Inventor · disambiguated record
Andrew John Mckerrow
Also filed as: MCKERROW ANDREW · MCKERROW ANDREW J · MCKERROW ANDREW JOHN
27 granted patents·9 pending applications·1,092 citations·filing 2000–2023
96Inventor score
Files withLAM RES CORP16TEXAS INSTRUMENTS INC11NOVELLUS SYSTEMS INC4GANESAN KOUSIK1SWAMINATHAN SHANKAR1
Top patents by PatentIndex Score
36 records- 0198US10347547B2Suppressing interfacial reactions by varying the wafer temperature throughout depositionLAM RES CORP·Filed 2016·Granted Jul 9, 2019·401 cites·20 claims
- 0298US10043655B2Plasma activated conformal dielectric film depositionNOVELLUS SYSTEMS INC·Filed 2017·Granted Aug 7, 2018·28 cites·20 claims
- 0398US9824884B1Method for depositing metals free ald silicon nitride films using halide-based precursorsLAM RES CORP·Filed 2016·Granted Nov 21, 2017·348 cites·16 claims
- 0498US9570274B2Plasma activated conformal dielectric film depositionNOVELLUS SYSTEMS INC·Filed 2015·Granted Feb 14, 2017·30 cites·11 claims
- 0597US10454029B2Method for reducing the wet etch rate of a sin film without damaging the underlying substrateLAM RES CORP·Filed 2016·Granted Oct 22, 2019·11 cites·22 claims
- 0697US8999859B2Plasma activated conformal dielectric film depositionNOVELLUS SYSTEMS INC·Filed 2013·Granted Apr 7, 2015·56 cites·25 claims
- 0797US8637411B2Plasma activated conformal dielectric film depositionSWAMINATHAN SHANKAR·Filed 2011·Granted Jan 28, 2014·99 cites·44 claims
- 0889US6720247B2Pre-pattern surface modification for low-k dielectrics using A H2 plasmaTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 13, 2004·48 cites·11 claims
- 0984US6838300B2Chemical treatment of low-k dielectric filmsTEXAS INSTRUMENTS INC·Filed 2003·Granted Jan 4, 2005·34 cites·20 claims
- 1081US9502255B2Low-k damage repair and pore sealing agents with photosensitive end groupsLAM RES CORP·Filed 2014·Granted Nov 22, 2016·4 cites·16 claims
- 1175US9816193B2Configuration and method of operation of an electrodeposition system for improved process stability and performanceGANESAN KOUSIK·Filed 2011·Granted Nov 14, 2017·1 cites·16 claims
- 1272US11239420B2Conformal damage-free encapsulation of chalcogenide materialsLAM RES CORP·Filed 2018·Granted Feb 1, 2022·1 cites·17 claims
- 1370US10319582B2Methods and apparatus for depositing silicon oxide on metal layersLAM RES CORP·Filed 2017·Granted Jun 11, 2019·1 cites·18 claims
- 1469US6620560B2Plasma treatment of low-k dielectric films to improve patterningTEXAX INSTR INC·Filed 2001·Granted Sep 16, 2003·13 cites·22 claims
- 1568US7678713B2Energy beam treatment to improve packaging reliabilityTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 16, 2010·4 cites·16 claims
- 1667US10745817B2Configuration and method of operation of an electrodeposition system for improved process stability and performanceNOVELLUS SYSTEMS INC·Filed 2017·Granted Aug 18, 2020·0 cites·19 claims
- 1766US11832533B2Conformal damage-free encapsulation of chalcogenide materialsLAM RES CORP·Filed 2021·Granted Nov 28, 2023·0 cites·15 claims
- 1864US7342315B2Method to increase mechanical fracture robustness of porous low k dielectric materialsTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 11, 2008·2 cites·16 claims
- 1961US11075127B2Suppressing interfacial reactions by varying the wafer temperature throughout depositionLAM RES CORP·Filed 2019·Granted Jul 27, 2021·0 cites·20 claims
- 2056US6831008B2Nickel silicide—silicon nitride adhesion through surface passivationTEXAS INSTRUMENTS INC·Filed 2002·Granted Dec 14, 2004·5 cites·15 claims
- 2155US10020188B2Method for depositing ALD films using halide-based precursorsLAM RES CORP·Filed 2017·Granted Jul 10, 2018·0 cites·18 claims
- 2254US2025197996A1Low-k dielectric protection during plasma deposition of silicon nitrideLAM RES CORP·Filed 2023·Application pending·0 cites
- 2353US2025132127A1Transformer coupled plasma source design for thin dielectric film depositionLAM RES CORP·Filed 2022·Application pending·0 cites
- 2453US2025372367A1Deposition and etch of silicon-containing layerLAM RES CORP·Filed 2023·Application pending·0 cites
- 2550US2025226227A1Deposition of metal-containing films and chamber cleanLAM RES CORP·Filed 2023·Application pending·0 cites
- 2648US12230495B2Method of depositing silicon nitride filmsLAM RES CORP·Filed 2019·Granted Feb 18, 2025·0 cites·17 claims
- 2746US6861348B2Pre-pattern surface modification of low-k dielectricsTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 1, 2005·1 cites·16 claims
- 2846US6806103B1Method for fabricating semiconductor devices that uses efficient plasmasTEXAS INSTRUMENTS INC·Filed 2003·Granted Oct 19, 2004·2 cites·17 claims
- 2945US6872665B1Process flow for dual damescene interconnect structuresTEXAS INSTRUMENTS INC·Filed 2000·Granted Mar 29, 2005·3 cites·8 claims
- 3045US2022235463A1SixNy AS A NUCLEATION LAYER FOR SiCxOyLAM RES CORP·Filed 2020·Application pending·0 cites
- 3142US7087518B2Method of passivating and/or removing contaminants on a low-k dielectric/copper surfaceTEXAS INSTRUMENTS INC·Filed 2003·Granted Aug 8, 2006·0 cites·7 claims
- 3242US2007105368A1Method of fabricating a microelectronic device using electron beam treatment to induce stressTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 3340US2005090087A1Nickel silicide - silicon nitride adhesion through surface passivationFiled 2004·Application pending·0 cites
- 3439US2003170992A1Method of passivating and/or removing contaminants on a low-k dielectric/copper surfaceFiled 2002·Application pending·0 cites
- 3536US10240236B2Clean resistant windows for ultraviolet thermal processingLAM RES CORP·Filed 2015·Granted Mar 26, 2019·0 cites·20 claims
- 3636US2004152296A1Hexamethyldisilazane treatment of low-k dielectric filmsTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →