Inventor · disambiguated record
Albert Wu
Also filed as: WU ALBERT · WU ALBERT T · WU ALBERT TAAN
108 granted patents·15 pending applications·1,385 citations·filing 1986–2021
99Inventor score
Top patents by PatentIndex Score
123 records- 0198US9087835B2Structures embedded within core material and methods of manufacturing thereofMARVELL WORLD TRADE LTD·Filed 2013·Granted Jul 21, 2015·43 cites·22 claims
- 0298US8471376B1Integrated circuit packaging configurationsLIOU SHIANN-MING·Filed 2010·Granted Jun 25, 2013·49 cites·19 claims
- 0398US7359261B1Memory repair system and methodMARVELL INT LTD·Filed 2006·Granted Apr 15, 2008·64 cites·27 claims
- 0498US4794565AElectrically programmable memory device employing source side injectionUNIV CALIFORNIA·Filed 1986·Granted Dec 27, 1988·280 cites·2 claims
- 0597US7535110B2Stack die packagesMARVELL WORLD TRADE LTD·Filed 2007·Granted May 19, 2009·63 cites·20 claims
- 0696US9768144B2Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrateMARVELL WORLD TRADE LTD·Filed 2016·Granted Sep 19, 2017·11 cites·19 claims
- 0795US8618654B2Structures embedded within core material and methods of manufacturing thereofSUTARDJA SEHAT·Filed 2011·Granted Dec 31, 2013·19 cites·13 claims
- 0895US7734966B1Method and system for memory testing and test data reporting during memory testingMARVELL INT LTD·Filed 2007·Granted Jun 8, 2010·41 cites·29 claims
- 0994US7751264B1Memory repair system and methodMARVELL INT LTD·Filed 2008·Granted Jul 6, 2010·21 cites·24 claims
- 1091US8030128B1Method to form high density phase change memory (PCM) top contact every two bitsMARVELL INT LTD·Filed 2008·Granted Oct 4, 2011·21 cites·22 claims
- 1190US8423841B1Method and systems for memory testing and test data reporting during memory testingLEE WINSTON·Filed 2011·Granted Apr 16, 2013·10 cites·19 claims
- 1290US8218383B1Memory repair system and methodWU ALBERT·Filed 2011·Granted Jul 10, 2012·9 cites·20 claims
- 1390US7704875B1High-density contact holesMARVELL INT LTD·Filed 2008·Granted Apr 27, 2010·11 cites·22 claims
- 1489US9275929B2Package assembly having a semiconductor substrateMARVELL WORLD TRADE LTD·Filed 2015·Granted Mar 1, 2016·6 cites·20 claims
- 1589US8008137B2Method for fabricating 1T-DRAM on bulk siliconMARVELL WORLD TRADE LTD·Filed 2007·Granted Aug 30, 2011·19 cites·11 claims
- 1689US7892936B1Self aligned integration of high density phase change memory with thin film access deviceMARVELL INT LTD·Filed 2009·Granted Feb 22, 2011·18 cites·12 claims
- 1788US7939445B1High density via and metal interconnect structures, and methods of forming the sameMARVELL INT LTD·Filed 2008·Granted May 10, 2011·17 cites·21 claims
- 1888US7704805B1Fuse structures, methods of making and using the same, and integrated circuits including the sameMARVELL INT LTD·Filed 2008·Granted Apr 27, 2010·12 cites·23 claims
- 1987US7314819B2Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling sameINTEL CORP·Filed 2005·Granted Jan 1, 2008·15 cites·23 claims
- 2086US8999786B1Reducing source contact to gate spacing to decrease transistor pitchWU ALBERT·Filed 2008·Granted Apr 7, 2015·9 cites·20 claims
- 2186US5256594AMasking technique for depositing gallium arsenide on siliconINTEL CORP·Filed 1989·Granted Oct 26, 1993·82 cites·29 claims
- 2285US8884419B1Integrated circuit packaging configurationsMARVELL INT LTD·Filed 2013·Granted Nov 11, 2014·6 cites·20 claims
- 2385US7958413B1Method and system for memory testing and test data reporting during memory testingMARVELL INT LTD·Filed 2010·Granted Jun 7, 2011·7 cites·24 claims
- 2484US8987893B1Heat dissipating interposersMARVELL INT LTD·Filed 2012·Granted Mar 24, 2015·7 cites·14 claims
- 2584US8947909B1System and method for creating a bipolar resistive RAM (RRAM)MARVELL INT LTD·Filed 2013·Granted Feb 3, 2015·7 cites·18 claims
- 2684US7948818B1Memory repair system and methodMARVELL INT LTD·Filed 2010·Granted May 24, 2011·5 cites·15 claims
- 2783US8934285B2Method and apparatus for forming a contact in a cell of a resistive random access memory to reduce a voltage required to program the cellMARVELL WORLD TRADE LTD·Filed 2013·Granted Jan 13, 2015·6 cites·20 claims
- 2883US8030098B1Pre-formed conductive bumps on bonding padsMARVELL INT LTD·Filed 2008·Granted Oct 4, 2011·9 cites·16 claims
- 2983US7820493B1Methods of making and using fuse structures, and integrated circuits including the sameMARVELL INT LTD·Filed 2008·Granted Oct 26, 2010·8 cites·15 claims
- 3082US9659851B2Method and apparatus for improving the reliability of a connection to a via in a substrateMARVELL WORLD TRADE LTD·Filed 2015·Granted May 23, 2017·4 cites·14 claims
- 3182US7745809B1Ultra high density phase change memory having improved emitter contacts, improved GST cell reliability and highly matched UHD GST cells using column mirco-trench stripsMARVELL INT LTD·Filed 2008·Granted Jun 29, 2010·9 cites·19 claims
- 3281US8767491B1Apparatus and method for remapping addresses of defective memory locations to redundant memory locationsMARVELL INT LTD·Filed 2013·Granted Jul 1, 2014·4 cites·13 claims
- 3381US8319353B1Pre-formed conductive bumps on bonding padsLIOU SHIANN-MING·Filed 2011·Granted Nov 27, 2012·5 cites·21 claims
- 3481US7694440B1Insole cushioning device with repelling magnetic fieldWU ALBERT·Filed 2006·Granted Apr 13, 2010·24 cites·20 claims
- 3581US5986934ASemiconductor memory array with buried drain lines and methods thereforWINBOND ELECTRONICS CORP I·Filed 1997·Granted Nov 16, 1999·56 cites·22 claims
- 3680US8368214B2Alpha shielding techniques and configurationsMARVELL WORLD TRADE LTD·Filed 2009·Granted Feb 5, 2013·8 cites·10 claims
- 3779US8796839B1Semiconductor package including a power plane and a ground planeSUTARDJA SEHAT·Filed 2012·Granted Aug 5, 2014·5 cites·6 claims
- 3879US7834341B2Phase change material (PCM) memory devices with bipolar junction transistors and methods for making thereofMARVELL WORLD TRADE LTD·Filed 2008·Granted Nov 16, 2010·9 cites·17 claims
- 3977US9444510B2Method and apparatus for incorporating passive devices in an integrated passive device separate from a dieMARVELL WORLD TRADE LTD·Filed 2015·Granted Sep 13, 2016·3 cites·20 claims
- 4077US7888166B2Method to form high efficiency GST cell using a double heater cutMARVELL WORLD TRADE LTD·Filed 2010·Granted Feb 15, 2011·3 cites·9 claims
- 4176US8462569B1Memory repair system and methodWU ALBERT·Filed 2012·Granted Jun 11, 2013·3 cites·16 claims
- 4276US8338934B2Embedded die with protective interposerWU ALBERT·Filed 2011·Granted Dec 25, 2012·4 cites·19 claims
- 4376US8330477B1Test engine for integrated circuit chip testingWU ALBERT·Filed 2009·Granted Dec 11, 2012·8 cites·13 claims
- 4476US7960831B2Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling sameINTEL CORP·Filed 2007·Granted Jun 14, 2011·7 cites·23 claims
- 4575US8885388B2Apparatus and method for reforming resistive memory cellsMARVELL WORLD TRADE LTD·Filed 2013·Granted Nov 11, 2014·4 cites·21 claims
- 4675US7911053B2Semiconductor packaging with internal wiring busMARVELL WORLD TRADE LTD·Filed 2008·Granted Mar 22, 2011·5 cites·15 claims
- 4774US9257410B2Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrateWU ALBERT·Filed 2011·Granted Feb 9, 2016·2 cites·26 claims
- 4874US9047252B1Method and apparatus for detecting a row or a column of a memory to repair without reporting all corresponding defective memory cellsMARVELL INT LTD·Filed 2014·Granted Jun 2, 2015·3 cites·20 claims
- 4974US8762801B1Method and system for detecting and repairing defective memory cells without reporting a defective memory cellMARVELL INT LTD·Filed 2013·Granted Jun 24, 2014·3 cites·20 claims
- 5074US8518742B1Semiconductor packaging with internal wiring busLIU CHENGLIN·Filed 2011·Granted Aug 27, 2013·3 cites·10 claims
Showing the top 50 of 123 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →