- 0198US9502265B1Vertical gate all around (VGAA) transistors and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·938 cites·20 claims
- 0298US9093530B2Fin structure of FinFETTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 28, 2015·1.3k cites·20 claims
- 0386US10160091B2CMP polishing head design for improving removal rate uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·2 cites·20 claims
- 0485US9870956B2FinFETs with nitride liners and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·4 cites·19 claims
- 0584US11865666B2CMP polishing head design for improving removal rate uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 0682US11529712B2CMP polishing head design for improving removal rate uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 20, 2022·1 cites·17 claims
- 0778US10333001B2Fin structure of FinFETTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 25, 2019·1 cites·20 claims
- 0875US9929272B2Fin structure of FinFETTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 27, 2018·1 cites·20 claims
- 0975US9006802B2Semiconductor device manufacturing methods and methods of forming insulating material layersHUANG GIN-CHEN·Filed 2011·Granted Apr 14, 2015·3 cites·20 claims
- 1072US9443964B2Fin structure of FinFetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 13, 2016·1 cites·20 claims
- 1152US9607826B2Semiconductor device manufacturing methods and methods of forming insulating material layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 28, 2017·0 cites·20 claims
- 1251US2013264585A1Semiconductor device with stress-providing structureUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1350US8481391B2Process for manufacturing stress-providing structure and semiconductor device with such stress-providing structureLIAO CHIN-I·Filed 2011·Granted Jul 9, 2013·0 cites·11 claims
- 1450US2014374838A1FinFETs with Nitride Liners and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
- 1547US9543417B2High mobility devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 10, 2017·0 cites·20 claims
- 1641US8853052B2Method of manufacturing a semiconductor deviceHUANG GIN-CHEN·Filed 2011·Granted Oct 7, 2014·0 cites·19 claims
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