Inventor · disambiguated record
Amir Widmann
Also filed as: WIDMANN AMIR
19 granted patents·243 citations·filing 2003–2020
95Inventor score
Top patents by PatentIndex Score
19 records- 0197US7561282B1Techniques for determining overlay and critical dimension using a single metrology toolKLA TENCOR TECH CORP·Filed 2006·Granted Jul 14, 2009·48 cites·20 claims
- 0296US9116442B2Feedforward/feedback litho process control of stress and overlayADEL MICHAEL·Filed 2011·Granted Aug 25, 2015·18 cites·38 claims
- 0395US8559001B2Inspection guided overlay metrologyCHANG ELLIS·Filed 2011·Granted Oct 15, 2013·35 cites·22 claims
- 0494US8175831B2Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafersIZIKSON PAVEL·Filed 2008·Granted May 8, 2012·42 cites·30 claims
- 0594US8111376B2Feedforward/feedback litho process control of stress and overlayADEL MICHAEL·Filed 2008·Granted Feb 7, 2012·20 cites·33 claims
- 0692US9170209B1Inspection guided overlay metrologyKLA TENCOR CORP·Filed 2013·Granted Oct 27, 2015·11 cites·24 claims
- 0791US9329033B2Method for estimating and correcting misregistration target inaccuracyKLA TENCOR CORP·Filed 2013·Granted May 3, 2016·8 cites·17 claims
- 0886US7925486B2Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layoutKLA TENCOR TECH CORP·Filed 2007·Granted Apr 12, 2011·16 cites·18 claims
- 0983US8655469B2Advanced process control optimizationCHOI DONGSUB·Filed 2011·Granted Feb 18, 2014·4 cites·15 claims
- 1082US8948495B2Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a waferKLA TENCOR CORP·Filed 2013·Granted Feb 3, 2015·8 cites·37 claims
- 1180US10649447B2Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafersKLA TENCOR CORP·Filed 2017·Granted May 12, 2020·2 cites·19 claims
- 1275US8804137B2Unique mark and method to determine critical dimension uniformity and registration of reticles combined with wafer overlay capabilityCHOI DONGSUB·Filed 2010·Granted Aug 12, 2014·4 cites·21 claims
- 1374US9558978B2Material handling with dedicated automated material handling systemWIDMANN AMIR·Filed 2013·Granted Jan 31, 2017·6 cites·6 claims
- 1470US9576861B2Method and system for universal target based inspection and metrologyKLA TENCOR CORP·Filed 2013·Granted Feb 21, 2017·2 cites·25 claims
- 1568US6864458B2Iced film substrate cleaningAPPLIED MATERIALS INC·Filed 2003·Granted Mar 8, 2005·11 cites·18 claims
- 1666US8045786B2Waferless recipe optimizationKLA TENCOR TECH CORP·Filed 2006·Granted Oct 25, 2011·5 cites·31 claims
- 1766US7679069B2Method and system for optimizing alignment performance in a fleet of exposure toolsKLA TENCOR TECH CORP·Filed 2007·Granted Mar 16, 2010·2 cites·35 claims
- 1865US9651943B2Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafersIZIKSON PAVEL·Filed 2012·Granted May 16, 2017·1 cites·16 claims
- 1945US11498189B2WrenchHAM LET ISRAEL — CANADA LTD·Filed 2020·Granted Nov 15, 2022·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →