Inventor · disambiguated record
Ajit Balakrishna
Also filed as: BALAKRISHNA AJIT
39 granted patents·16 pending applications·876 citations·filing 1999–2024
98Inventor score
Top patents by PatentIndex Score
55 records- 0198US10580620B2Symmetric plasma process chamberAPPLIED MATERIALS INC·Filed 2016·Granted Mar 3, 2020·38 cites·17 claims
- 0298US10546728B2Symmetric plasma process chamberAPPLIED MATERIALS INC·Filed 2016·Granted Jan 28, 2020·39 cites·11 claims
- 0398US10535502B2Symmetric plasma process chamberAPPLIED MATERIALS INC·Filed 2016·Granted Jan 14, 2020·35 cites·14 claims
- 0498US10453656B2Symmetric plasma process chamberAPPLIED MATERIALS INC·Filed 2016·Granted Oct 22, 2019·36 cites·15 claims
- 0598US9741546B2Symmetric plasma process chamberAPPLIED MATERIALS INC·Filed 2012·Granted Aug 22, 2017·385 cites·17 claims
- 0696US8118938B2Lower liner with integrated flow equalizer and improved conductanceCARDUCCI JAMES D·Filed 2011·Granted Feb 21, 2012·26 cites·10 claims
- 0795US7987814B2Lower liner with integrated flow equalizer and improved conductanceAPPLIED MATERIALS INC·Filed 2008·Granted Aug 2, 2011·26 cites·14 claims
- 0894US9745663B2Symmetrical inductively coupled plasma source with symmetrical flow chamberAPPLIED MATERIALS INC·Filed 2012·Granted Aug 29, 2017·8 cites·18 claims
- 0994US8282736B2Lower liner with integrated flow equalizer and improved conductanceCARDUCCI JAMES D·Filed 2012·Granted Oct 9, 2012·14 cites·10 claims
- 1092US8075728B2Gas flow equalizer plate suitable for use in a substrate process chamberBALAKRISHNA AJIT·Filed 2008·Granted Dec 13, 2011·28 cites·9 claims
- 1191US6215106B1Thermally processing a substrateAPPLIED MATERIALS INC·Filed 1999·Granted Apr 10, 2001·87 cites·23 claims
- 1290US7967996B2Process for wafer backside polymer removal and wafer front side photoresist removalAPPLIED MATERIALS INC·Filed 2007·Granted Jun 28, 2011·16 cites·20 claims
- 1389US8440019B2Lower liner with integrated flow equalizer and improved conductanceCARDUCCI JAMES D·Filed 2012·Granted May 14, 2013·7 cites·15 claims
- 1489US7879183B2Apparatus and method for front side protection during backside cleaningAPPLIED MATERIALS INC·Filed 2008·Granted Feb 1, 2011·13 cites·25 claims
- 1588US9761416B2Apparatus and methods for reducing particles in semiconductor process chambersAPPLIED MATERIALS INC·Filed 2014·Granted Sep 12, 2017·7 cites·2 claims
- 1686US10131994B2Inductively coupled plasma source with top coil over a ceiling and an independent side coil and independent air flowAPPLIED MATERIALS INC·Filed 2012·Granted Nov 20, 2018·4 cites·13 claims
- 1786US9909213B2Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactorsAPPLIED MATERIALS INC·Filed 2014·Granted Mar 6, 2018·3 cites·19 claims
- 1886US9896769B2Inductively coupled plasma source with multiple dielectric windows and window-supporting structureAPPLIED MATERIALS INC·Filed 2012·Granted Feb 20, 2018·4 cites·15 claims
- 1986US8329593B2Method and apparatus for removing polymer from the wafer backside and edgeYOUSIF IMAD·Filed 2007·Granted Dec 11, 2012·14 cites·17 claims
- 2086US7569463B2Method of thermal processing structures formed on a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Aug 4, 2009·9 cites·25 claims
- 2184US11315760B2Symmetric plasma process chamberAPPLIED MATERIALS INC·Filed 2020·Granted Apr 26, 2022·1 cites·20 claims
- 2284US7552736B2Process for wafer backside polymer removal with a ring of plasma under the waferAPPLIED MATERIALS INC·Filed 2007·Granted Jun 30, 2009·9 cites·10 claims
- 2381US10615006B2Symmetric plasma process chamberAPPLIED MATERIALS INC·Filed 2017·Granted Apr 7, 2020·1 cites·20 claims
- 2481US6803546B1Thermally processing a substrateAPPLIED MATERIALS INC·Filed 2000·Granted Oct 12, 2004·25 cites·33 claims
- 2580US8980760B2Methods and apparatus for controlling plasma in a process chamberAGARWAL ANKUR·Filed 2012·Granted Mar 17, 2015·7 cites·20 claims
- 2680US7041931B2Stepped reflector plateAPPLIED MATERIALS INC·Filed 2002·Granted May 9, 2006·24 cites·32 claims
- 2778US11693053B2Bode fingerprinting for characterizations and failure detections in processing chamberAPPLIED MATERIALS INC·Filed 2022·Granted Jul 4, 2023·0 cites·20 claims
- 2877US10612135B2Method and system for high temperature cleanAPPLIED MATERIALS INC·Filed 2017·Granted Apr 7, 2020·2 cites·20 claims
- 2975US8398814B2Tunable gas flow equalizerBALAKRISHNA AJIT·Filed 2009·Granted Mar 19, 2013·2 cites·20 claims
- 3074US11894220B2Method and apparatus for controlling a processing reactorAPPLIED MATERIALS INC·Filed 2019·Granted Feb 6, 2024·2 cites·6 claims
- 3172US8895889B2Methods and apparatus for rapidly responsive heat control in plasma processing devicesAPPLIED MATERIALS INC·Filed 2013·Granted Nov 25, 2014·2 cites·8 claims
- 3271US9269546B2Plasma reactor with electron beam plasma source having a uniform magnetic fieldAPPLIED MATERIALS INC·Filed 2013·Granted Feb 23, 2016·2 cites·17 claims
- 3369US11486927B2Bode fingerprinting for characterizations and failure detections in processing chamberAPPLIED MATERIALS INC·Filed 2020·Granted Nov 1, 2022·0 cites·21 claims
- 3468US10770269B2Apparatus and methods for reducing particles in semiconductor process chambersAPPLIED MATERIALS INC·Filed 2017·Granted Sep 8, 2020·0 cites·9 claims
- 3567US2018142354A1Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactorsAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 3666US2019085467A1Plasma Reactor Having Radial Struts for Substrate SupportAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 3763US2017350017A1Symmetrical Inductively Coupled Plasma Source with Symmetrical Flow ChamberAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 3863US2017350018A1Inductively Coupled Plasma Source with Multiple Dielectric Windows and Window Supporting StructureAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 3960US2022084794A1Plasma chamber with a multiphase rotating modulated cross-flowAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4059US2025231547A1Model based development of zone based flow or thermal distribution systemsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4155US9155134B2Methods and apparatus for rapidly responsive heat control in plasma processing devicesZHANG CHUNLEI·Filed 2008·Granted Oct 6, 2015·0 cites·16 claims
- 4255US2025140538A1Model-driven pressure estimationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4353US2009188624A1Method and apparatus for enhancing flow uniformity in a process chamberAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4452US2010081284A1Methods and apparatus for improving flow uniformity in a process chamberAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4551US2009230089A1Electrical control of plasma uniformity using external circuitBERA KALLOL·Filed 2008·Application pending·0 cites
- 4650US2013008604A1Method and apparatus for enhancing flow uniformity in a process chamberAPPLIED MATERIALS INC·Filed 2012·Application pending·0 cites
- 4748US9449796B2Plasma processing system including a symmetrical remote plasma source for minimal ion energyAPPLIED MATERIALS INC·Filed 2014·Granted Sep 20, 2016·0 cites·20 claims
- 4846US11049699B2Gas box for CVD chamberAPPLIED MATERIALS INC·Filed 2019·Granted Jun 29, 2021·0 cites·16 claims
- 4946US2011120505A1Apparatus and method for front side protection during backside cleaningAPPLIED MATERIALS INC·Filed 2011·Application pending·0 cites
- 5044US8894805B2Electron beam plasma source with profiled magnet shield for uniform plasma generationBERA KALLOL·Filed 2012·Granted Nov 25, 2014·0 cites·19 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →