Inventor · disambiguated record
Canfeng Lai
Also filed as: LAI CANFENG
35 granted patents·14 pending applications·2,570 citations·filing 1997–2024
98Inventor score
Top patents by PatentIndex Score
49 records- 0199US6863019B2Semiconductor device fabrication chamber cleaning method and apparatus with recirculation of cleaning gasAPPLIED MATERIALS INC·Filed 2002·Granted Mar 8, 2005·608 cites·6 claims
- 0298US6869880B2In situ application of etch back for improved deposition into high-aspect-ratio featuresAPPLIED MATERIALS INC·Filed 2002·Granted Mar 22, 2005·241 cites·13 claims
- 0398US6447651B1High-permeability magnetic shield for improved process uniformity in nonmagnetized plasma process chambersAPPLIED MATERIALS INC·Filed 2001·Granted Sep 10, 2002·501 cites·24 claims
- 0498US6418874B1Toroidal plasma source for plasma processingAPPLIED MATERIALS INC·Filed 2000·Granted Jul 16, 2002·272 cites·19 claims
- 0597US6755150B2Multi-core transformer plasma sourceAPPLIED MATERIALS INC·Filed 2001·Granted Jun 29, 2004·79 cites·10 claims
- 0697US6450117B1Directing a flow of gas in a substrate processing chamberAPPLIED MATERIALS INC·Filed 2000·Granted Sep 17, 2002·572 cites·61 claims
- 0793US10699878B2Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ringLAM RES CORP·Filed 2017·Granted Jun 30, 2020·12 cites·27 claims
- 0893US7363876B2Multi-core transformer plasma sourceAPPLIED MATERIALS INC·Filed 2004·Granted Apr 29, 2008·37 cites·8 claims
- 0990US12020965B2Magnetic holding structures for plasma processing applicationsAPPLIED MATERIALS INC·Filed 2020·Granted Jun 25, 2024·2 cites·10 claims
- 1090US6841006B2Atmospheric substrate processing apparatus for depositing multiple layers on a substrateAPPLIED MATERIALS INC·Filed 2001·Granted Jan 11, 2005·46 cites·11 claims
- 1188US6364958B1Plasma assisted semiconductor substrate processing chamber having a plurality of ground path bridgesAPPLIED MATERIALS INC·Filed 2000·Granted Apr 2, 2002·43 cites·18 claims
- 1287US11699571B2Semiconductor processing chambers for deposition and etchAPPLIED MATERIALS INC·Filed 2020·Granted Jul 11, 2023·2 cites·17 claims
- 1387US10529541B2Inductive plasma source with metallic shower head using B-field concentratorAPPLIED MATERIALS INC·Filed 2017·Granted Jan 7, 2020·3 cites·19 claims
- 1486US11581408B2Method and apparatus for selective nitridation processAPPLIED MATERIALS INC·Filed 2021·Granted Feb 14, 2023·1 cites·17 claims
- 1584US7789993B2Internal balanced coil for inductively coupled high density plasma processing chamberAPPLIED MATERIALS INC·Filed 2007·Granted Sep 7, 2010·8 cites·6 claims
- 1684US7572647B2Internal balanced coil for inductively coupled high density plasma processing chamberAPPLIED MATERIALS INC·Filed 2007·Granted Aug 11, 2009·10 cites·7 claims
- 1782US12142459B2Single chamber flowable film formation and treatmentsAPPLIED MATERIALS INC·Filed 2020·Granted Nov 12, 2024·1 cites·18 claims
- 1882US7651587B2Two-piece dome with separate RF coils for inductively coupled plasma reactorsAPPLIED MATERIALS INC·Filed 2005·Granted Jan 26, 2010·8 cites·15 claims
- 1981US6712020B2Toroidal plasma source for plasma processingAPPLIED MATERIALS INC·Filed 2002·Granted Mar 30, 2004·15 cites·9 claims
- 2080US6894474B2Non-intrusive plasma probeAPPLIED MATERIALS INC·Filed 2002·Granted May 17, 2005·38 cites·42 claims
- 2177US7571698B2Low-frequency bias power in HDP-CVD processesAPPLIED MATERIALS INC·Filed 2005·Granted Aug 11, 2009·4 cites·14 claims
- 2276US6682603B2Substrate support with extended radio frequency electrode upper surfaceAPPLIED MATERIALS INC·Filed 2002·Granted Jan 27, 2004·21 cites·17 claims
- 2375US7659184B2Plasma immersion ion implantation process with chamber seasoning and seasoning layer plasma discharging for wafer dechuckingAPPLIED MATERIALS INC·Filed 2008·Granted Feb 9, 2010·3 cites·13 claims
- 2474US11450509B2Inductive plasma source with metallic shower head using b-field concentratorAPPLIED MATERIALS INC·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 2573US9048190B2Methods and apparatus for processing substrates using an ion shieldAPPLIED MATERIALS INC·Filed 2013·Granted Jun 2, 2015·2 cites·14 claims
- 2673US2024297059A1Magnetic holding structures for plasma processing applicationsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2772US12456602B2Semiconductor processing chambers and methods for deposition and etchAPPLIED MATERIALS INC·Filed 2023·Granted Oct 28, 2025·0 cites·18 claims
- 2872US7399707B2In situ application of etch back for improved deposition into high-aspect-ratio featuresAPPLIED MATERIALS INC·Filed 2005·Granted Jul 15, 2008·3 cites·7 claims
- 2969US8317970B2Ceiling electrode with process gas dispersers housing plural inductive RF power applicators extending into the plasmaLAI CANFENG·Filed 2008·Granted Nov 27, 2012·3 cites·9 claims
- 3067US8003500B2Plasma immersion ion implantation process with chamber seasoning and seasoning layer plasma discharging for wafer dechuckingAPPLIED MATERIALS INC·Filed 2009·Granted Aug 23, 2011·1 cites·7 claims
- 3164US7588036B2Chamber clean method using remote and in situ plasma cleaning systemsAPPLIED MATERIALS INC·Filed 2002·Granted Sep 15, 2009·7 cites·22 claims
- 3263US12460298B2Showerhead design to control stray depositionAPPLIED MATERIALS INC·Filed 2021·Granted Nov 4, 2025·0 cites·18 claims
- 3360US10950698B2Method and apparatus for selective nitridation processAPPLIED MATERIALS INC·Filed 2018·Granted Mar 16, 2021·0 cites·20 claims
- 3460US2009263594A1Low-frequency bias power in hdp-cvd processesAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 3558US5835335AUnbalanced bipolar electrostatic chuck power supplies and methods thereofLAM RES CORP·Filed 1997·Granted Nov 10, 1998·26 cites·20 claims
- 3654US11984302B2Magnetic-material shield around plasma chambers near pedestalAPPLIED MATERIALS INC·Filed 2020·Granted May 14, 2024·0 cites·16 claims
- 3754US2023377855A1Lower deposition chamber ccp electrode cleaning solutionAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3853US2008188090A1Internal balanced coil for inductively coupled high density plasma processing chamberAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 3949US2013017315A1Methods and apparatus for controlling power distribution in substrate processing systemsAPPLIED MATERIALS INC·Filed 2011·Application pending·0 cites
- 4048US2013014894A1Methods and apparatus for controlling power distribution in substrate processing systemsAPPLIED MATERIALS INC·Filed 2011·Application pending·0 cites
- 4146US2015332941A1Methods and apparatus for processing substrates using an ion shieldAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 4245US2011278260A1Inductive plasma source with metallic shower head using b-field concentratorLAI CANFENG·Filed 2010·Application pending·0 cites
- 4344US2006075967A1Magnetic-field concentration in inductively coupled plasma reactorsAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 4444US2006177600A1Inductive plasma system with sidewall magnetAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 4543US2005098115A1Atmospheric substrate processing apparatus for depositing multiple layers on a substrateAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 4643US2016013020A1Systems and methods for producing energetic neutralsLAM RES CORP·Filed 2015·Application pending·0 cites
- 4738US2017330764A1Methods and apparatuses for controlling transitions between continuous wave and pulsing plasmasLAM RES CORP·Filed 2017·Application pending·0 cites
- 4837US2012222618A1Dual plasma source, lamp heated plasma chamberOLSEN CHRISTOPHER·Filed 2011·Application pending·0 cites
- 4935USD946534SRadio frequency conduitAPPLIED MATERIALS INC·Filed 2019·Granted Mar 22, 2022·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →