Inventor · disambiguated record
Timothy Antesberger
Also filed as: ANTESBERGER TIMOTHY · ANTESBERGER TIMOTHY E · ANTESBERGER TIMOTHY EUGENE
14 granted patents·2 pending applications·32 citations·filing 2003–2020
88Inventor score
Files withENDICOTT INTERCONNECT TECH INC5CORNING INC4MARKOVICH VOYA3ANTESBERGER TIMOTHY2ENDICOTT INTERNAT TECHNOLOGIES1
Top patents by PatentIndex Score
16 records- 0187US8198551B2Power core for use in circuitized substrate and method of making sameJAPP ROBERT M·Filed 2010·Granted Jun 12, 2012·9 cites·29 claims
- 0274US8541687B2Coreless layer buildup structureMARKOVICH VOYA·Filed 2010·Granted Sep 24, 2013·3 cites·18 claims
- 0372US8405229B2Electronic package including high density interposer and circuitized substrate assembly utilizing sameANTESBERGER TIMOTHY·Filed 2009·Granted Mar 26, 2013·6 cites·15 claims
- 0468US8536459B2Coreless layer buildup structure with LGAMARKOVICH VOYA·Filed 2010·Granted Sep 17, 2013·2 cites·18 claims
- 0567US8245392B2Method of making high density interposer and electronic package utilizing sameANTESBERGER TIMOTHY·Filed 2009·Granted Aug 21, 2012·4 cites·20 claims
- 0664US7163847B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jan 16, 2007·2 cites·16 claims
- 0756US11833604B2Method of preparing an electrode for use in forming a honeycomb extrusion dieCORNING INC·Filed 2020·Granted Dec 5, 2023·0 cites·17 claims
- 0853US12377594B2System for manufacturing of honeycomb extrusion dies and manufacturing methods thereofCORNING INC·Filed 2020·Granted Aug 5, 2025·0 cites·18 claims
- 0950US7084014B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Aug 1, 2006·3 cites·7 claims
- 1048US12122066B2Extrusion dies and methods of manufacturing the sameCORNING INC·Filed 2020·Granted Oct 22, 2024·0 cites·5 claims
- 1148US7091066B2Method of making circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Aug 15, 2006·0 cites·24 claims
- 1246US10611051B2Systems and methods for skinning articlesCORNING INC·Filed 2014·Granted Apr 7, 2020·0 cites·18 claims
- 1345US2005224167A1Material separation to form segmented productENDICOTT INTERCONNECT TECH INC·Filed 2005·Application pending·0 cites
- 1443US9351408B2Coreless layer buildup structure with LGA and joining layerMARKOVICH VOYA·Filed 2010·Granted May 24, 2016·0 cites·27 claims
- 1543US6958106B2Material separation to form segmented productENDICOTT INTERNAT TECHNOLOGIES·Filed 2003·Granted Oct 25, 2005·3 cites·31 claims
- 1639US2013025839A1Thermal substrateENDICOTT INTERCONNECT TECH INC·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →