Inventor · disambiguated record
Arvind Sundarrajan
Also filed as: SUNDARRAJAN ARVIND
61 granted patents·22 pending applications·441 citations·filing 1998–2023
98Inventor score
Top patents by PatentIndex Score
83 records- 0198US10229827B2Method of redistribution layer formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Mar 12, 2019·33 cites·13 claims
- 0298US10211072B2Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Feb 19, 2019·37 cites·17 claims
- 0393US11854886B2Methods of TSV formation for advanced packagingAPPLIED MATERIALS INC·Filed 2022·Granted Dec 26, 2023·2 cites·6 claims
- 0492US8668816B2Self-ionized and inductively-coupled plasma for sputtering and resputteringDING PEIJUN·Filed 2007·Granted Mar 11, 2014·19 cites·16 claims
- 0591US10651126B2Methods and apparatus for wafer-level die bridgeAPPLIED MATERIALS INC·Filed 2017·Granted May 12, 2020·16 cites·10 claims
- 0691US8455352B1Method for removing native oxide and associated residue from a substrateZHENG BO·Filed 2012·Granted Jun 4, 2013·10 cites·20 claims
- 0790US7686926B2Multi-step process for forming a metal barrier in a sputter reactorAPPLIED MATERIALS INC·Filed 2005·Granted Mar 30, 2010·16 cites·11 claims
- 0889US11404318B2Methods of forming through-silicon vias in substrates for advanced packagingAPPLIED MATERIALS INC·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 0989US8747686B2Methods of end point detection for substrate fabrication processesZHENG BO·Filed 2012·Granted Jun 10, 2014·5 cites·24 claims
- 1087US8951913B2Method for removing native oxide and associated residue from a substrateAPPLIED MATERIALS INC·Filed 2014·Granted Feb 10, 2015·5 cites·13 claims
- 1186US10047430B2Self-ionized and inductively-coupled plasma for sputtering and resputteringAPPLIED MATERIALS INC·Filed 2014·Granted Aug 14, 2018·5 cites·22 claims
- 1286US6235163B1Methods and apparatus for ionized metal plasma copper deposition with enhanced in-film particle performanceAPPLIED MATERIALS INC·Filed 1999·Granted May 22, 2001·54 cites·14 claims
- 1385US8772162B2Method for removing native oxide and associated residue from a substrateZHENG BO·Filed 2013·Granted Jul 8, 2014·5 cites·25 claims
- 1481US9362111B2Hermetic CVD-cap with improved step coverage in high aspect ratio structuresAPPLIED MATERIALS INC·Filed 2015·Granted Jun 7, 2016·5 cites·20 claims
- 1581US6177350B1Method for forming a multilayered aluminum-comprising structure on a substrateAPPLIED MATERIALS INC·Filed 1998·Granted Jan 23, 2001·63 cites·26 claims
- 1680US12374586B2Methods of TSV formation for advanced packagingAPPLIED MATERIALS INC·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 1780US8871064B2Electromagnet array in a sputter reactorGUNG TZA-JING·Filed 2010·Granted Oct 28, 2014·6 cites·6 claims
- 1878US10002771B1Methods for chemical mechanical polishing (CMP) processing with ozoneAPPLIED MATERIALS INC·Filed 2017·Granted Jun 19, 2018·3 cites·20 claims
- 1977US8696875B2Self-ionized and inductively-coupled plasma for sputtering and resputteringDING PEIJUN·Filed 2002·Granted Apr 15, 2014·15 cites·61 claims
- 2076US9472392B2Step coverage dielectricAPPLIED MATERIALS INC·Filed 2015·Granted Oct 18, 2016·3 cites·16 claims
- 2175US10515927B2Methods and apparatus for semiconductor package processingAPPLIED MATERIALS INC·Filed 2017·Granted Dec 24, 2019·2 cites·17 claims
- 2273US8642473B2Methods for contact cleanCHANG MEI·Filed 2012·Granted Feb 4, 2014·4 cites·23 claims
- 2373US6607640B2Temperature control of a substrateAPPLIED MATERIALS INC·Filed 2000·Granted Aug 19, 2003·13 cites·5 claims
- 2470US10319601B2Slurry for polishing of integrated circuit packagingAPPLIED MATERIALS INC·Filed 2017·Granted Jun 11, 2019·1 cites·15 claims
- 2570US6454919B1Physical vapor deposition apparatus with deposition and DC target power controlAPPLIED MATERIALS INC·Filed 2000·Granted Sep 24, 2002·16 cites·12 claims
- 2670US6375743B2Method for improved chamber bake-out and cool-downAPPLIED MATERIALS INC·Filed 2000·Granted Apr 23, 2002·12 cites·6 claims
- 2769US11373803B2Method of forming a magnetic core on a substrateAPPLIED MATERIALS INC·Filed 2018·Granted Jun 28, 2022·1 cites·17 claims
- 2869US10276424B2Method and apparatus for wafer level packagingAPPLIED MATERIALS INC·Filed 2017·Granted Apr 30, 2019·1 cites·20 claims
- 2968US10566226B2Multi-cassette carrying caseAPPLIED MATERIALS INC·Filed 2015·Granted Feb 18, 2020·1 cites·16 claims
- 3068US7807568B2Methods for reducing damage to substrate layers in deposition processesAPPLIED MATERIALS INC·Filed 2008·Granted Oct 5, 2010·2 cites·23 claims
- 3167US11791094B2Semiconductor substrate having magnetic core inductorAPPLIED MATERIALS INC·Filed 2021·Granted Oct 17, 2023·0 cites·19 claims
- 3267US11421316B2Methods and apparatus for controlling warpage in wafer level packaging processesAPPLIED MATERIALS INC·Filed 2019·Granted Aug 23, 2022·1 cites·15 claims
- 3366US12495582B2Self-aligned wide backside power rail contacts to multiple transistor sourcesAPPLIED MATERIALS INC·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 3466US10153187B2Methods and apparatus for transferring a substrateAPPLIED MATERIALS INC·Filed 2015·Granted Dec 11, 2018·1 cites·19 claims
- 3565US11309278B2Methods for bonding substratesAPPLIED MATERIALS INC·Filed 2019·Granted Apr 19, 2022·1 cites·18 claims
- 3665US11177146B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2019·Granted Nov 16, 2021·1 cites·16 claims
- 3764US12424446B2Silicon (Si) dry etch for die-to-wafer thinningAPPLIED MATERIALS INC·Filed 2022·Granted Sep 23, 2025·0 cites·18 claims
- 3864US9305838B2BEOL interconnect with carbon nanotubesNARWANKAR PRAVIN K·Filed 2012·Granted Apr 5, 2016·2 cites·15 claims
- 3964US6458251B1Pressure modulation method to obtain improved step coverage of seed layerAPPLIED MATERIALS INC·Filed 1999·Granted Oct 1, 2002·28 cites·52 claims
- 4063US6376807B1Enhanced cooling IMP coil supportAPPLIED MATERIALS INC·Filed 1999·Granted Apr 23, 2002·23 cites·16 claims
- 4162US9954051B2Structure and method of fabricating three-dimensional (3D) metal-insulator-metal (MIM) capacitor and resistor in semi-additive plating metal wiringSEE GUAN HUEI·Filed 2016·Granted Apr 24, 2018·1 cites·21 claims
- 4262US6193811B1Method for improved chamber bake-out and cool-downAPPLIED MATERIALS INC·Filed 1999·Granted Feb 27, 2001·23 cites·12 claims
- 4360US11302549B2Substrate vacuum transport and storage apparatusAPPLIED MATERIALS INC·Filed 2019·Granted Apr 12, 2022·0 cites·19 claims
- 4459US2019181019A1Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 4557US9993853B2Method and apparatus for backside cleaning of substratesAPPLIED MATERIALS INC·Filed 2014·Granted Jun 12, 2018·0 cites·17 claims
- 4657US8912096B2Methods for precleaning a substrate prior to metal silicide fabrication processZHENG BO·Filed 2011·Granted Dec 16, 2014·1 cites·20 claims
- 4757US2009233438A1Self-ionized and inductively-coupled plasma for sputtering and resputteringAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4856US12138742B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 4956US2024387458A1Three-Dimensional Vertical Interconnect Architecture and Methods For FormingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 5056US2024379411A1Embedding redistribution layer metal traces in a polymeric dielectricAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 83 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →