Inventor · disambiguated record
Ronald Patrick Huemoeller
Also filed as: HUEMOELLER RONALD · HUEMOELLER RONALD P · HUEMOELLER RONALD PATRICK
164 granted patents·11 pending applications·5,387 citations·filing 1999–2025
99Inventor score
Files withAMKOR TECHNOLOGY INC111AMKOR TECH SINGAPORE HOLDING PTE LTD28HUEMOELLER RONALD PATRICK14HINER DAVID JON7APPLIED MATERIALS INC5
Top patents by PatentIndex Score
175 records- 0199US9406645B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 2, 2016·40 cites·14 claims
- 0299US8710649B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 29, 2014·47 cites·20 claims
- 0399US7932170B1Flip chip bump structure and fabrication methodAMKOR TECHNOLOGY INC·Filed 2008·Granted Apr 26, 2011·197 cites·16 claims
- 0499US7932595B1Electronic component package comprising fan-out tracesAMKOR TECHNOLOGY INC·Filed 2010·Granted Apr 26, 2011·66 cites·18 claims
- 0599US7842541B1Ultra thin package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2008·Granted Nov 30, 2010·169 cites·19 claims
- 0699US7714431B1Electronic component package comprising fan-out and fan-in tracesAMKOR TECHNOLOGY INC·Filed 2006·Granted May 11, 2010·98 cites·20 claims
- 0799US7671457B1Semiconductor package including top-surface terminals for mounting another semiconductor packageAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 2, 2010·233 cites·12 claims
- 0899US7633765B1Semiconductor package including a top-surface metal layer for implementing circuit featuresAMKOR TECHNOLOGY INC·Filed 2005·Granted Dec 15, 2009·387 cites·23 claims
- 0999US7548430B1Buildup dielectric and metallization process and semiconductor packageAMKOR TECHNOLOGY INC·Filed 2006·Granted Jun 16, 2009·202 cites·19 claims
- 1099US7192807B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2005·Granted Mar 20, 2007·139 cites·18 claims
- 1199US7185426B1Method of manufacturing a semiconductor packageAMKOR TECHNOLOGY INC·Filed 2004·Granted Mar 6, 2007·395 cites·20 claims
- 1299US6930256B1Integrated circuit substrate having laser-embedded conductive patterns and method thereforAMKOR TECHNOLOGY INC·Filed 2002·Granted Aug 16, 2005·235 cites·22 claims
- 1398US11424155B2Semiconductor device package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
- 1498US10074630B2Semiconductor package with high routing density patchAMKOR TECHNOLOGY INC·Filed 2015·Granted Sep 11, 2018·27 cites·20 claims
- 1598US9653428B1Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted May 16, 2017·132 cites·20 claims
- 1698US9543242B1Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 10, 2017·73 cites·20 claims
- 1798US8341835B1Buildup dielectric layer having metallization pattern semiconductor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2009·Granted Jan 1, 2013·71 cites·20 claims
- 1898US7572681B1Embedded electronic component packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Aug 11, 2009·103 cites·19 claims
- 1998US7361533B1Stacked embedded leadframeAMKOR TECHNOLOGY INC·Filed 2005·Granted Apr 22, 2008·96 cites·20 claims
- 2098US7334326B1Method for making an integrated circuit substrate having embedded passive componentsAMKOR TECHNOLOGY INC·Filed 2005·Granted Feb 26, 2008·68 cites·19 claims
- 2198US7297562B1Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patternsAMKOR TECHNOLOGY INC·Filed 2005·Granted Nov 20, 2007·42 cites·22 claims
- 2298US6905914B1Wafer level package and fabrication methodAMKOR TECHNOLOGY INC·Filed 2002·Granted Jun 14, 2005·117 cites·22 claims
- 2397US11901335B2Semiconductor package with routing patch and conductive interconnection structures laterally displaced from routing patchAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Feb 13, 2024·2 cites·18 claims
- 2497US10256114B2Semiconductor device with tiered pillar and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Apr 9, 2019·16 cites·16 claims
- 2597US9349681B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted May 24, 2016·16 cites·20 claims
- 2697US8432022B1Shielded embedded electronic component substrate fabrication method and structureHUEMOELLER RONALD PATRICK·Filed 2009·Granted Apr 30, 2013·65 cites·16 claims
- 2797US8026587B1Semiconductor package including top-surface terminals for mounting another semiconductor packageAMKOR TECHNOLOGY INC·Filed 2010·Granted Sep 27, 2011·24 cites·17 claims
- 2897US8018068B1Semiconductor package including a top-surface metal layer for implementing circuit featuresAMKOR TECHNOLOGY INC·Filed 2009·Granted Sep 13, 2011·47 cites·10 claims
- 2997US7692286B1Two-sided fan-out wafer escape packageAMKOR TECHNOLOGY INC·Filed 2008·Granted Apr 6, 2010·68 cites·20 claims
- 3097US7632753B1Wafer level package utilizing laser-activated dielectric materialAMKOR TECHNOLOGY INC·Filed 2007·Granted Dec 15, 2009·55 cites·25 claims
- 3197US7420272B1Two-sided wafer escape packageAMKOR TECHNOLOGY INC·Filed 2007·Granted Sep 2, 2008·76 cites·20 claims
- 3297US7247523B1Two-sided wafer escape packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Jul 24, 2007·81 cites·12 claims
- 3397US6507102B2Printed circuit board with integral heat sink for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Jan 14, 2003·142 cites·19 claims
- 3496US11289451B2Semiconductor package with high routing density patchAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Mar 29, 2022·3 cites·22 claims
- 3596US10192816B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jan 29, 2019·15 cites·18 claims
- 3696US9966300B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted May 8, 2018·13 cites·20 claims
- 3796US8653674B1Electronic component package fabrication method and structureDARVEAUX ROBERT FRANCIS·Filed 2011·Granted Feb 18, 2014·28 cites·20 claims
- 3896US8298866B1Wafer level package and fabrication methodHUEMOELLER RONALD PATRICK·Filed 2012·Granted Oct 30, 2012·16 cites·20 claims
- 3996US8188584B1Direct-write wafer level chip scale packageBERRY CHRISTOPHER JOHN·Filed 2010·Granted May 29, 2012·41 cites·7 claims
- 4096US8119455B1Wafer level package fabrication methodHUEMOELLER RONALD PATRICK·Filed 2011·Granted Feb 21, 2012·15 cites·19 claims
- 4196US8110909B1Semiconductor package including top-surface terminals for mounting another semiconductor packageHINER DAVID JON·Filed 2010·Granted Feb 7, 2012·20 cites·16 claims
- 4296US7977163B1Embedded electronic component package fabrication methodAMKOR TECHNOLOGY INC·Filed 2009·Granted Jul 12, 2011·36 cites·18 claims
- 4396US7028400B1Integrated circuit substrate having laser-exposed terminalsAMKOR TECHNOLOGY INC·Filed 2003·Granted Apr 18, 2006·79 cites·20 claims
- 4496US6534391B1Semiconductor package having substrate with laser-formed aperture through solder mask layerAMKOR TECHNOLOGY INC·Filed 2001·Granted Mar 18, 2003·135 cites·27 claims
- 4595US10283400B1Semiconductor device package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted May 7, 2019·11 cites·20 claims
- 4695US8987050B1Method and system for backside dielectric patterning for wafer warpage and stress controlHINER DAVID JON·Filed 2012·Granted Mar 24, 2015·16 cites·26 claims
- 4795US8390130B1Through via recessed reveal structure and methodHINER DAVID JON·Filed 2011·Granted Mar 5, 2013·19 cites·17 claims
- 4895US7752752B1Method of fabricating an embedded circuit patternAMKOR TECHNOLOGY INC·Filed 2007·Granted Jul 13, 2010·34 cites·13 claims
- 4995US7723210B2Direct-write wafer level chip scale packageAMKOR TECHNOLOGY INC·Filed 2007·Granted May 25, 2010·32 cites·14 claims
- 5094US11652038B2Semiconductor package with front side and back side redistribution structures and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted May 16, 2023·2 cites·20 claims
Showing the top 50 of 175 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →