Inventor · disambiguated record
Akhil Singhal
Also filed as: SINGHAL AKHIL · SINGHAL AKHIL N
26 granted patents·13 pending applications·659 citations·filing 2005–2025
95Inventor score
Top patents by PatentIndex Score
39 records- 0198US7214630B1PMOS transistor with compressive dielectric capping layerNOVELLUS SYSTEMS INC·Filed 2005·Granted May 8, 2007·511 cites·34 claims
- 0296US10566186B2Methods of encapsulationLAM RES CORP·Filed 2018·Granted Feb 18, 2020·9 cites·17 claims
- 0396US9773643B1Apparatus and method for deposition and etch in gap fillLAM RES CORP·Filed 2016·Granted Sep 26, 2017·41 cites·19 claims
- 0495US10373806B2Apparatus and method for deposition and etch in gap fillLAM RES CORP·Filed 2017·Granted Aug 6, 2019·17 cites·18 claims
- 0594US10157736B2Methods of encapsulationLAM RES CORP·Filed 2016·Granted Dec 18, 2018·13 cites·22 claims
- 0693US10957514B2Apparatus and method for deposition and etch in gap fillLAM RES CORP·Filed 2019·Granted Mar 23, 2021·4 cites·7 claims
- 0793US10763107B2Methods of encapsulationLAM RES CORP·Filed 2020·Granted Sep 1, 2020·3 cites·20 claims
- 0893US9328416B2Method for the reduction of defectivity in vapor deposited filmsLAM RES CORP·Filed 2014·Granted May 3, 2016·17 cites·22 claims
- 0991US10081869B2Defect control in RF plasma substrate processing systems using DC bias voltage during movement of substratesLAM RES CORP·Filed 2014·Granted Sep 25, 2018·9 cites·20 claims
- 1090US7327001B1PMOS transistor with compressive dielectric capping layerNOVELLUS SYSTEMS INC·Filed 2007·Granted Feb 5, 2008·16 cites·24 claims
- 1186US7998881B1Method for making high stress boron-doped carbon filmsNOVELLUS SYSTEMS INC·Filed 2008·Granted Aug 16, 2011·11 cites·17 claims
- 1284US11670516B2Metal-containing passivation for high aspect ratio etchLAM RES CORP·Filed 2019·Granted Jun 6, 2023·3 cites·20 claims
- 1383US11784229B2Profile shaping for control gate recessesAPPLIED MATERIALS INC·Filed 2020·Granted Oct 10, 2023·1 cites·11 claims
- 1483US11646216B2Systems and methods of seasoning electrostatic chucks with dielectric seasoning filmsAPPLIED MATERIALS INC·Filed 2020·Granted May 9, 2023·1 cites·14 claims
- 1582US10840082B2Method to clean SnO2 film from chamberLAM RES CORP·Filed 2018·Granted Nov 17, 2020·3 cites·15 claims
- 1675US12381106B2Systems and methods of seasoning electrostatic chucks with dielectric seasoning filmsAPPLIED MATERIALS INC·Filed 2023·Granted Aug 5, 2025·0 cites·19 claims
- 1775US12211908B2Profile shaping for control gate recessesAPPLIED MATERIALS INC·Filed 2023·Granted Jan 28, 2025·0 cites·8 claims
- 1868US2025216788A1Bubble defect reductionLAM RES CORP·Filed 2025·Application pending·0 cites
- 1967US11717866B2Etching metal-oxide and protecting chamber componentsLAM RES CORP·Filed 2022·Granted Aug 8, 2023·0 cites·8 claims
- 2064US11887846B2Deposition tool and method for depositing metal oxide films on organic materialsLAM RES CORP·Filed 2020·Granted Jan 30, 2024·0 cites·24 claims
- 2160US12248252B2Bubble defect reductionLAM RES CORP·Filed 2019·Granted Mar 11, 2025·0 cites·7 claims
- 2260US2025369113A1Nested-loop atomic layer deposition with inhibition and/or etchAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2358US11915923B2Method to clean SnO2 film from chamberLAM RES CORP·Filed 2020·Granted Feb 27, 2024·0 cites·14 claims
- 2458US2025046602A1Reactive-ion deposition processes for dielectric material formationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2555US2025357109A1Bottom-up gap fill using non-conformal poisoningAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2654US12315724B2Helium-free silicon formationAPPLIED MATERIALS INC·Filed 2021·Granted May 27, 2025·0 cites·20 claims
- 2754US2024332000A1Doped silicon-containing materials with increased electrical, mechanical, and etch characteristicsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2853US2025372385A1Methods for gap filling vertical and lateral features with plasma inhibitionAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2953US2025329529A1Volumetric expansion deposition of silicon based dielectric filmAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3052US2019390341A1Deposition tool and method for depositing metal oxide films on organic materialsLAM RES CORP·Filed 2018·Application pending·0 cites
- 3150US12372872B2Extreme ultraviolet (EUV) lithography using an intervening layer or a multi-layer stack with varying mean free paths for secondary electron generationLAM RES CORP·Filed 2020·Granted Jul 29, 2025·0 cites·13 claims
- 3249US12371781B2In situ protective coating of chamber components for semiconductor processingLAM RES CORP·Filed 2019·Granted Jul 29, 2025·0 cites·15 claims
- 3349US2023238238A1Advanced self aligned multiple patterning using tin oxideLAM RES CORP·Filed 2021·Application pending·0 cites
- 3449US2021308726A1Etching metal-oxide and protecting chamber componentsLAM RES CORP·Filed 2019·Application pending·0 cites
- 3547US2024096605A1Backside deposition for wafer bow managementAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3645US11031244B2Modification of SNO2 surface for EUV lithographyLAM RES CORP·Filed 2018·Granted Jun 8, 2021·0 cites·19 claims
- 3744US2023038880A1Protective coating for a semiconductor reaction chamberLAM RES CORP·Filed 2020·Application pending·0 cites
- 3840US2019385828A1Temperature control systems and methods for removing metal oxide filmsLAM RES CORP·Filed 2018·Application pending·0 cites
- 3932US9617637B2Systems and methods for improving deposition rate uniformity and reducing defects in substrate processing systemsLAM RES CORP·Filed 2014·Granted Apr 11, 2017·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →